Eccosorb® LS
Lossy, Flexible, Foam Microwave Absorber
LOSSY, FLEXIBLE FOAM ABSORBER
Eccosorb LS is the most widely known, used, and recommended polyurethane foam
absorber. Eccosorb LS obtains its microwave properties via impregnation with a carbon black
dispersion and is therefore electrically conductive. It is a very low cost solution for many
applications over the thinner, more expensive rubber absorbers.
FEATURES AND BENEFITS
•
Flexible, foam material
•
High loss, low density
•
Very low cost
MARKETS
•
Commercial Telecom
•
Test Boxes
•
Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
Max. Service Temperature °C (°F)
Frequency Range
ECCOSORB LS
90 (194)
≥ 1 GHz
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
Attenuation
(dB/cm)
3 GHz
LS-14
LS-16
LS-18
LS-20
LS-22
LS-24
LS-26
LS-28
LS-30
1.0
1.5
3.2
4.2
7.4
11
16
20
24
10 GHz
1.7
2.3
4.7
7.0
14.9
24
34
40
46
Relative Impedance
(|Z|/Z
0
)
3 GHz
0.83
0.78
0.69
0.61
0.55
0.25
0.18
0.16
0.13
10 GHz
0.89
0.87
0.82
0.78
0.74
0.44
0.31
0.27
0.22
APPLICATIONS
•
Eccosorb LS is used to lower cavity Q’s in RF amplifiers, oscillators, cabinets containing
microwave devices, computer housings, LNB’s and isolation of antennas by insertion loss.
•
Eccosorb LS is also used to reduce surface currents on radiating elements and outer
ground-plane type surfaces.
•
Reflectivity of an object (metal or otherwise) can be reduced somewhat by applying one
or more layers of Eccosorb LS to its surface.
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Eccosorb®LS
AVAILABILITY
•
Standard sheets are 610mm x 610mm (24”x24”).
•
Standard thicknesses are 3.2 mm (1/8”), 6.4 mm (1/4”), 9.5 mm (3/8”), 12.7 mm (1/2”),
19.1 mm (3/4”).
•
All Eccosorb LS types can be delivered in special sizes or customer specified configurations
upon request. This includes die-cut and kiss cut parts to reduce installation labor by
allowing quick assembly.
•
Usually Eccosorb LS is supplied with a pressure sensitive adhesive.
•
Upon special request, Eccosorb LS can be supplied with an anti-dust coating to prevent
carbon fallout.
•
It can also be supplied, upon request, with a coating to prevent moisture uptake in high
humidity to moderately wet environments.
INSTRUCTIONS FOR USE
•
For optimal performance, Eccosorb LS should be bonded to a metallic surface.
•
To obtain a strong bond, the surface should be thoroughly cleaned with a degreasing
solvent.
•
It can be securely bonded to itself or to other materials such as metal, wood and common
plastic composites. Our specific Eccostock® foam adhesive is recommended or the self-
adhesive version can be used.
•
The material can be easily cut with a sharp knife, scissors or die.
Approximate Insertion Loss at 3 GHz and 45°
60
dB Insertion Loss
50
40
30
20
10
0
3.2
6.4
9.5
12.7
19.1
LS-30
LS-28
LS-26
LS-24
LS-22
LS-20
LS-18
LS-16
LS-14
Thickness (mm)
RFP-DS-LS 070116
A
ny information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the
end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be
the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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