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733001

产品描述97SC C511 2% .022DIA 22AWG 24SWG
产品类别工具与设备   
文件大小76KB,共2页
制造商Multicore
标准
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733001概述

97SC C511 2% .022DIA 22AWG 24SWG

733001规格参数

参数名称属性值
类型焊线
成分Sn96.5Ag3Cu0.5(96.5/3/0.5)
直径0.022"(0.56mm)
熔点423°F(217°C)
焊剂类型免清洁
线规23 AWG,24 SWG
工艺无铅
形式线轴,8.8 盎司(250g)
保质期不适用
重量0.55 磅(249.48g)

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Technical Data Sheet
LOCTITE C 511
September
-2014
PRODUCT DESCRIPTION
LOCTITE C 511 provides the following product characteristics:
Technology
Activity
Product Benefits
Cored solder wire
High
● No clean
● Clear residue
● Good wetting
● Fast soldering
● Heat stable
● Mild odor
● Pb-free and SnPb alloys available
ROM1
Soldering - Cored wire
Copper, Brass and Nickel
soldering iron design and the nature of the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux spitting
and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned. Severely
contaminated soldering iron tips should be cleaned with
Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning with
LOCTITE C 511 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron tip
should contact both the base material and the lead at the same
time to heat both surfaces properly. It should take no more than
a fraction of a second to heat both surfaces adequately.
2. Apply LOCTITE C 511 flux cored wire to a part of the joint
surface away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply excessive
solder to the joint as this will not improve joint integrity and it will
leave excess flux residues on the surface.
3. Remove solder from the work piece and then remove the iron tip.
4. The total process will be very rapid, depending upon thermal
mass, tip temperature, tip configuration and the solderability of
the surfaces to be joined.
5. The resin and flux systems are designed to leave relatively low
residues and to minimize residual activity. This is achieved by
ensuring some decomposition and volatilization takes place
during the soldering process
Cleaning:
LOCTITE C 511 flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most industrial
and consumer electronics applications, cleaning will not be
required. The product may, therefore, be used to complement a
no-clean wave soldering or reflow process or to allow repairs to
cleaned boards without the need for a second cleaning process. In
high-reliability applications, the residues should be removed.
Should cleaning be required, this is best achieved using SC-01™
cleaner.
IPC/J-STD-004
Classification
Application
Surface Finishes
LOCTITE C 511 cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
TYPICAL PROPERTIES
Solder Wire - Cored Typical Properties
Alloys - Tin/lead
● SN63
● SN60
● SN62
● 60EN
Alloys - Lead Free
● 96SC (SAC387)
● 97SC (SAC305)
● 99C (SnCu)
● 95A (SnSb)
● 96S (SnAg)
Acid Value
164 to 176 mg KOH/g
Halide content
1.1%
Flux Content (%)
2.7
ALLOYS:
The alloys used in LOCTITE C 511 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
LOCTITE C 511 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor and leave
a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with LOCTITE C 511 does not require any special methods
or deviation from standard hand soldering practices.
Soldering Iron:
● Good results can be obtained using a range of tip temperatures.
However, the optimum tip temperature and heat capacity
required for a hand-soldering process is a function of both
RELIABILITY PROPERTIES
J-STD-004
Solder spread mm²
Corrosion Test
SIR (without cleaning)
IPC-SF-818 Class 3
Bellcore
TR-NWT-000078
Electromigration (without cleaning) Bellcore
TR-NWT-000078
Classification
EN29454-1
IPC-SF-818
340
Pass
Pass
Pass
Pass
1.1.2
MR3CN

 
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