Floating Point Processor, 32-Bit, CMOS, CQFP164, CERAMIC, QFP-164
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | QFP |
包装说明 | QFF, QFL164,1.2SQ,25 |
针数 | 164 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
Is Samacsys | N |
其他特性 | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION |
边界扫描 | NO |
最大时钟频率 | 20 MHz |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-CQFP-F164 |
JESD-609代码 | e0 |
长度 | 29.2735 mm |
低功率模式 | NO |
端子数量 | 164 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出数据总线宽度 | 32 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF |
封装等效代码 | QFL164,1.2SQ,25 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.8702 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 0.635 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 29.2735 mm |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, FLOATING POINT PROCESSOR |
Base Number Matches | 1 |
AM29027-20/BYC | AM29027-25GC | AM29027-25GCB | AM29027-16GCB | AM29027-16/BYC | AM29027-16/BZC | AM29027-16GC | AM29027-20/BZC | AM29027-20GC | AM29027-20GCB | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Floating Point Processor, 32-Bit, CMOS, CQFP164, CERAMIC, QFP-164 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CQFP164, CERAMIC, QFP-164 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 | Floating Point Processor, 32-Bit, CMOS, CPGA169, PGA-169 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | QFP | PGA | PGA | PGA | QFP | PGA | PGA | PGA | PGA | PGA |
包装说明 | QFF, QFL164,1.2SQ,25 | PGA, PGA169,17X17 | PGA, PGA169,17X17 | PGA, PGA169,17X17 | QFF, QFL164,1.2SQ,25 | PGA, PGA169,17X17 | PGA, PGA169,17X17 | PGA, PGA169,17X17 | PGA, PGA169,17X17 | PGA, PGA169,17X17 |
针数 | 164 | 169 | 169 | 169 | 164 | 169 | 169 | 169 | 169 | 169 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION | SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION |
边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 20 MHz | 25 MHz | 25 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 20 MHz | 20 MHz | 20 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
JESD-30 代码 | S-CQFP-F164 | S-CPGA-P169 | S-CPGA-P169 | S-CPGA-P169 | S-CQFP-F164 | S-CPGA-P169 | S-CPGA-P169 | S-CPGA-P169 | S-CPGA-P169 | S-CPGA-P169 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 29.2735 mm | 44.704 mm | 44.704 mm | 44.704 mm | 29.2735 mm | 44.704 mm | 44.704 mm | 44.704 mm | 44.704 mm | 44.704 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
端子数量 | 164 | 169 | 169 | 169 | 164 | 169 | 169 | 169 | 169 | 169 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C |
输出数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF | PGA | PGA | PGA | QFF | PGA | PGA | PGA | PGA | PGA |
封装等效代码 | QFL164,1.2SQ,25 | PGA169,17X17 | PGA169,17X17 | PGA169,17X17 | QFL164,1.2SQ,25 | PGA169,17X17 | PGA169,17X17 | PGA169,17X17 | PGA169,17X17 | PGA169,17X17 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.8702 mm | 4.953 mm | 4.953 mm | 4.953 mm | 2.8702 mm | 4.953 mm | 4.953 mm | 4.953 mm | 4.953 mm | 4.953 mm |
最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | YES | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | OTHER | OTHER | OTHER | MILITARY | MILITARY | OTHER | MILITARY | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | PIN/PEG | PIN/PEG | PIN/PEG | FLAT | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 0.635 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.635 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 29.2735 mm | 44.704 mm | 44.704 mm | 44.704 mm | 29.2735 mm | 44.704 mm | 44.704 mm | 44.704 mm | 44.704 mm | 44.704 mm |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR | DSP PERIPHERAL, FLOATING POINT PROCESSOR |
最大压摆率 | - | 500 mA | 500 mA | 419 mA | - | - | 419 mA | - | 455 mA | 455 mA |
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