1
4
A
3
3
3
2
3
5
6
7
B
3
C
D
3
NOTES:
MATERIAL
1.Pin(outer sleeve): Brass, machined CuZn38Pb2
3
2.Clip(contact 4 finger): Beryllium copper, heat treated
3.Plating(outer sleeve): HZL: 2um/80u"nickel, 5um/200u"Tin
HGL: 2um/80u"nickel, Gold flash
4.Plating(contact): 2um/80u"nickel, Gold flash or 10u", 30u" Gold
5.Insulator Material: Glass filled PBT, UL94V-0 Black
ELECTRICAL
1.Current Rating: 3Amps/contact max.
2.Contact Resistance: 4mΩ/contact max.
3.Insulation Resistance: ≥10000MΩ at 500VAC
4.Operating Voltage: 100 VRMS/150VDC
MECHANICAL
1.Average Insertion force with steel pin of
∅
0.43mm/0.017": <250g
2.Average Withdrawal force with steel pin of
∅
0.43mm/0.017": >50g min.
3.Mechanical life cycle: 200 min.
4.Operation Temperature: -40°C to +105°C
5.Wave Soldering temperature: +245°C, 5-10s max.
4
A
B
C
D
Packing: Tube
Order Code:
E
No. of contact
06 ~ 64
Versions
-TT
/7-TT
Plating
HZL
HZL/01
HZL/07
HGL
AR xx- x x
- Standard
- Only for 24+28 poles*
(Dim C: 7.62)
outer sleeve / contact
- Sleeve tin / clip gold flash
- Sleeve tin / clip 10u" gold
- Sleeve tin / clip 30u" gold
- Sleeve gold flash / clip gold flash
F
2
PCB LAYOUT
Contact
06
08
10
14
16
18
20
22
24*
24
28*
Dim A
7.62
10.16
12.70
17.78
20.32
22.86
25.40
27.94
30.48
30.48
35.56
Dim B
5.08
7.62
10.16
15.24
17.78
20.32
22.86
25.40
27.94
27.94
33.02
Dim C
7.62
7.62
7.62
7.62
7.62
7.62
7.62
10.16
7.62
15.24
7.62
Dim D
Note 3
10.16
10.16
10.16 w/o bar
10.16
10.16
10.16
10.16
12.70
10.16 with bar
17.78
10.16
E
F
Scale
X.
X.X
Free
TOLERANCE
4
Update wave solder temp.
16.08.2017
Amy
Drawn
Date
23.07.2012
28
32
35.56
40.64
33.02
38.10
15.24
15.24
17.78
17.78
RoHS compliant
Unit:mm
Name
Customer-No.
G
Lucas
±0.50
±0.30
3 Update to new drawing
G
28.10.2016
Amy
Approved
16.08.2017
Amy
ASSMANN WSW-No.
±0.20
2 Add "HGL"-Version,corrected P/N code 28.01.2014 A. Plate
X.XX
X.XXX ±0.10
1
Add sheet 2
16.08.2012
Lucas
AR xx-x x
DIM
Angle
Angle
TOL
Drawing-No.
H
1
2
±
5°
TOL
0
Id.
Drawn
Modification
23.07.2012
Date
Lucas
Name
ASS 4852 CO
rev04
H
3
4
5
Replace
Sheet
1/2
6
7
1
4
A
3
3
2
3
5
6
7
B
3
C
3
3
D
NOTES:
MATERIAL
1.Pin(outer sleeve): Brass, machined CuZn38Pb2
3
2.Clip(contact 4 finger): Beryllium copper, heat treated
3.Plating(outer sleeve): HZL: 2um/80u"nickel, 5um/200u"Tin
HGL: 2um/80u"nickel, Gold flash
4.Plating(contact): 2um/80u"nickel, Gold flash or 10u", 30u" Gold
5.Insulator Material: Glass filled PBT, UL94V-0 Black
ELECTRICAL
1.Current Rating: 3Amps/contact max.
2.Contact Resistance: 4mΩ/contact max.
3.Insulation Resistance: ≥10000MΩ at 500VAC
4.Operating Voltage: 100 VRMS/150VDC
MECHANICAL
1.Average Insertion force with steel pin of
∅
0.43mm/0.017": <250g
2.Average Withdrawal force with steel pin of
∅
0.43mm/0.017": >50g min.
3.Mechanical life cycle: 200 min.
4.Operation Temperature: -40°C to +105°C
5.Wave Soldering temperature: +245°C, 5-10s max.
4
A
B
C
D
Packing: Tube
E
F
PCB LAYOUT
Contact
36
40
42
48
50
52
50
52
64
Dim A
45.72
50.80
53.34
60.96
63.50
66.04
63.50
66.04
81.28
Dim B Dim C
15.24
15.24
15.24
15.24
15.24
15.24
22.86
22.86
22.86
Dim D
43.18
48.26
50.80
58.42
60.96
63.50
60.96
63.50
78.74
17.78
17.78
17.78
17.78
17.78
17.78
25.40
25.40
25.40
E
F
Scale
X.
Free
TOLERANCE
±0.50
28.10.2016
Amy
±0.30
X.X
±0.20
2 Add "HGL"-Version,corrected P/N code 28.01.2014 A. Plate
X.XX
X.XXX ±0.10
1
Add sheet 2
16.08.2012
Lucas
3
Update to new drawing
Approved
16.08.2017
4
Update wave solder temp.
16.08.2017
Amy
Drawn
Date
23.07.2012
RoHS compliant
Unit:mm
Name
Customer-No.
G
Lucas
G
Amy
ASSMANN WSW-No.
AR xx-x x
DIM
Angle
Angle
TOL
Drawing-No.
H
1
2
±
5°
TOL
0
Id.
Drawn
Modification
23.07.2012
Date
Lucas
Name
ASS 4852 CO
rev04
H
3
4
5
Replace
Sheet
2/2
6
7
FPGA/CPLD
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