Datasheet> 器件分类 > 存储> MX25L25655FXDI-10G

文档预览

MX25L25655FXDI-10G: 产品描述IC FLASH 256M SPI 24CSPBGA; 产品类别存储; 文件大小4MB，共107页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

下载文档详细参数选型对比全文预览

MX25L25655FXDI-10G概述

IC FLASH 256M SPI 24CSPBGA

MX25L25655FXDI-10G规格参数

参数名称	属性值
存储器类型	非易失
存储器格式	闪存
技术	FLASH - NOR
存储容量	256Mb （32M x 8）
时钟频率	104MHz
写周期时间 - 字，页	30µs，3ms
存储器接口	SPI
电压 - 电源	2.7 V ~ 3.6 V
工作温度	-40°C ~ 85°C（TA）
安装类型	表面贴装
封装/外壳	24-TBGA，CSPBGA
供应商器件封装	24-CSPBGA（6x8）

文档预览

下载PDF文档

全文
预览

MX25L25655F

DATASHEET

P/N: PM1875

MX25L25655F

Contents

1. FEATURES .............................................................................................................................................................. 4

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Read performance Comparison ....................................................................................................6

3. PIN CONFIGURATIONS ......................................................................................................................................... 7

4. PIN DESCRIPTION .................................................................................................................................................. 7

5. BLOCK DIAGRAM................................................................................................................................................... 8

6. DATA PROTECTION................................................................................................................................................ 9

Table 2. Protected Area Sizes ...................................................................................................................10

Table 3. 4K-bit Secured OTP Definition

.................................................................................................... 11

7. Memory Organization ........................................................................................................................................... 12

Table 4. Memory Organization ..................................................................................................................12

8. DEVICE OPERATION ............................................................................................................................................ 13

8-1. 256Mb Address Protocol .......................................................................................................................... 15

8-2. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 16

9. COMMAND DESCRIPTION ................................................................................................................................... 17

9-1.

9-2.

9-3.

9-4.

9-5.

9-6.

9-7.

9-8.

9-9.

9-10.

9-11.

9-12.

9-13.

9-14.

9-15.

9-16.

9-17.

9-18.

9-19.

9-20.

9-21.

9-23.

9-22.

9-24.

P/N: PM1875

Table 5. Command Set..............................................................................................................................17

Write Enable (WREN) .............................................................................................................................. 22

Write Disable (WRDI)............................................................................................................................... 23

Read Identification (RDID)

....................................................................................................................... 25

Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 26

Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 28

QPI ID Read (QPIID) ............................................................................................................................... 29

Table 6. ID Definitions

..............................................................................................................................29

Read Status Register (RDSR) ................................................................................................................. 30

Read Configuration Register (RDCR)

...................................................................................................... 31

Write Status Register (WRSR)................................................................................................................. 37

Table 7. Protection Modes.........................................................................................................................38

Enter 4-byte mode (EN4B) ...................................................................................................................... 41

Exit 4-byte mode (EX4B) ......................................................................................................................... 41

Read Data Bytes (READ) ........................................................................................................................ 42

Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 43

Dual Output Read Mode (DREAD) .......................................................................................................... 45

2 x I/O Read Mode (2READ) ................................................................................................................... 46

Quad Read Mode (QREAD) .................................................................................................................... 47

4 x I/O Read Mode (4READ) ................................................................................................................... 48

4 Byte Address Command Set ................................................................................................................. 50

Burst Read ............................................................................................................................................... 52

Performance Enhance Mode ................................................................................................................... 53

Performance Enhance Mode Reset (FFh) ............................................................................................... 56

Fast Boot ................................................................................................................................................. 58

Sector Erase (SE) .................................................................................................................................... 61

Block Erase (BE32K) ............................................................................................................................... 62

REV. 1.0, OCT. 19, 2012

MX25L25655F

Block Erase (BE) ..................................................................................................................................... 63

Chip Erase (CE) ....................................................................................................................................... 64

Page Program (PP) ................................................................................................................................. 65

4 x I/O Page Program (4PP) .................................................................................................................... 67

Deep Power-down (DP) ........................................................................................................................... 68

Enter Secured OTP (ENSO) .................................................................................................................... 69

Exit Secured OTP (EXSO) ....................................................................................................................... 69

Read Security Register (RDSCUR) ......................................................................................................... 69

Write Security Register (WRSCUR)......................................................................................................... 69

Table 8. Security Register Definition

.........................................................................................................70

9-34. Write Protection Selection (WPSEL)........................................................................................................ 71

9-35. Advanced Sector Protection .................................................................................................................... 73

9-36. Program/Erase Suspend/Resume ........................................................................................................... 81

9-37. Erase Suspend ........................................................................................................................................ 81

9-38. Program Suspend .................................................................................................................................... 81

9-39. Write-Resume .......................................................................................................................................... 83

9-40. No Operation (NOP) ................................................................................................................................ 83

9-41. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 83

9-42. Read SFDP Mode (RDSFDP).................................................................................................................. 85

Table 9. Signature and Parameter Identification Data Values

..................................................................86

Table 10. Parameter Table (0): JEDEC Flash Parameter Tables ..............................................................87

Table 11. Parameter Table (1): Macronix Flash Parameter Tables............................................................89

10. RESET.................................................................................................................................................................. 91

Table 12. Reset Timing..............................................................................................................................91

11. POWER-ON STATE ............................................................................................................................................. 92

12. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 93

Table 13. ABSOLUTE MAXIMUM RATINGS ............................................................................................93

Table 14. CAPACITANCE TA = 25°C, f = 1.0 MHz ....................................................................................93

Table 15. DC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V ~ 3.6V)

.......................95

Table 16. AC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V ~ 3.6V)

......................96

13. OPERATING CONDITIONS ................................................................................................................................. 97

Table 17. Power-Up Timing and VWI Threshold

.......................................................................................99

13-1. INITIAL DELIVERY STATE

...................................................................................................................... 99

14. ERASE AND PROGRAMMING PERFORMANCE ............................................................................................ 100

15. DATA RETENTION ............................................................................................................................................ 100

16. LATCH-UP CHARACTERISTICS ...................................................................................................................... 100

17. ORDERING INFORMATION .............................................................................................................................. 101

18. PART NAME DESCRIPTION ............................................................................................................................. 102

19. PACKAGE INFORMATION ................................................................................................................................ 103

20. REVISION HISTORY ......................................................................................................................................... 106

9-25.

9-26.

9-27.

9-28.

9-29.

9-30.

9-31.

9-32.

9-33.

P/N: PM1875

REV. 1.0, OCT. 19, 2012

MX25L25655FXDI-10G相似产品对比

	MX25L25655FXDI-10G	MX25L25655FMI-10G	MX25L25655FXCI-10G
描述	IC FLASH 256M SPI 24CSPBGA	IC flash 256mbit 104mhz 16sop	IC FLASH 256M SPI 24CSPBGA
存储器类型	非易失	-	非易失
存储器格式	闪存	-	闪存
技术	FLASH - NOR	-	FLASH - NOR
存储容量	256Mb （32M x 8）	-	256Mb （32M x 8）
时钟频率	104MHz	-	104MHz
写周期时间 - 字，页	30µs，3ms	-	30µs，3ms
存储器接口	SPI	-	SPI
电压 - 电源	2.7 V ~ 3.6 V	-	2.7 V ~ 3.6 V
工作温度	-40°C ~ 85°C（TA）	-	-40°C ~ 85°C（TA）
安装类型	表面贴装	-	表面贴装
封装/外壳	24-TBGA，CSPBGA	-	24-TBGA，CSPBGA
供应商器件封装	24-CSPBGA（6x8）	-	24-CSPBGA（6x8）

MX25L25655FXDI-10G

MX25L25655FXDI-10G概述

MX25L25655FXDI-10G规格参数

文档预览

MX25L25655FXDI-10G相似产品对比

推荐资源