IC REG BCK BST ADJ 0.8A DL 10DFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC10,.12,20 |
| 针数 | 10 |
| 制造商包装代码 | DD |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 最大输入电压 | 5.5 V |
| 最小输入电压 | 2.5 V |
| 标称输入电压 | 3.6 V |
| JESD-30 代码 | S-PDSO-N10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 端子数量 | 10 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 1.6 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC10,.12,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 表面贴装 | YES |
| 切换器配置 | BUCK |
| 最大切换频率 | 2700 kHz |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| LTC3407AIDD-2#PBF | LTC3407AEDD-2#TRPBF | LTC3407AEMSE-2#TRPBF | LTC3407AIMSE-2#PBF | LTC3407AIDD-2#TRPBF | LTC3407AIMSE-2#TRPBF | LTC3407AEDD-2#PBF | LTC3407AEMSE-2#PBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC REG BCK BST ADJ 0.8A DL 10DFN | IC REG BCK BST ADJ 0.8A DL 10DFN | IC REG BUCK BST ADJ 0.8A 10MSOP | IC REG BUCK BST ADJ 0.8A 10MSOP | IC REG BCK BST ADJ 0.8A DL 10DFN | IC REG BUCK BST ADJ 0.8A 10MSOP | IC REG BCK BST ADJ 0.8A DL 10DFN | IC REG BUCK BST ADJ 0.8A 10MSOP |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DFN | DFN | MSOP | MSOP | DFN | MSOP | DFN | MSOP |
| 包装说明 | HVSON, SOLCC10,.12,20 | HVSON, SOLCC10,.12,20 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 | HVSON, SOLCC10,.12,20 | HTSSOP, TSSOP10,.19,20 | HVSON, SOLCC10,.12,20 | HTSSOP, TSSOP10,.19,20 |
| 针数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 制造商包装代码 | DD | DD | MSE | MSE | DD | MSE | DD | MSE |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 最大输入电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称输入电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| JESD-30 代码 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-N10 | S-PDSO-G10 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最大输出电流 | 1.6 A | 1.6 A | 1.6 A | 1.6 A | 1.6 A | 1.6 A | 1.6 A | 1.6 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | HVSON | HTSSOP | HTSSOP | HVSON | HTSSOP | HVSON | HTSSOP |
| 封装等效代码 | SOLCC10,.12,20 | SOLCC10,.12,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | SOLCC10,.12,20 | TSSOP10,.19,20 | SOLCC10,.12,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 1.1 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 切换器配置 | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK |
| 最大切换频率 | 2700 kHz | 2700 kHz | 2700 kHz | 2700 kHz | 2700 kHz | 2700 kHz | 2700 kHz | 2700 kHz |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | OTHER | OTHER | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | OTHER | OTHER |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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