XTSC423.xxx - 0201 Extreme Temperature
Silicon Capacitor
Rev 3.1
Key features
Ultra High temperature up to 250°C:
Temperature Coeff : <±1.5%(-55 °C to +250°C)
Voltage <0.1 %/V
Negligible capacitance loss through aging
Unique high capacitance in EIA/0201 package
size, up to 10 nF
High reliability (FIT <0.017 parts / billion hours)
Low leakage current down to 100 pA
Low ESL and Low ESR
Suitable for lead free reflow-soldering
*Please refer to
our assembly Application Note for further recommendations
Key applications
250°C requirements, High temperature
applications, such as military, aerospace,
automotive and downhole industries.
High reliability applications
Replacement of X8R and C0G dielectrics
Decoupling / Filtering / Charge pump
(i.e.: pressure sensor, motor management)
Downsizing
Thanks to the unique IPDiA Silicon capacitor
technology, most of the problems encountered in
demanding applications can be solved.
EXtreme
Temperature Silicon Capacitors
are
appropriate for applications used in extreme
operating temperature range (up to
250°C).
XTSC industry leading performances allow to
propose a
10nF in 0201
with a
TC<±1.5%
over
the full -55°C/+250°C temperature range.
This technology also offers a
negligible ageing
and a stable insulation resistance, even at very
high temperature, as well as a stable capacitor
value over the full operating.
The
IPDiA
technology
features
a
capacitor
²
integration capability (up to 250nF/mm ) which
allows a capacitance value similar to X8R
dielectric, but with better electrical performances
than C0G/NP0 dielectrics.
This technology also offers
high reliability,
up to
10
times
better
than
alternative
capacitor
technologies, such as Tantalum or MLCC, and
eliminates cracking phenomena.
This Silicon based technology is RoHS compliant
and compatible with lead free reflow soldering
process.
XTSC423.xxx
Electrical specification
Capacitance value
10
Contact
1 pF
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10 pF
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0.1 nF
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10nF:
935.133.423.510
1 nF
935.133.723.510
15
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22
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33
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47
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68
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(*) Thinner thickness (as low as 100 µm thick) available, see Low Profile Silicon Capacitor product: LPSC
(**) Other values on request.
Parameters
Capacitance range
Capacitance tolerances
Operating temperature range
Storage temperatures
Temperature coefficient
Breakdown voltage (BV)
Capacitance variation versus
RVDC
Equivalent Serial Inductor (ESL)
Equivalent Serial Resistor (ESR)
Insulation resistance
Ageing
Reliability
Capacitor height
Value
10 nF
(**)
±15
%
-55 °C to 250 °C
- 70 °C to 265 °C
<±1.5 %, from -55 °C to +250 °C
11 VDC, 30VDC
0.1 % /V (from 0 V to RVDC)
Max 100 pH
Max 400m
(**)
50G
min @ 3V,25°C
10G
min @ 3V,250°C
Negligible, < 0.001 % / 1000 h
FIT<0.017 parts / billion hours,
Max 400 µm
(*)
(**)
Unit
DC Voltage stability
MLCC capacitors vs. PICS
10
PICS
0
-10
Capacitance change (%)
ESL (nH) @25°C
0402 C0G(NPO) vs. PICS
1,1
1
C0G
0,9
0,8
0,7
C0G
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
1
2
3
Bias voltage (V)
4
5
6
7
Y5V
X7R
ESL(nH)
0,6
0,5
0,4
0,3
0,2
PICS
0,1
0
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950 1000
Capacitance (pF)
Fig.1 Capacitance change versus temperature
variation compared with alternative dielectrics
Fig.2 Capacitance change versus voltage
variation compared with alternative dielectrics
Fig.3 ESL versus capacitance value
compared with alternative dielectrics
Part Number
935.133.
B.2
Breakdown
Voltage
4 = 11V
7 = 30V
S.
Size
3 = 0201
U
Unit
0 = 10 f
1 = 0.1 p
2=1p
3 = 10 p
4 = 0.1 n
xx
i.e.: 10 nF/0201 case (XTSC type)
935.133.423.510
5=1n
6 = 10 n
7 = 0.1 µ
8=1µ
9 = 10 µ
Value (E6)
10
15
22
33
47
68
Termination and Outline
Termination
Lead-free nickel/solder coating compatible
with automatic soldering technologies:
reflow and manual.
Typical dimensions, all dimensions in mm.
Package outline
L
Typ.
Comp.
size
L
W
0201
W
0.8±0.03
0.60±0.03
Land
pattern
IPD
component
Solder
Resist
(0201 PCB footprint)
Packaging
Tape and reel, tray, waffle pack or wafer delivery
Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner. The information
presented in this document does not form part of any
quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be
accepted by the publisher for any consequence of its use.
Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
For more information, please visit:
http://www.ipdia.com
To contact us, email to:
sales@ipdia.com
Date of release: 28
th
February 2014
Document identifier: CL431 111 615 123
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