EEPROM,
| 参数名称 | 属性值 |
| Objectid | 7209286327 |
| 包装说明 | TSSOP, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.4 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128KX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |

| RM24C128DS-LTAI-T | RM24C64DS-LSNI-B | RM24C64DS-LMAI-T | RM24C64DS-LSNI-T | RM24C64DS-LTAI-T | RM24C64DS-LTAI-B | RM25C64DS-LSNI-T | RM25C256DS-LSNI-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, | EEPROM, | EEPROM, | EEPROM, | EEPROM, | EEPROM, | IC CBRAM 64K SPI 20MHZ 8SOIC | IC CBRAM 256K SPI 20MHZ 8SOIC |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CBRAM | CBRAM |
| Objectid | 7209286327 | 8326015118 | 7209286359 | 7209286360 | 7209286362 | 7209286361 | - | - |
| 包装说明 | TSSOP, | SOP, | HVSON, | SOP, | TSSOP, | TSSOP, | - | - |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | - | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | - |
| 长度 | 4.4 mm | 4.925 mm | 3 mm | 4.925 mm | 4.4 mm | 4.4 mm | - | - |
| 内存密度 | 131072 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | - | - |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | - |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | - | - |
| 字数 | 131072 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | - | - |
| 字数代码 | 128000 | 64000 | 64000 | 64000 | 64000 | 64000 | - | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 组织 | 128KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | TSSOP | SOP | HVSON | SOP | TSSOP | TSSOP | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - |
| 座面最大高度 | 1.2 mm | 1.75 mm | 0.6 mm | 1.75 mm | 1.2 mm | 1.2 mm | - | - |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | - | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | - | - |
| 端子节距 | 0.65 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 宽度 | 3 mm | 3.9 mm | 2 mm | 3.9 mm | 3 mm | 3 mm | - | - |
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