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PZUxBL series
Single Zener diodes
Rev. 01 — 6 May 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I
Non-repetitive peak reverse power
dissipation: P
ZSM
≤
40 W
I
Total power dissipation: P
tot
≤
250 mW
I
Tolerance series:
B: approximately
±5
%;
B2: approximately
±2
%
I
Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
I
Low reverse current I
R
range
I
Small plastic package suitable for
surface-mounted design
I
AEC-Q101 qualified
1.3 Applications
I
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
V
F
P
ZSM
P
tot
[1]
[2]
[3]
[4]
Quick reference data
Parameter
forward voltage
non-repetitive peak reverse
power dissipation
total power dissipation
T
amb
≤
25
°C
Conditions
I
F
= 100 mA
[1]
[2]
Min
-
-
-
Typ
-
-
-
Max
1.1
40
250
Unit
V
W
mW
[3][4]
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
NXP Semiconductors
PZUxBL series
Single Zener diodes
2. Pinning information
Table 2.
Pin
1
2
Pinning
Description
cathode
anode
[1]
Simplified outline
Graphic symbol
1
2
1
2
006aaa152
Transparent
top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Package
Name
PZU2.4BL to
PZU36BL
[1]
PZU2.7B2L to
PZU24B2L
[2]
[1]
[2]
The series consists of 29 types with nominal working voltages from 2.4 V to 36 V.
The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
Type number
Description
leadless ultra small plastic package; 2 terminals;
body 1.0
×
0.6
×
0.5 mm
Version
SOD882
-
4. Marking
Table 4.
PZU2.4BL
PZU2.7BL
PZU3.0BL
PZU3.3BL
PZU3.6BL
PZU3.9BL
PZU4.3BL
PZU4.7BL
PZU5.1BL
PZU5.6BL
PZU6.2BL
PZU6.8BL
PZU7.5BL
PZU8.2BL
PZU9.1BL
PZU10BL
PZU11BL
PZUXBL_SER_1
Marking codes
Marking code
H2
H3
H4
H5
H6
H7
H8
H9
HA
HB
HC
HD
HE
HF
HG
HH
HK
Rev. 01 — 6 May 2008
Type number
Type number
PZU2.7B2L
PZU3.0B2L
PZU3.3B2L
PZU3.6B2L
PZU3.9B2L
PZU4.3B2L
PZU4.7B2L
PZU5.1B2L
PZU5.6B2L
PZU6.2B2L
PZU6.8B2L
PZU7.5B2L
PZU8.2B2L
PZU9.1B2L
PZU10B2L
PZU11B2L
PZU12B2L
Marking code
HZ
K1
K2
K3
K4
K5
K6
K7
K8
H1
K9
KA
KB
KC
KD
KE
KF
© NXP B.V. 2008. All rights reserved.
Product data sheet
2 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
Marking codes
…continued
Marking code
HL
HM
HN
HP
HR
HS
HT
HU
HV
HW
HX
HY
Type number
PZU13B2L
PZU14B2L
PZU15B2L
PZU16B2L
PZU18B2L
PZU20B2L
PZU22B2L
PZU24B2L
-
-
-
-
Marking code
KG
KH
KK
KL
KM
KN
KP
KR
-
-
-
-
Table 4.
PZU12BL
PZU13BL
PZU15BL
PZU16BL
PZU18BL
PZU20BL
PZU22BL
PZU24BL
PZU27BL
PZU30BL
PZU33BL
PZU36BL
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
I
F
I
ZSM
Parameter
forward current
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[1]
Conditions
Min
-
-
Max
200
see
Table 8
and
9
40
250
500
150
+150
+150
Unit
mA
P
ZSM
P
tot
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
[1]
-
-
-
-
−55
−65
W
mW
mW
°C
°C
°C
T
amb
≤
25
°C
[2][3]
[2][4]
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
3 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
6. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
R
th(j-sp)
[1]
[2]
[3]
[4]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Conditions
in free air
[1][2]
[1][3]
[4]
Min
-
-
-
Typ
-
-
-
Max
500
250
55
Unit
K/W
K/W
K/W
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
V
F
Parameter
forward voltage
I
F
= 10 mA
I
F
= 100 mA
[1]
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
Conditions
[1]
Min
-
-
Typ
-
-
Max
0.9
1.1
Unit
V
V
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L
T
j
= 25
°
C unless otherwise specified.
PZUxxx Sel
Working
voltage
V
Z
(V)
I
Z
= 5 mA
Min
2.4
2.7
3.0
3.3
3.6
3.9
4.3
B
B
B2
B
B2
B
B2
B
B2
B
B2
B
B2
PZUXBL_SER_1
Differential resistance Reverse
current
r (Ω)
dif
Temperature
coefficient
S
Z
(mV/K)
I
Z
= 5 mA
I
R
(µA)
I
Z
= 0.5 mA I
Z
= 5 mA
Max
1000
1000
1000
1000
1000
1000
1000
Max
100
100
95
95
90
90
90
Max
50
20
10
5
5
3
3
V
R
(V)
1
1
1
1
1
1
1
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)
[1]
d
I
ZSM
(A)
[2]
Max
2.6
2.9
2.9
3.20
3.20
3.50
3.50
3.80
3.80
4.10
4.10
4.48
4.34
© NXP B.V. 2008. All rights reserved.
Typ
−1.6
−2.0
−2.1
−2.4
−2.4
−2.5
−2.5
Max
450
440
425
410
390
370
350
Max
8
8
8
8
8
8
8
2.3
2.5
2.65
2.80
2.95
3.10
3.25
3.40
3.55
3.70
3.87
4.01
4.15
Product data sheet
Rev. 01 — 6 May 2008
4 of 13
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