Content Addressable SRAM, 256X48, 65ns, CMOS, CDIP28, 0.400 INCH, CERDIP-28
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 65 ns |
| 其他特性 | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC |
| JESD-30 代码 | R-GDIP-T28 |
| 长度 | 37.1475 mm |
| 内存密度 | 12288 bit |
| 内存集成电路类型 | CONTENT ADDRESSABLE SRAM |
| 内存宽度 | 48 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256X48 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.588 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| AM99C10A-100DC | AM99C10A-70JC | AM99C10A-70RC | AM99C10A-70DC | AM99C10A-100JC | AM99C10A-100RC | |
|---|---|---|---|---|---|---|
| 描述 | Content Addressable SRAM, 256X48, 65ns, CMOS, CDIP28, 0.400 INCH, CERDIP-28 | Content Addressable SRAM, 256X48, 45ns, CMOS, PQCC32, PLASTIC, LCC-32 | Content Addressable SRAM, 256X48, 45ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Content Addressable SRAM, 256X48, 45ns, CMOS, CDIP28, 0.400 INCH, CERDIP-28 | Content Addressable SRAM, 256X48, 65ns, CMOS, PQCC32, PLASTIC, LCC-32 | Content Addressable SRAM, 256X48, 65ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DIP | QFJ | DIP | DIP | QFJ | DIP |
| 包装说明 | DIP, | QCCJ, | DIP, | DIP, | QCCJ, | DIP, |
| 针数 | 28 | 32 | 28 | 28 | 32 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N | N | N |
| 最长访问时间 | 65 ns | 45 ns | 45 ns | 45 ns | 65 ns | 65 ns |
| 其他特性 | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC | LANCAM; BIT/WORD MASKING; MATCH OUTPUT; OPTEMP SPECIFIED AS TC |
| JESD-30 代码 | R-GDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-GDIP-T28 | R-PQCC-J32 | R-PDIP-T28 |
| 长度 | 37.1475 mm | 13.97 mm | 35.2425 mm | 37.1475 mm | 13.97 mm | 35.2425 mm |
| 内存密度 | 12288 bit | 12288 bit | 12288 bit | 12288 bit | 12288 bit | 12288 bit |
| 内存集成电路类型 | CONTENT ADDRESSABLE SRAM | CONTENT ADDRESSABLE SRAM | CONTENT ADDRESSABLE SRAM | CONTENT ADDRESSABLE SRAM | CONTENT ADDRESSABLE SRAM | CONTENT ADDRESSABLE SRAM |
| 内存宽度 | 48 | 48 | 48 | 48 | 48 | 48 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 32 | 28 | 28 | 32 | 28 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256X48 | 256X48 | 256X48 | 256X48 | 256X48 | 256X48 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | DIP | DIP | QCCJ | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.588 mm | 3.55 mm | 5.08 mm | 5.588 mm | 3.55 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 10.16 mm | 11.43 mm | 7.62 mm | 10.16 mm | 11.43 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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