Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | TSSOP |
包装说明 | HTSSOP, TSSOP24,.25 |
针数 | 24 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
商用集成电路类型 | VOLUME CONTROL CIRCUIT |
谐波失真 | 1% |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 7.8 mm |
湿度敏感等级 | 2 |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 2 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTSSOP |
封装等效代码 | TSSOP24,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大压摆率 | 8 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
Base Number Matches | 1 |
TPA0212PWPRG4 | TPA0212PWP | TPA0212PWPG4 | TPA0212PWPR | |
---|---|---|---|---|
描述 | Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85 | Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85 | Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85 | Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
包装说明 | HTSSOP, TSSOP24,.25 | HTSSOP, TSSOP24,.25 | HTSSOP, TSSOP24,.25 | HTSSOP, TSSOP24,.25 |
针数 | 24 | 24 | 24 | 24 |
Reach Compliance Code | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
商用集成电路类型 | VOLUME CONTROL CIRCUIT | VOLUME CONTROL CIRCUIT | AUDIO AMPLIFIER | VOLUME CONTROL CIRCUIT |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 7.8 mm | 7.8 mm | 7.8 mm | 7.8 mm |
湿度敏感等级 | 2 | 2 | 2 | 2 |
信道数量 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
标称输出功率 | 2 W | 2 W | 2.6 W | 2 W |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
封装等效代码 | TSSOP24,.25 | TSSOP24,.25 | TSSOP24,.25 | TSSOP24,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大压摆率 | 8 mA | 8 mA | 8 mA | 8 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
是否无铅 | 不含铅 | 不含铅 | - | 不含铅 |
谐波失真 | 1% | 1% | - | 1% |
Factory Lead Time | - | 1 week | 1 week | 1 week |
器件名 | 厂商 | 描述 |
---|---|---|
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