Datasheet> 器件分类 > 存储> MT28EW512ABA1LPC-0SIT TR

文档预览

MT28EW512ABA1LPC-0SIT TR: 产品描述IC FLASH 512M PARALLEL 64LBGA; 产品类别存储; 文件大小991KB，共81页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

下载文档详细参数全文预览

MT28EW512ABA1LPC-0SIT TR概述

IC FLASH 512M PARALLEL 64LBGA

MT28EW512ABA1LPC-0SIT TR规格参数

参数名称	属性值
存储器类型	非易失
存储器格式	闪存
技术	FLASH - NOR
存储容量	512Mb （64M x 8，32M x 16）
写周期时间 - 字，页	60ns
访问时间	95ns
存储器接口	并联
电压 - 电源	2.7 V ~ 3.6 V
工作温度	-40°C ~ 85°C（TA）
安装类型	表面贴装
封装/外壳	64-LBGA
供应商器件封装	64-LBGA（11x13）

文档预览

下载PDF文档

全文
预览

512Mb: x8/x16, 3V, MT28EW Embedded Parallel NOR

Features

Parallel NOR Flash Embedded Memory

MT28EW512ABA

Features

• Single-level cell (SLC) technology

• Density: 512Mb

• Supply voltage

– V

= 2.7–3.6V (program, erase, read)

– V

CCQ

= 1.65 - V

(I/O buffers)

• Asynchronous random/page read

– Page size: 16 words or 32 bytes

– Page access: 20ns

– Random access: 95ns (V

= V

CCQ

= 2.7-3.6V)

– Random access: 100ns (V

CCQ

= 1.65-V

)

• Buffer program (512-word program buffer)

– 2.0 MB/s (TYP) when using full buffer program

– 2.5 MB/s (TYP) when using accelerated buffer

program (V

)

• Word/Byte program: 25us per word (TYP)

• Block erase (128KB): 0.2s (TYP)

• Memory organization

– Uniform blocks: 128KB or 64KW each

– x8/x16 data bus

• Program/erase suspend and resume capability

– Read from another block during a PROGRAM

SUSPEND operation

– Read or program another block during an ERASE

SUSPEND operation

• Unlock bypass, block erase, chip erase, and write to

buffer capability

• BLANK CHECK operation to verify an erased block

• CYCLIC REDUNDANCY CHECK (CRC) operation to

verify a program pattern

• V

/WP# protection

– Protects first or last block regardless of block

protection settings

• Software protection

– Volatile protection

– Nonvolatile protection

– Password protection

• Extended memory block

– 128-word (256-byte) block for permanent, secure

identification

– Programmed or locked at the factory or by the

customer

• JESD47-compliant

– 100,000 (minimum) ERASE cycles per block

– Data retention: 20 years (TYP)

• Package

– 56-pin TSOP 14 x 20mm (JS)

– 64-ball LBGA, 11 x 13mm (PC)

– 56-ball VFBGA, 7 x 9mm (PN)

• RoHS-compliant, halogen-free packaging

• Operating temperature

– Ambient: –40°C to +85°C

PDF: 09005aef855e354a

mt28ew_generation-b_512mb.pdf - Rev. I 05/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x8/x16, 3V, MT28EW Embedded Parallel NOR

Features

Contents

Important Notes and Warnings ......................................................................................................................... 7

General Description ......................................................................................................................................... 8

Signal Assignments ........................................................................................................................................... 9

Signal Descriptions ......................................................................................................................................... 12

Memory Organization .................................................................................................................................... 14

Memory Configuration ............................................................................................................................... 14

Memory Map ............................................................................................................................................. 14

Bus Operations ............................................................................................................................................... 15

Read .......................................................................................................................................................... 15

Write .......................................................................................................................................................... 15

Standby ..................................................................................................................................................... 16

Output Disable ........................................................................................................................................... 16

Reset .......................................................................................................................................................... 16

Registers ........................................................................................................................................................ 17

Data Polling Register .................................................................................................................................. 17

Lock Register .............................................................................................................................................. 22

Standard Command Definitions – Address-Data Cycles .................................................................................... 24

READ and AUTO SELECT Operations .............................................................................................................. 27

READ/RESET Command ............................................................................................................................ 27

READ CFI Command .................................................................................................................................. 27

AUTO SELECT Command ........................................................................................................................... 27

Read Electronic Signature ........................................................................................................................... 28

Cyclic Redundancy Check Operation ............................................................................................................... 29

CYCLIC REDUNDANCY CHECK Command ................................................................................................. 29

Cyclic Redundancy Check Operation Command Sequence .......................................................................... 29

Bypass Operations .......................................................................................................................................... 32

UNLOCK BYPASS Command ...................................................................................................................... 32

UNLOCK BYPASS RESET Command ............................................................................................................ 32

Program Operations ....................................................................................................................................... 33

PROGRAM Command ................................................................................................................................ 33

UNLOCK BYPASS PROGRAM Command ..................................................................................................... 33

WRITE TO BUFFER PROGRAM Command .................................................................................................. 33

UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command ....................................................................... 36

WRITE TO BUFFER PROGRAM CONFIRM Command .................................................................................. 36

BUFFERED PROGRAM ABORT AND RESET Command ................................................................................ 36

PROGRAM SUSPEND Command ................................................................................................................ 36

PROGRAM RESUME Command .................................................................................................................. 37

ACCELERATED BUFFERED PROGRAM Operations .......................................................................................... 37

Erase Operations ............................................................................................................................................ 38

CHIP ERASE Command .............................................................................................................................. 38

UNLOCK BYPASS CHIP ERASE Command ................................................................................................... 38

BLOCK ERASE Command ........................................................................................................................... 38

UNLOCK BYPASS BLOCK ERASE Command ................................................................................................ 39

ERASE SUSPEND Command ....................................................................................................................... 39

ERASE RESUME Command ........................................................................................................................ 40

ACCELERATED CHIP ERASE Operations ......................................................................................................... 40

BLANK CHECK Operation .............................................................................................................................. 41

BLANK CHECK Commands ........................................................................................................................ 41

Device Protection ........................................................................................................................................... 42

Hardware Protection .................................................................................................................................. 42

PDF: 09005aef855e354a

mt28ew_generation-b_512mb.pdf - Rev. I 05/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x8/x16, 3V, MT28EW Embedded Parallel NOR

Features

Software Protection ....................................................................................................................................

Volatile Protection Mode .............................................................................................................................

Nonvolatile Protection Mode ......................................................................................................................

Password Protection Mode ..........................................................................................................................

Block Protection Command Definitions – Address-Data Cycles ........................................................................

Protection Operations ....................................................................................................................................

LOCK REGISTER Commands ......................................................................................................................

PASSWORD PROTECTION Commands .......................................................................................................

NONVOLATILE PROTECTION Commands ..................................................................................................

NONVOLATILE PROTECTION BIT LOCK BIT Commands ............................................................................

VOLATILE PROTECTION Commands ..........................................................................................................

EXTENDED MEMORY BLOCK Commands ..................................................................................................

EXIT PROTECTION Command ....................................................................................................................

Common Flash Interface ................................................................................................................................

Power-Up and Reset Characteristics ................................................................................................................

Absolute Ratings and Operating Conditions .....................................................................................................

DC Characteristics ..........................................................................................................................................

Read AC Characteristics ..................................................................................................................................

Write AC Characteristics .................................................................................................................................

Data Polling/Toggle AC Characteristics ............................................................................................................

Program/Erase Characteristics ........................................................................................................................

Package Dimensions .......................................................................................................................................

Revision History .............................................................................................................................................

Rev. I –05/18 ...............................................................................................................................................

Rev. H – 11/16 .............................................................................................................................................

Rev. G – 4/16 ..............................................................................................................................................

Rev. F – 4/15 ...............................................................................................................................................

Rev. E – 1/15 ...............................................................................................................................................

Rev. D – 11/14 .............................................................................................................................................

Rev. C – 9/14 ...............................................................................................................................................

Rev. B – 3/14 ...............................................................................................................................................

Rev. A – 9/13 ...............................................................................................................................................

PDF: 09005aef855e354a

mt28ew_generation-b_512mb.pdf - Rev. I 05/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x8/x16, 3V, MT28EW Embedded Parallel NOR

Features

List of Figures

Figure 1: Part Number Chart ............................................................................................................................ 2

Figure 2: Logic Diagram ................................................................................................................................... 8

Figure 3: 56-Pin TSOP (Top View) .................................................................................................................... 9

Figure 4: 64-Ball LBGA (Top View – Balls Down) ............................................................................................. 10

Figure 5: 56-Ball VFBGA (Top View – Balls Down) ........................................................................................... 11

Figure 6: Data Polling Flowchart .................................................................................................................... 19

Figure 7: Toggle Bit Flowchart ........................................................................................................................ 20

Figure 8: Data Polling/Toggle Bit Flowchart .................................................................................................... 21

Figure 9: Lock Register Program Flowchart ..................................................................................................... 23

Figure 10: Boundary Condition of Program Buffer Size .................................................................................... 34

Figure 11: WRITE TO BUFFER PROGRAM Flowchart ...................................................................................... 35

Figure 12: Software Protection Scheme .......................................................................................................... 44

Figure 13: Set/Clear Nonvolatile Protection Bit Algorithm Flowchart ............................................................... 50

Figure 14: Power-Up Timing .......................................................................................................................... 57

Figure 15: Reset AC Timing – No PROGRAM/ERASE Operation in Progress ...................................................... 58

Figure 16: Reset AC Timing During PROGRAM/ERASE Operation .................................................................... 58

Figure 17: AC Measurement Load Circuit ....................................................................................................... 60

Figure 18: AC Measurement I/O Waveform ..................................................................................................... 60

Figure 19: Random Read AC Timing (8-Bit Mode) ........................................................................................... 64

Figure 20: Random Read AC Timing (16-Bit Mode) ......................................................................................... 65

Figure 21: BYTE# Transition Read AC Timing .................................................................................................. 65

Figure 22: Page Read AC Timing (16-Bit Mode) ............................................................................................... 66

Figure 23: WE#-Controlled Program AC Timing (8-Bit Mode) .......................................................................... 68

Figure 24: WE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 69

Figure 25: CE#-Controlled Program AC Timing (8-Bit Mode) ........................................................................... 71

Figure 26: CE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 72

Figure 27: Chip/Block Erase AC Timing (16-Bit Mode) .................................................................................... 73

Figure 28: Accelerated Program AC Timing ..................................................................................................... 73

Figure 29: Data Polling AC Timing .................................................................................................................. 74

Figure 30: Toggle/Alternative Toggle Bit Polling AC Timing .............................................................................. 75

Figure 31: 56-Pin TSOP – 14mm x 20mm (Package Code: JS) ............................................................................ 78

Figure 32: 64-Ball LBGA – 11mm x 13mm (Package Code: PC) ......................................................................... 79

Figure 33: 56-Ball VFBGA – 7mm x 9mm (Package Code: PN) .......................................................................... 80

PDF: 09005aef855e354a

mt28ew_generation-b_512mb.pdf - Rev. I 05/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

推荐资源

基于FPGA的IIC接口驱动设计: 基于FPGA的IIC接口驱动设计 ...; 雷北城 FPGA/CPLD

stm32f105/107usbOTG能接现在普通的U盘和PC吗？: ...; szkyd stm32/stm8

一文探索究竟，电路中的自举电路到底有什么作用？: 自举电路也叫升压电路，是利用自举升压二极管，自举升压电容等电子元件，使电容放电电压和电源电压叠加，从而使电压升高，有的电路升高的电压能达到数倍电源电压。 1、mos管自举电路原理在 ......; buildele 电源技术

西勒振荡电路的静态工作点怎么确定啊: 实在是丢人，学过的都还给老师了。。。求助大神 ...; zhuuu 模拟电子

关于.s文件: 请大侠们告诉一下，.s文需要自己修改吗？他具体是干什么的？一般情况下改的话都是针对什么来改？急!!...; renguoquan stm32/stm8

AD09布线一点问题: 我想问下，除了覆铜外，用走线的话因为没网络所以线会显绿色，加上网络又是上述情况，请问有什么办法使之没有直角吗？想用热转印制电路板，所以不想覆铜，还是只能用走线补上？其实用走线显绿 ......; 寒冰翼love PCB设计

STM32F4编程手册学习2_内存模型

1. 内存映射 MCU将资源映射到一段固定的4GB可寻址内存上，如下图所示。内存映射将内存分为几块区域，每一块区域都有一个定义的内存类型，一些区域还有一些附加的内存类型。内存类型有以下几种： Normal 处理器可以为了性能而对访问该区域的任务进行重排序。 Device 处理器保证访问该内存的任务与其他访问Device或者Stronly-ordered内存的任务相对顺序不变。 Str...[详细]
USART波特率 vs SPI速率--学习笔记

　　本篇文章将与大家探讨USART波特率 vs SPI速率。这里提出一个问题，为什么USART的波特率是内核时钟的1/8或者1/16，而SPI最快的频率可以是内核时钟的1/2。　　请大家带着这个问题来阅读本文。　　　　串口和SPI内部时钟　　在回答上面问题之前，需要先了解STM32内部时钟的概念，尤其是串口和SPI的内部时钟。　　STM32里包含有系统时钟、AHB时钟和APB时钟...[详细]
汽车网络安全破局之战：CyberMan 赋能信息安全高效开发与未来升级

随着科技的飞速发展，汽车智能化正在以前所未有的速度提升，这不仅增强了汽车的功能性和舒适性，同时也对网络安全提出了更高的要求。汽车智能化的提升，直接带动了网络安全需求的增长，传统依赖Excel、邮件流转与碎片化工具的网络安全流程已不堪重负。面对ISO/SAE 21434，UN R155/R156等全球性法规强制合规压力与日益复杂的攻击面，行业正陷入“合规成本激增、专业人才缺口扩大”的双...[详细]
新能源汽车是选择混动好还是纯电动好

我们在城市出行的时候，都会觉得电动汽车好处还是很多的，作为代步工具的它，也能够很好的完成自己的使命。现在大城市越来越多的小区有电动汽车专用车位，可以随时充电。当然这只是一种配套服务，真要使用起来可能一个星期才用充一次电，这也跟现在电动汽车的续航里程有直接的关系。很多人也禁不住为新能源汽车叫好，觉得很快就可以取代燃油汽车。不过我们却发现似乎还是我们国内非常热闹，在欧洲那些老牌汽车企业，在电动...[详细]
电视常识每日新知：软硬屏区分方法

IPS面板最大的特点就是它的两极都在同一个面上，而不象其它液晶模式的电极是在上下两面，立体排列。该技术把液晶分子的排列方式进行了优化，采取水平排列方式，当遇到外界压力时，分子结构向下稍微下陷，但是整体分子还呈水平状。在遇到外力时，硬屏液晶分子结构坚固性和稳定性远远优于软屏!所以不会产生画面失真和影响画面色彩，可以最大程度的保护画面效果不被损害。 IPS硬屏技术是目前世界上最领先的液晶技术。与...[详细]
文远知行发布一段式端到端辅助驾驶解决方案，预计2025年内量产上车

8月21日，文远知行WeRide正式推出与博世合作的一段式端到端辅助驾驶解决方案——WePilot AiDrive，这距离双方合作的“两段式端到端”方案量产上车仅半年。目前，WePilot AiDrive已完成核心功能验证，预计2025年内实现量产上车，助力全球辅助驾驶行业走向更智能、更高效、更普适的大规模应用阶段。据悉，相比先感知再决策的传统两段式架构，文远知行WePilot Ai...[详细]
英飞凌低噪声放大器在无线数据接收中的应用

　　2014年6月，工信部向联通和电信颁发4G FD-LTE牌照，加上在此之前发放给移动、联通、电信的4G TD-LTE牌照，这意味着国内三大运营商全面进入4G商用化时代，同时各大手机制造商纷纷推出多模、多频的LTE手机和终端，目前国内LTE用户规模已经达到5,000万。　　相对于3G而言，4G LTE能够提供更大的信道容量，手机用户可以享用更高的数据下载速率，在FD-LTE 20MHz...[详细]
为什么焊接工匠都爱助焊剂？揭开回流焊接的秘密

在电子制造过程中，回流焊接是最常用的方法之一，它允许在相对短的时间内焊接大量的元件。然而，任何经验丰富的电子工程师都会告诉你，没有助焊剂，高质量的回流焊接是无法完成的。那么，为什么回流焊接时需要使用助焊剂呢？以下几个方面可以解释这一点。首先，助焊剂的主要功能是帮助焊接材料在被焊接表面上均匀分布。焊接是一个涉及熔化金属并使其重新固化的过程。如果金属在固化之前不能均匀分布在被焊接表面上，焊接质...[详细]
安全第一！矿用防爆R型隔离变压器教你保护自己！

通常情况下煤矿井下含有瓦斯和煤尘。当瓦斯和煤尘达到一定浓度时，就会发生瓦斯和煤尘爆炸事故。而电气设备在正常运行或故障时就会产生电弧，电弧也是煤矿燃烧煤气和煤尘的主要火源之一。因此，煤矿的电气设备通常都采用矿用防爆R型隔离变压器。矿用防爆电气的设计制造必须符合国家防爆设备标准。防爆设备的总标志是EX。防爆电气设备的类型、类别、级别和组别以及防爆设备的总标志一起，形成防爆标志。除了防爆电源变压器的明...[详细]
博世发布面向L2+级的新一代SoC（SX600 / SX601）

博世发布新SoC系列以支撑L2+级别的高级驾驶辅助功能，该芯片集成了高分辨率与远距离探测能力，并内置对神经网络推理的支持与车规接口，便于车厂在主流车型上实现自动紧急制动、自适应巡航等功能的升级。图片来源：博世该芯片定位在主流家用轿车和SUV的ADAS平台，可与摄像头、毫米波雷达等传感器融合使用，帮助车企在更广泛的产品线上部署成熟的辅助驾驶功能并提升道路安全准入率。 ...[详细]
VSCode STM32跨平台开发环境搭建

VSCode的强大不用多说了,直接上教程: 一.到官网下载安装VSCode 二.安装完成后,打开VSCode,安装PlatformIO IDE 插件三.安装完重启VSCode,VSCode会继续安装PlatformIO IDE的依赖项,如果提示一直在安装,可以尝试用VPN瞧瞧,是不是被墙了不知道,我用VPN很快环境就安装好了四.新建工程 STM32F103C8为例,使用...[详细]
【E问E答】为何手机CPU品牌比电脑多？

　　“我想问为什么手机的CPU有很多厂商会做，而电脑的CPU只有inter和AMD两家公司会做?” 　　国内PC端的CPU制作进展到如今已让很多对此抱有期待的网友失望不已，而手机的CPU发展速度却让人产生疑惑，为什么国内可以有很多手机的CPU制作厂商，而电脑却只有那两三家公司呢?今天借这位网友的提出的问题，小编就在此为大家简单的讲解一下这个问题。　　为什么电脑的CPU只有inter和A...[详细]
ADI 2025三财季业绩超预期，工业业务复苏强劲，机器人是未来

ADI举行了 2025 财年第三季度财报电话会议。首席执行官兼董事会主席 Vincent T. Roche 与执行副总裁兼首席财务官 Richard C. Puccio 共同出席，就公司季度业绩、业务发展及未来展望进行了详细阐述。财务业绩强劲，多领域增长超预期第三季度财务数据：收入 28.8 亿美元，超预期上限，环比 + 9%，同比 + 25%。工业业务占 45%，环比...[详细]
【E课堂】你真了解内存吗？奥秘居然这么多

　　内存相信大家都听说过，电脑速度慢了也许身边的高手会建议我们升级更大容量的内存。那么电脑内存究竟是干什么用的呢?内存容量高低为什么会影响电脑的运行速度呢?这里面有不少的奥秘，不过董师傅相信大家读完下面这篇文章，一切都会明白了。　　带你先认识一下内存　　内存，也叫内存储器，是一种快速存储设备，在计算机角色扮演里占据着核心的位置。现在的内存条是一块长方形薄片状的电路板，上面焊接有很多黑色“...[详细]
MOSFET的顶部散热：与PCB和双面散热相比，散热管理更出色

随着现代电子系统的功率密度持续提高，高效的热管理已成为确保系统性能、可靠性和使用寿命的关键因素 - 尤其是在工业驱动、汽车系统和供电等高功率应用领域。尽管通过PCB进行底部散热的方法已作为标准沿用多年，但顶部散热正逐渐成为一种更高效的替代方案。本文将重点阐述顶部散热相较于传统PCB散热及双面散热方案所具有的核心优势。传统底部散热对于采用底部散热的MOSFET，半导体芯片产生的热量...[详细]

器件捷径: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多