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74ABT16501CSSC

产品描述IC UNIV BUS TXRX 18BIT 56SSOP
产品类别半导体    逻辑   
文件大小66KB,共7页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
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74ABT16501CSSC概述

IC UNIV BUS TXRX 18BIT 56SSOP

74ABT16501CSSC规格参数

参数名称属性值
逻辑类型通用总线收发器
电路数18 位
电流 - 输出高,低3mA,64mA
电压 - 电源4.5 V ~ 5.5 V
工作温度-40°C ~ 85°C
安装类型表面贴装
封装/外壳56-BSSOP(0.295",7.50mm 宽)
供应商器件封装56-SSOP

文档预览

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74ABT16501 18-Bit Universal Bus Transceivers with 3-STATE Outputs
January 1995
Revised January 1999
74ABT16501
18-Bit Universal Bus Transceivers with 3-STATE Outputs
General Description
The ABT16501 18-bit universal bus transceiver combines
D-type latches and D-type flip-flops to allow data flow in
transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the
device operates in the transparent mode when LEAB is
HIGH. When LEAB is LOW, the A data is latched if CLKAB
is held at a HIGH or LOW logic level. If LEAB is LOW, the A
bus data is stored in the latch/flip-flop on the LOW-to-HIGH
transition of CLKAB. Output-enable OEAB is active-high.
When OEAB is HIGH, the outputs are active. When OEAB
is LOW, the outputs are in the high-impedance state.
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, and CLKBA. The output enables are com-
plementary (OEAB is active HIGH and OEBA is active
LOW).
To ensure the high-impedance state during power up or
power down, OE inputs should be tied to GND through a
pulldown resistor; the minimum value of the resistor is
determined by the current-sourcing capability of the driver.
Features
s
Combines D-Type latches and D-Type flip-flops for oper-
ation in transparent, latched, or clocked mode
s
Flow-through architecture optimizes PCB layout
s
Guaranteed latch-up protection
s
High impedance glitch free bus loading during entire
power up and power down cycle
s
Non-destructive hot insertion capability
Ordering Code:
Order Number
74ABT16501CSSC
74ABT16501CMTD
Package Number
MS56A
MTD56
Package Description
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape or Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Assignment for SSOP
Function Table
OEAB
L
H
H
H
H
H
H
LEAB
X
H
H
L
L
L
L
(Note 1)
Output
A
X
L
H
L
H
X
X
B
Z
L
H
L
H
B
0
(Note 2)
B
0
(Note 3)
X
X
X
H
L
Inputs
CLKAB
Note 1:
A-to-B data flow is shown: B-to-A flow is similar but uses OEBA,
LEBA, and CLKBA.
Note 2:
Output level before the indicated steady-state input conditions
were established.
Note 3:
Output level before the indicated steady-state input conditions
were established, provided that CLKAB was HIGH before LEAB went LOW.
© 1999 Fairchild Semiconductor Corporation
DS011690.prf
www.fairchildsemi.com

74ABT16501CSSC相似产品对比

74ABT16501CSSC 74ABT16501CMTD 74ABT16501CSSCX 74ABT16501CMTDX
描述 IC UNIV BUS TXRX 18BIT 56SSOP IC UNIV BUS TXRX 18BIT 56TSSOP IC UNIV BUS TXRX 18BIT 56SSOP IC UNIV BUS TXRX 18BIT 56TSSOP
逻辑类型 通用总线收发器 通用总线收发器 通用总线收发器 通用总线收发器
电路数 18 位 18 位 18 位 18 位
电流 - 输出高,低 3mA,64mA 3mA,64mA 3mA,64mA 3mA,64mA
电压 - 电源 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V
工作温度 -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
安装类型 表面贴装 表面贴装 表面贴装 表面贴装
封装/外壳 56-BSSOP(0.295",7.50mm 宽) 56-TFSOP(0.240",6.10mm 宽) 56-BSSOP(0.295",7.50mm 宽) 56-TFSOP(0.240",6.10mm 宽)
供应商器件封装 56-SSOP 56-TSSOP 56-SSOP 56-TSSOP
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