Powering Communications and Technology
IES SERIES
20 WATT
DESCRIPTION
IES DC/DC converters provide up to 20 Watts of
output power in an industry standard package. With
88% efficiency and a maximum case temperature of
100°C, the IES is well suited for the most demanding
telecom, networking, and industrial applications.
The IES features 1500 VDC isolation, short circuit,
and overtemperature protection.
FEATURES
•
•
•
•
20W Standard Package
100°C Case Operation
3.3V Output Available
Open Frame or
Encapsulated
•
•
•
•
88% Efficiency at 5V
Wide Range Input
1500V Isolation
Short Circuit
Protection
Efficiency vs. Load (24V Input)
85
80
75
70
65
IES020YG-A
EFF. (18v)
EFF. (24v)
EFF. (36v)
TECHNICAL SPECIFICATIONS
Input
Voltage Range
24 VDC Nominal
48 VDC Nominal
Input Undervoltage Lockout
UVLO Hysteresis
Reflected Ripple
Input Reverse Voltage Protection
16 - 36 VDC
36 - 72 VDC
<34V or <17V
1V Nom.
25 mA
Shunt Diode
60
55
50
45
40
10
20
30
40
50
60
70
80
90
100
LOAD %
Efficiency vs. Load (48V Input)
90
Output
Setpoint Accuracy
±1%
Line Regulation Vin Min. - Vin Max., Iout Rated
0.2% Vout
Load Regulation Iout Min. - Iout Max., Vin Nom.
0.5% Vout
Minimum Output Current
10 %
Dynamic Regulation, Loadstep
25% Iout
Pk Deviation
4% Vout
Settling Time
500
µs
Voltage Trim Range
±10%
Short Circuit / Overcurrent Protection
Shutdown / Hiccup
Current Limit Threshold Range, % of Iout Rated
110 - 140%
OVP Trip Range
115 - 140% Vout Nom.
OVP Type
Second Control Loop, Self-Recovering
85
80
75
70
65
60
55
50
45
40
10
20
30
40
50
60
70
80
90
100
LOAD %
IES020ZG-A
EFF. (36v)
EFF. (48v)
EFF. (72v)
High Density - Board Mounted Power Division
General
Turn-On Time
10 ms
Remote Shutdown
Positive Logic
Switching Frequency
300 kHz Open Frame / 450 kHz Cased
Isolation
Input - Output
1500 VDC
Input - Case (24 Vin Units)
500 VDC
Output - Case (48 Vin Units)
500 VDC
Temperature Coefficient
0.03%/°C
Case Temperature
Operating Range
-40 To +100°C
Storage Range
-40 To +125°C
Humidity Max., Non-Condensing
95%
Vibration, 3 Axes, 5 Min Each
5 g, 10 - 55 Hz
MTBF† (Bellcore TR-NWT-000332)
1.9 x 106 hrs
Safety
UL, CSA, EN60950
Weight (approx.)
1.2 oz
Notes
† MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load,
unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully
compatible with commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model.
Please consult factory for specific model information.
Units are water-washable and fully compatible with commercial
spray or immersion post wave-solder washing equipment.
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OPTIONS
Powering Communications and Technology
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and
add them to the model number. Example ordering options are located below the options table.
OPTIONS
Negative Logic
SUFFIX
N
APPLICABLE SERIES
HAS, HBD, HBS, HES, HLS, LES,
QBS, QES, QLS, TES, TQD
HAS, HBD, HBS, HES, HLS, QBS, QES,
QLS
XWS, XWD, XWT
IAS, LES
IAD, IAS, LES, SMS
IAS, LES
SMS
Encapsulated EWS, IWS, OWS
Standard Pin Length is 0.180"
(4.6mm)
8
9
1H
1V
2H
2V
3H
3V
All Units (Except SMS)
All Units (Except SMS)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
REMARKS
TTL "Low" Turns Module ON
TTL "High" Turns Module OFF
Lucent Compatible Trim
Terminal Strip
Trim
Enable
Trim and Enable
Current Share
Headerless
PIN LENGTH AND HEATSINK
OPTIONS
0.110" (2.8mm) Pin Length
0.150" (3.8mm) Pin Length
0.24" (6.1mm) Horizontal Heatsink
0.24" (6.1mm) Vertical Heatsink
0.45" (11.4mm) Horizontal Heatsink
0.45" (11.4mm) Vertical Heatsink
0.95" (24.1mm) Horizontal Heatsink
0.95" (24.1mm) Vertical Heatsink
T
TS
1
2
3
4
Y
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
High Density - Board Mounted Power Division
Includes Thermal Pad
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used
in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu-
factured. Specifications are subject to change without notice.
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