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LTC4312CDE#PBF

产品描述IC MULTIPLEXER I2C HOTSWAP 14DFN
产品类别电源/电源管理    电源电路   
文件大小199KB,共20页
制造商Linear ( ADI )
官网地址http://www.analog.com/cn/index.html
标准
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LTC4312CDE#PBF概述

IC MULTIPLEXER I2C HOTSWAP 14DFN

LTC4312CDE#PBF规格参数

参数名称属性值
Brand NameLinear Technology
是否Rohs认证符合
厂商名称Linear ( ADI )
零件包装代码DFN
包装说明HVSON,
针数14
制造商包装代码DE
Reach Compliance Codecompliant
ECCN代码EAR99
可调阈值NO
模拟集成电路 - 其他类型POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码R-PDSO-N14
JESD-609代码e3
长度4 mm
湿度敏感等级1
信道数量2
功能数量1
端子数量14
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码HVSON
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度0.8 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.9 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm

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FEATURES
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LTC4312
Pin-Selectable, 2-Channel,
2-Wire Multiplexer
with Bus Buffers
DESCRIPTION
The LTC
®
4312 is a hot-swappable 2-channel 2-wire bus
multiplexer that allows one upstream bus to connect to
any combination of downstream busses or channels.
An individual enable pin controls each connection. The
LTC4312 provides bidirectional buffering, keeping the up-
stream bus capacitance isolated from the downstream bus
capacitances. The high noise margin allows the LTC4312
to be interoperable with I
2
C devices that drive a high V
OL
(> 0.4V). The LTC4312 supports level translation between
1.5V, 1.8V, 2.5V, 3.3V and 5V busses. The hot-swappable
nature of the LTC4312 allows I/O card insertion into, and
removal from, a live backplane without corruption of the
data and clock busses.
If both data and clock are not simultaneously high at
least once in 45ms and DISCEN is high, a
FAULT
signal is
generated indicating a stuck bus low condition, the input
is disconnected from each enabled output channel and up
to 16 clocks are generated on the enabled downstream
busses. A three state
ACC
pin enables input and output
side rise time accelerators of varying strengths and sets
the V
IL,RISING
voltage.
L,
LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. Hot Swap is a trademark of Linear Technology Corporation. All other
trademarks are the property of their respective owners. Protected by U.S. Patents, including
6356140, 6650174, 7032051, 7478286.
1:2 Multiplexer/Switch for 2-Wire Bus
Bidirectional Buffer for SDA and SCL Lines
High Noise Margin with V
IL
= 0.3•V
CC
ENABLE Pins Connect SDA and SCL Lines
Selectable Rise Time Accelerator Current and
Activation Voltage
Level Shift 1.5V, 1.8V, 2.5V, 3.3V and 5V Busses
Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
Stuck Bus Disconnect and Recovery
Compatible with I
2
C, I
2
C Fast Mode and SMBus
±4kV Human Body Model (HBM) ESD Ruggedness
14-Lead 4mm × 3mm DFN and 16-Lead MSOP
Packages
APPLICATIONS
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n
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n
n
Telecommunications Systems Including ATCA
Address Expansion
Level Translator
Capacitance Buffers/Bus Extender
Live Board Insertion
PMBus
TYPICAL APPLICATION
3.3V
3.3V
Rising Edge from Asserted Low
with Level Translation
10k
0.01μF
6V
C
SCLOUT1
+ C
SCLOUT2
= 100pF
C
SCLIN
= 50pF
SCLOUT2
0.01μF
SCLIN
SDAIN
ENABLE1
ENABLE2
10k
10k
V
CC
SCLIN
SDAIN
ENABLE1
ENABLE2
V
CC2
10k
5V
SCLOUT1
SDAOUT1
5V
SCLOUT1
1V/DIV
SDAOUT1
SCLOUT1
SCLIN
3.3V
3.3V
LTC4312
10k
ACC
DISCEN
SCLOUT2
SDAOUT2
GND
4314 TA01a
10k
10k
SCLOUT2
SDAOUT2
0V
200ns/DIV
4312 TA01b
FAULT
FAULT
4312f
1

LTC4312CDE#PBF相似产品对比

LTC4312CDE#PBF LTC4312IDE#TRPBF LTC4312IMS#TRPBF LTC4312IMS#PBF LTC4312IDE#PBF LTC4312CMS#PBF LTC4312CMS#TRPBF LTC4312CDE#TRPBF
描述 IC MULTIPLEXER I2C HOTSWAP 14DFN IC MULTIPLEXER I2C HOTSWAP 14DFN IC MULTIPLEXR I2C HOTSWAP 16MSOP IC MULTIPLEXR I2C HOTSWAP 16MSOP IC MULTIPLEXER I2C HOTSWAP 14DFN IC MULTIPLEXR I2C HOTSWAP 16MSOP IC MULTIPLEXR I2C HOTSWAP 16MSOP IC MULTIPLEXER I2C HOTSWAP 14DFN
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
零件包装代码 DFN DFN MSOP MSOP DFN MSOP MSOP DFN
包装说明 HVSON, HVSON, HTSSOP, HTSSOP, HVSON, HTSSOP, HTSSOP, HVSON,
针数 14 14 16 16 14 16 16 14
制造商包装代码 DE DE MS MS DE MS MS DE
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
可调阈值 NO NO NO NO NO NO NO NO
模拟集成电路 - 其他类型 POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码 R-PDSO-N14 R-PDSO-N14 R-PDSO-G16 R-PDSO-G16 R-PDSO-N14 R-PDSO-G16 R-PDSO-G16 R-PDSO-N14
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
长度 4 mm 4 mm 4.039 mm 4.039 mm 4 mm 4.039 mm 4.039 mm 4 mm
湿度敏感等级 1 1 1 1 1 1 1 1
信道数量 2 2 2 2 2 2 2 2
功能数量 1 1 1 1 1 1 1 1
端子数量 14 14 16 16 14 16 16 14
最高工作温度 70 °C 85 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSON HVSON HTSSOP HTSSOP HVSON HTSSOP HTSSOP HVSON
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.9 V 2.9 V 2.9 V 2.9 V 2.9 V 2.9 V 2.9 V 2.9 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 NO LEAD NO LEAD GULL WING GULL WING NO LEAD GULL WING GULL WING NO LEAD
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
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