MPL115A1
Miniature SPI digital barometer, 50 to 115 kPa
Rev. 8 — 10 October 2017
Data sheet: technical data
1
General description
The MPL115A1 is an absolute pressure sensor with a digital SPI output targeting low
cost applications. A miniature 5 x 3 x 1.2 mm LGA package is ideally suited for the space
constrained requirements of portable electronic devices. Low current consumptions of
5 μA during Active mode and 1 μA during Shutdown (Sleep) mode are essential when
focusing on low-power applications. The wide operating temperature range spans from –
40 °C to +105 °C to fit demanding environment conditions.
The MPL115A1 employs a MEMS pressure sensor with a conditioning IC to provide
accurate pressure measurements from 50 to 115 kPa. An integrated ADC converts
pressure and temperature sensor readings to digitized outputs via a SPI port. Factory
calibration data is stored internally in an on-board ROM. Utilizing the raw sensor output
and calibration data, the host microcontroller executes a compensation algorithm to
render
Compensated Absolute Pressure
with ±1 kPa accuracy.
The MPL115A1 pressure sensor’s small form factor, low power capability, precision, and
digital output optimize it for barometric measurement applications.
2
Features
•
Digitized pressure and temperature information together with programmed calibration
coefficients for host micro use.
•
Factory calibrated
•
50 kPa to 115 kPa absolute pressure
•
±1 kPa accuracy
•
2.375 V to 5.5 V supply
•
Integrated ADC
•
SPI Interface
•
Monotonic pressure and temperature data outputs
•
Surface mount RoHS compliant package
3
Applications
•
•
•
•
•
•
•
Barometry (portable and desktop)
Altimeters
Weather stations
Hard-disk drives (HDD)
Industrial equipment
Health monitoring
Air control systems
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
MPL115A1
4
Ordering information
Package
Name
Description
LGA 8 I/O, 3 X 5 X 1.25 PITCH, SENSOR 1.2MAX MM PKG
Table 1. Ordering information
Type number
MPL115A1
Version
SOT1769-1
TSON8
4.1 Ordering options
Table 2. Ordering options
Device Name
MPL115A1
MPL115A1T1
Package Options
Tray
Tape & Reel (1000)
•
•
# of Ports
None Single
Dual
Gauge
Pressure Type
Differential
Absolute
•
•
Digital
Interface
SPI
SPI
5
Block diagram
Figure 1. Block diagram of MPL115A1
MPL115A1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Data sheet: technical data
Rev. 8 — 10 October 2017
2 / 23
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
MPL115A1
6
Pinning information
6.1 Pinning
MPL115A1
VDD
CAP
GND
SHDN
1
2
3
4
8
7
6
5
SCLK
DIN
DOUT
CS
transparent top view
Figure 2. Pin configuration
6.2 Pin description
Table 3. Pin description
Pin
1
2
3
4
5
6
7
8
Name
VDD
CAP
GND
SHDN
CS
DOUT
DIN
SCLK
Function
Power Supply Connection. VDD range is 2.375 V to 5.5 V.
External Capacitor: Output decoupling capacitor for main internal
regulator. Connect a 1 μF ceramic capacitor to ground.
Ground
Shutdown: Connect to GND to disable the device. When in shut
down the part draws no more than 1 μA supply current and all
communications pins (CS, SCLK, DOUT, DIN) are high impedance.
Connect to VDD for normal operation.
Chip Select line.
Serial data output
Serial data input
Serial clock input.
7
Handling and Board Mount Recommendations
The sensor die is sensitive to light exposure. Direct light exposure through the port hole
can lead to varied accuracy of pressure measurement. Avoid such exposure to the port
during normal operation.
7.1 Methods of Handling
Components can be picked from the carrier tape using either the vacuum assist or the
mechanical type pickup heads. A vacuum assist nozzle type is most common due to its
lower cost of maintenance and ease of operation. The recommended vacuum nozzle
configuration should be designed to make contact with the device directly on the metal
cover and avoid vacuum port location directly over the vent hole in the metal cover of the
MPL115A1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Data sheet: technical data
Rev. 8 — 10 October 2017
3 / 23
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
device. Multiple vacuum ports within the nozzle may be required to effectively handle the
device and prevent shifting during movement to placement position.
Vacuum pressure required to adequately support the component should be
approximately 25 inches Hg (85 kPa). This level is typical of in-house vacuum supply.
Pickup nozzles are available in various sizes and configurations to suit a variety of
component geometries. To select the nozzle best suited for the specific application, it
is recommended that the customer consult their pick and place equipment supplier to
determine the correct nozzle. In some cases it may be necessary to fabricate a special
nozzle depending on the equipment and speed of operation.
Tweezers or other mechanical forms of handling that have a sharp point are not
recommended since they can inadvertently be inserted into the vent hole of the device.
This can lead to a puncture of the MEMS element that will render the device inoperable.
MPL115A1
7.2 Board Mount Recommendations
Components can be mounted using solder paste stencil, screen printed or dispensed
onto the PCB pads prior to placement of the component. The volume of solder paste
applied to the PCB is normally sufficient to secure the component during transport to the
subsequent reflow soldering process. Use of adhesives to secure the component is not
recommended, but where necessary can be applied to the underside of the device.
Solder pastes are available in variety of metal compositions, particle size and flux types.
The solder paste consists of metals and flux required for a reliable connection between
the component lead and the PCB pad. Flux aids the removal of oxides that may be
present on PCB pads and prevents further oxidation from occurring during the solder
process.
The use of a No-Clean (NC) flux is recommended for exposed cavity components.
Using pressure spray, wire brush, or other methods of cleaning is not recommended
since it can puncture the MEMS device and render it unusable. If cleaning of the pcb
is performed, Water Soluble (WS) flux can be used. However, it is recommended the
component cavity is protected by adhesive Kapton tape, vinyl cap or other means
prior to the cleaning process. This covering will prevent damage to the MEMS device,
contamination, and foreign materials from being introduced into device cavity as result of
cleaning processes.
Ultrasonic cleaning is not recommended as the frequencies can damage wire bond
interconnections and the MEMS device.
MPL115A1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Data sheet: technical data
Rev. 8 — 10 October 2017
4 / 23
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
MPL115A1
8
Functional description
Initial
powe rup
Readin g
coefficient data
Data conversion
Compensated
pressure readin g
Shutdown
Figure 3. Sequence flow chart
The MPL115A interfaces to a host (or system) microcontroller in the user’s application.
All communications are via SPI. A typical usage sequence is as follows:
Initial power-up
All circuit elements are active. SPI port pins are high impedance and associated registers
are cleared. The device then enters standby mode.
Reading coefficient data
The user then typically accesses the part and reads the coefficient data. The main
circuits within the slave device are disabled during read activity. The coefficients are
usually stored in the host microcontoller local memory but can be re-read at any time.
Reading of the coefficients may be executed only once and the values stored in the host
microcontroller. It is not necessary to read this multiple times because the coefficients
within a device are constant and do not change. However, note that the coefficients will
be different from device to device, and cannot be used for another part.
Data conversion
This is the first step that is performed each time a new pressure reading is required which
is initiated by the host sending the CONVERT command. The main system circuits are
activated (wake) in response to the command and after the conversion completes, the
result is placed into the Pressure and Temperature ADC output registers.
The conversion completes within the maximum conversion time, tc (see row
6,
in
Table 11).
The device then enters standby mode.
MPL115A1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Data sheet: technical data
Rev. 8 — 10 October 2017
5 / 23
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