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FGD3N60LSDTM-T

产品描述INTEGRATED CIRCUIT
产品类别分立半导体    晶体管   
文件大小860KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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FGD3N60LSDTM-T概述

INTEGRATED CIRCUIT

FGD3N60LSDTM-T规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
包装说明,
制造商包装代码369AS
Reach Compliance Codeunknown
Factory Lead Time1 week

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FGD3N60LSD IGBT
FGD3N60LSD
IGBT
Features
• High Current Capability
• Very Low Saturation Voltage : V
CE(sat)
= 1.2 V @ I
C
= 3A
• High Input Impedance
Description
ON Semiconductor's
Insulated Gate Bipolar Transistors
(IGBTs)
provide very low conduction losses. The device is
designed for applica-tions where very low On-Voltage Drop is
a required feature.
Applications
• HID Lamp Applications
• Piezo Fuel Injection Applications
C
C
G
G
E
D-PAK
E
Absolute Maximum Ratings
Symbol
V
CES
V
GES
I
C
I
CM (1)
I
F
I
FM
P
D
T
J
T
stg
T
L
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current
Collector Current
Pulsed Collector Current
Diode Continous Forward Current
Diode Maximum Forward Current
Maximum Power Dissipation
Derating Factor
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from Case for 5 Seconds
@ T
C
= 25°C
@ T
C
= 100°C
@ T
C
= 25°C
@ T
C
= 100°C
(1)
FGD3N60LSD
600
±
25
6
3
25
3
25
40
0.32
-55 to +150
-55 to +150
250
Units
V
V
A
A
A
A
A
W
W/°C
°C
°C
°C
Thermal Characteristics
Symbol
R
θJC
(IGBT)
R
θJA
Notes :
(2) Mounted on 1” squre PCB (FR4 or G-10 Material)
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient (PCB Mount)
(2)
Typ.
--
--
Max.
3.1
100
Units
°C/W
°C/W
©2006
Semiconductor Components Industries, LLC.
October-2017,Rev. 2
Publication Order Number:
FGD3N60LSD/D

 
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