F-219
SEAM–20–02.0–S–10–2–A–K–TR
SEAM–30–02.0–S–08–2–A–K–TR
SEAM–30–03.5–S–04–2–A–K–TR
(1.27 mm) .050"
SEAM SERIES
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
2.7 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Mates with:
SEAF, SEAFP
Standoffs:
JSO
Up to 500
Pins
(1.12 mm)
.044"
NOMINAL
WIPE
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
Low
insertion/
extraction
forces
Solder
charges
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
OTHER SOLUTIONS
• Up to 560 pins
SEAM
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
K
–A
TR
STANDARDS
• VITA 47
• VITA 57.1 FMC
• VITA 57.4 FMC+
• VITA 74 VNX
• PISMO
™
2
Visit www.samtec.com/standards
for more information.
MATED HEIGHTS
SEAM
SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5 –07.5
–02.0
–03.0
7 mm
8 mm
8 mm
9 mm
8.5 mm 9.5 mm
9.5 mm 10.5 mm
(–10 only available in 04 row)
(-15 is only available in 4 Row
with -02.0 lead style and 10
row with any lead style)
NO. OF
ROWS
–04
–05, –06
–08
–10
–10, –15, – 20,
– 30, –40, –50
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
=Four Rows
(–06.5 not
available)
– 04
– 05
– 06
– 08
– 10
= Tin/Lead Alloy
Solder Charge
–1
–2
= Alignment Pins
(Required. Arrays
will not self-center
on solder pads)
B
(7.06) .278
(9.60) .378
(12.14) .478
(14.68) .578
01
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
=Five Rows
(–06.5 not
available)
= Lead-Free
Solder Charge
= Polyimide film
Pick & Place Pad
–K
=Tape & Reel
– TR
=Six Rows
(–06.5 not
available)
–03.5
8.5 mm 9.5 mm 10 mm 11 mm
–06.5
11.5 mm 12.5 mm 13 mm 14 mm
–07.0
–09.0
–11.0
12 mm
14 mm
16 mm
13 mm 13.5 mm 14.5 mm
15 mm 15.5 mm 16.5 mm
17 mm 17.5 mm 18.5 mm
08
(1.27)
.050
B
=Eight Rows
POWER/SIGNAL
APPLICATION
=Ten Rows
LEAD
STYLE
–02.0
–03.0
–03.5
–06.5
–07.0
No. of positions x (1.27) .050 + (4.98) .196
(1.02)
.040
(1.27)
.050
A
A
(4.60) .181
(5.59) .220
(6.10) .240
(9.14) .360
(9.60) .378
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
(1.02)
.040
(0.86)
(1.12)
(1.27)
.034
.044
.050
DIA
DIA
No. of positions x (1.27) .050 + (3.58) .141
(0.10)
.004
–09.0
(11.60) .457
–11.0
(13.60) .535
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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