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USB2228-NU-05

产品描述4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小726KB,共27页
制造商SMSC
官网地址http://www.smsc.com/
标准
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USB2228-NU-05概述

4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs

USB2228-NU-05规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SMSC
零件包装代码QFP
包装说明TFQFP, TQFP128,.63SQ,16
针数128
Reach Compliance Codeunknow
主机接口标准USB
JESD-30 代码S-PQFP-G128
长度14 mm
端子数量128
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码TFQFP
封装等效代码TQFP128,.63SQ,16
封装形状SQUARE
封装形式FLATPACK, THIN PROFILE, FINE PITCH
电源3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大压摆率100 mA
最大供电电压1.98 V
最小供电电压1.62 V
标称供电电压1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式GULL WING
端子节距0.4 mm
端子位置QUAD
宽度14 mm
uPs/uCs/外围集成电路类型SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

文档预览

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USB2227/USB2228
4th Generation USB2.0
Flash Media Controller
with Integrated Card
Power FETs
PRODUCT FEATURES
Complete System Solution for interfacing SmartMedia
TM
(SM) or xD Picture Card
TM
(xD)
1
, Memory Stick
TM
(MS),
High Speed Memory Stick (HSMS), Memory Stick PRO
(MSPRO), MS Duo
TM
, Secure Digital (SD), Mini-Secure
Digital (Mini-SD), TransFlash (SD), MultiMediaCard
TM
(MMC), Reduced Size MultiMediaCard (RS-MMC), NAND
Flash, Compact Flash
TM
(CF) and CF Ultra
TM
I & II, and CF
form-factor ATA hard drives to USB2.0 bus
— Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
Support for simultaneous operation of all above devices.
(only one at a time of each of the following groups
supported: CF or ATA drive, SM or XD or NAND, SD or
MMC)
On-Chip 4-Bit High Speed Memory Stick and MS PRO
Hardware Circuitry
On-Chip firmware reads and writes High Speed Memory
Stick and MS PRO
1-bit ECC correction performed in hardware for maximum
efficiency
Hardware support for SD Security Command Extensions
On-chip power FETs for supplying flash media card power
with minimum board components
USB Bus Power Certified
3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3
Complete USB Specification 2.0 Compatibility for Bus
Powered Operation
— Includes USB2.0 Transceiver
— A Bi-directional Control and a Bi-directional Bulk
Endpoint are provided.
8051 8 bit microprocessor
— Provides low speed control functions
— 30 Mhz execution speed at 4 cycles per instruction
average
— 12K Bytes of internal SRAM for general purpose
scratchpad
— 768 Bytes of internal SRAM for general purpose
scratchpad or program execution while re-flashing
external ROM
Double Buffered Bulk Endpoint
— Bi-directional 512 Byte Buffer for Bulk Endpoint
— 64 Byte RX Control Endpoint Buffer
— 64 Byte TX Control Endpoint Buffer
Datasheet
Internal or External Program Memory Interface
— 64K Byte Internal Code Space or Optional 64K Byte
External Code Space using Flash, SRAM or EPROM
memory.
On Board 24Mhz Crystal Driver Circuit
Can be clocked by 48MHz external source
On-Chip 1.8V Regulator for Low Power Core Operation
Internal PLL for 480Mhz USB2.0 Sampling, Configurable
MCU clock
Supports firmware upgrade via USB bus if “boot block”
Flash program memory is used
15 GPIOs for special function use: LED indicators, button
inputs, power control to memory devices, etc.
— Inputs capable of generating interrupts with either edge
sensitivity
— Attribute bit controlled features:
— Activity LED polarity/operation/blink rate
— Full or Partial Card compliance checking
— Bus or Self Powered
— LUN configuration and assignment
— Write Protect Polarity
— SmartDetach™ Detach from USB when no Card
Inserted for Notebook apps
— Cover Switch operation for xD compliance
— Inquiry Command operation
— SD Write Protect operation
— Older CF card support
— Force USB 1.1 reporting
— Internal or External Power FET operation
Compatible with Microsoft WinXP, WinME, Win2K SP3,
Apple OS10, Softconnex, and Linux Multi-LUN Mass
Storage Class Drivers
Win2K, Win98/98SE and Apple OS8.6 and OS9 Multi-LUN
Mass Storage Class Drivers available from SMSC
128 Pin VTQFP Lead-free RoHS Compliant Package
(1.0mm height, 14mm x14mm footprint)
124 Pin DQFN Lead-free RoHS Compliant Package (0.8mm
height, 10mm x10mm footprint)
1.xD Picture Card not applicable to USB2227
SMSC USB2227/USB2228
DATASHEET
Revision 1.91 (10-13-06)

USB2228-NU-05相似产品对比

USB2228-NU-05 USB2227-NU-05 USB2227_06 USB2227-AHZS-XX USB2228-AHZS-XX
描述 4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs 4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs 4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs 4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs 4th Generation USB2.0 Flash Media Controller with Integrated Card Power FETs
是否Rohs认证 符合 符合 - 符合 符合
厂商名称 SMSC SMSC - SMSC SMSC
包装说明 TFQFP, TQFP128,.63SQ,16 TFQFP, TQFP128,.63SQ,16 - HVQCCN, SLGA124,20X20,20 HVQCCN, SLGA124,20X20,20
Reach Compliance Code unknow unknow - unknow unknow
主机接口标准 USB USB - USB USB
JESD-30 代码 S-PQFP-G128 S-PQFP-G128 - S-PQCC-N124 S-PQCC-N124
长度 14 mm 14 mm - 10 mm 10 mm
端子数量 128 128 - 124 124
最高工作温度 70 °C 70 °C - 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFQFP TFQFP - HVQCCN HVQCCN
封装等效代码 TQFP128,.63SQ,16 TQFP128,.63SQ,16 - SLGA124,20X20,20 SLGA124,20X20,20
封装形状 SQUARE SQUARE - SQUARE SQUARE
封装形式 FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
电源 3.3 V 3.3 V - 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm - 0.85 mm 0.85 mm
最大供电电压 1.98 V 1.98 V - 3.6 V 3.6 V
最小供电电压 1.62 V 1.62 V - 3 V 3 V
标称供电电压 1.8 V 1.8 V - 3.3 V 3.3 V
表面贴装 YES YES - YES YES
技术 CMOS CMOS - CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING - NO LEAD NO LEAD
端子节距 0.4 mm 0.4 mm - 0.5 mm 0.5 mm
端子位置 QUAD QUAD - QUAD QUAD
宽度 14 mm 14 mm - 10 mm 10 mm
uPs/uCs/外围集成电路类型 SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE - SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
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