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23A1024-I/P: 产品描述IC SRAM 1M SPI 20MHZ 8DIP; 产品类别存储存储; 文件大小414KB，共32页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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23A1024-I/P概述

IC SRAM 1M SPI 20MHZ 8DIP

23A1024-I/P规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Microchip(微芯科技)
包装说明	DIP, DIP8,.3
Reach Compliance Code	compliant
Factory Lead Time	6 weeks
最长访问时间	25 ns
最大时钟频率 (fCLK)	20 MHz
I/O 类型	COMMON/SEPARATE
JESD-30 代码	R-PDIP-T8
JESD-609代码	e3
长度	9.271 mm
内存密度	1048576 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
功能数量	1
端子数量	8
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	128KX8
输出特性	3-STATE
可输出	NO
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT APPLICABLE
电源	1.8/2 V
认证状态	Not Qualified
反向引出线	NO
座面最大高度	5.334 mm
最大待机电流	0.000012 A
最小待机电流	1.7 V
最大压摆率	0.01 mA
最大供电电压 (Vsup)	2.2 V
最小供电电压 (Vsup)	1.7 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn) - annealed
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT APPLICABLE
宽度	7.62 mm
Base Number Matches	1

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23A1024/23LC1024

1Mbit SPI Serial SRAM with SDI and SQI Interface

Device Selection Table

Part

Number

23A1024

23LC1024

Note 1:

Range

1.7-2.2V

2.5-5.5V

16 MHz for E-temp.

Temp.

Ranges

I, E

Dual I/O

(SDI)

Yes

Quad I/O

(SQI)

Yes

Max. Clock

Frequency

20 MHz

(1)

20 MHz

(1)

Packages

SN, ST, P

Features

• SPI Bus Interface:

- SPI compatible

- SDI (dual) and SQI (quad) compatible

- 20 MHz Clock rate for all modes

• Low-Power CMOS Technology:

- Read Current: 3 mA at 5.5V, 20 MHz

- Standby Current: 4

A

at +85°C

• Unlimited Read and Write Cycles

• Zero Write Time

• 128K x 8-bit Organization:

- 32-byte page

• Byte, Page and Sequential Mode for Reads and

Writes

• High Reliability

• Temperature Ranges Supported:

- Industrial (I):

-40C to +85C

- Automotive (E):

-40C to +125C

• RoHS Compliant

• 8 Lead SOIC, TSSOP and PDIP Packages

Description

The Microchip Technology Inc. 23A1024/23LC1024

are 1 Mbit Serial SRAM devices. The memory is

accessed via a simple Serial Peripheral Interface (SPI)

compatible serial bus. The bus signals required are a

clock input (SCK), a data in line (SI) and a data out line

(SO). Access to the device is controlled through a Chip

Select (CS) input. Additionally, SDI (Serial Dual

Interface) and SQI (Serial Quad Interface) is supported

if your application needs faster data rates.

This device also supports unlimited reads and writes to

the memory array.

The 23A1024/23LC1024 is available in standard

packages including 8-lead SOIC, PDIP and advanced

8-lead TSSOP.

Package Types (not to scale)

SOIC/TSSOP/PDIP

SO/SIO1

HOLD/SIO3

SCK

SI/SIO0

Pin Function Table

Name

SO/SIO1

SIO2

SI/SIO0

SCK

HOLD/SIO3

Function

Chip Select Input Pin

Serial Output/SDI/SQI Pin

SQI Pin

Ground Pin

Serial Input/SDI/SQI Pin

Serial Clock Pin

Hold/SQI Pin

Power Supply Pin

SIO2



2012-2015 Microchip Technology Inc.

DS20005142C-page 1

23A1024-I/P相似产品对比

	23A1024-I/P	23A1024-E/P	23LC1024-E/P	23LC1024T-E/ST	23LC1024T-I/ST	23A1024T-I/ST	23LC1024-I/SN	23LC1024T-E/SNVAO	23LC1024T-I/SNVAO	23LC1024-I/SNVAO
描述	IC SRAM 1M SPI 20MHZ 8DIP	IC SRAM 1M SPI 16MHZ 8DIP	IC SRAM 1M SPI 16MHZ 8DIP	IC SRAM 1M SPI 16MHZ 8TSSOP	IC SRAM 1M SPI 20MHZ 8TSSOP	IC SRAM 1M SPI 20MHZ 8TSSOP	存储器接口类型：SPI - Quad I/O 存储器容量：1Mb (128K x 8) 工作电压：2.5V ~ 5.5V 存储器类型：Volatile 1-Mbit(128K x 8bit)，SPI接口，工作电压：2.5V to 5.5V	Standard SRAM, 128KX8, CMOS, PDSO8	Standard SRAM, 128KX8, CMOS, PDSO8	Standard SRAM, 128KX8, 25ns, CMOS, PDSO8
技术	CMOS	CMOS	SRAM	SRAM	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
是否Rohs认证	符合	符合	-	-	符合	符合	符合	符合	符合	符合
厂商名称	Microchip(微芯科技)	Microchip(微芯科技)	-	-	Microchip(微芯科技)	Microchip(微芯科技)	Microchip(微芯科技)	Microchip(微芯科技)	Microchip(微芯科技)	Microchip(微芯科技)
包装说明	DIP, DIP8,.3	PDIP-8	-	-	TSSOP-8	TSSOP-8	SOIC-8	SOIC-8	SOIC-8	SOIC-8
Reach Compliance Code	compliant	compliant	-	-	compliant	compliant	compliant	compliant	compliant	compliant
最长访问时间	25 ns	32 ns	-	-	25 ns	25 ns	25 ns	32 ns	25 ns	25 ns
最大时钟频率 (fCLK)	20 MHz	16 MHz	-	-	20 MHz	20 MHz	20 MHz	16 MHz	20 MHz	20 MHz
I/O 类型	COMMON/SEPARATE	COMMON/SEPARATE	-	-	COMMON/SEPARATE	COMMON/SEPARATE	COMMON/SEPARATE	COMMON/SEPARATE	COMMON/SEPARATE	COMMON/SEPARATE
JESD-30 代码	R-PDIP-T8	R-PDIP-T8	-	-	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e3	e3	-	-	e3	e3	e3	e3	e3	e3
长度	9.271 mm	9.271 mm	-	-	4.4 mm	4.4 mm	4.9 mm	4.9 mm	4.9 mm	4.9 mm
内存密度	1048576 bit	1048576 bit	-	-	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	-	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	-	-	8	8	8	8	8	8
功能数量	1	1	-	-	1	1	1	1	1	1
端子数量	8	8	-	-	8	8	8	8	8	8
字数	131072 words	131072 words	-	-	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	-	-	128000	128000	128000	128000	128000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	125 °C	-	-	85 °C	85 °C	85 °C	125 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	128KX8	128KX8	-	-	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
输出特性	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	NO	NO	-	-	NO	NO	NO	NO	NO	NO
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	DIP	-	-	TSSOP	TSSOP	SOP	SOP	SOP	SOP
封装等效代码	DIP8,.3	DIP8,.3	-	-	TSSOP8,.25	TSSOP8,.25	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	-	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT APPLICABLE	NOT APPLICABLE	-	-	260	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
反向引出线	NO	NO	-	-	NO	NO	NO	NO	NO	NO
座面最大高度	5.334 mm	5.334 mm	-	-	1.2 mm	1.2 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm
最大待机电流	0.000012 A	0.000012 A	-	-	0.000012 A	0.000012 A	0.000012 A	0.000012 A	0.000012 A	0.000012 A
最小待机电流	1.7 V	1.7 V	-	-	2.5 V	1.7 V	2.5 V	2.5 V	2.5 V	2.5 V
最大压摆率	0.01 mA	0.01 mA	-	-	0.01 mA	0.01 mA	0.01 mA	0.01 mA	0.01 mA	0.01 mA
最大供电电压 (Vsup)	2.2 V	2.2 V	-	-	5.5 V	2.2 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.7 V	1.7 V	-	-	2.5 V	1.7 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	NO	NO	-	-	YES	YES	YES	YES	YES	YES
温度等级	INDUSTRIAL	AUTOMOTIVE	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL
端子面层	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	-	-	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
端子形式	THROUGH-HOLE	THROUGH-HOLE	-	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	2.54 mm	2.54 mm	-	-	0.65 mm	0.65 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT APPLICABLE	NOT APPLICABLE	-	-	40	40	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	7.62 mm	7.62 mm	-	-	3 mm	3 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm

23A1024-I/P

23A1024-I/P概述

23A1024-I/P规格参数

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23A1024-I/P相似产品对比

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