Technical Data | September 2016
3M™ Thermally Conductive Silicone Interface Pad 5549S
3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5549S
is designed to provide a preferential heat transfer
path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5549S
consists of a highly conformable and slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic
particles which provide enhanced thermal conductivity and excellent electrical insulation performance. 3M TCSIP
5549S has permanent PEN film 6 micrometer thick on one side to provide for a non-tacky surface, increased puncture
resistance, ease of handling and rework.
Product Description
Key Features
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Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
Compression relaxation properties reduces pressure to electric components
Slight tack allows pre-assembly
Good wet-ability for improved and lower thermal resistance
Product Construction/Material Description
Note:
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Property
Value
Color
Gray
Base resin
Silicone
Thickness
0.5 – 2.0 mm*
Primary Filler Type
Ceramic
Product Liner
PET Film Liners
*Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M Technical
Representative for more information.
3M™ Thermally Conductive Silicone Interface Pad 5549S
Permanent Polymeric Film Carrier (0.006mm)
Filled Silicone Elastomer
PET Film Liner
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Applications
Integrated circuit (IC) chip packaging heat conduction
Heat sink interface
Chip on film (COF) heat conduction
LED board thermal interface material (TIM)
HD TV IC chip
General gap filling in electronic devices
Application Techniques
3M™ Thermally Conductive Silicone Interface Pad 5549S
Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.
A clean surface can improve the thermal performance of an application.
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Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often
contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More
aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier
contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as
described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
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Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger
pressure to help reduce the potential for air entrapment under the thermal pad during its application.
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Remove the release liner before application.
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Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces
with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts
are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air
entrapment because one of the flexible substrate can conform to the other substrates during application.
Typical Physical Properties and Performance Characteristics
Note:
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Final product specifications and testing methods will be outlined in the products Certificate of Analysis
(COA) that is provided once the product is approved by 3M for general commercialization and development work is completed.
3M™ Thermally Conductive Silicone Interface Pad 5549S
Property
Thermal Conductivity (W/m-K)
b
With Permanent Film
Without Permanent Film
Density (g/cm
3
, @ 25°C)
Operating Temperature Range
Long Term (Weeks-Months)
Short Term (Hours-Days)
Hardness Shore 00
c
Dielectric Breakdown
Volume Resistivity
a
b
Method
a
ASTM D5470
ASTM D6111
3M test method
Modified ASTM D2240
Modified ASTM D149
(3M test method)
ASTM D257
Value
3.5 W/m-K
5 W/m-K
2.8
-50°C to 125°C
-50°C to 180°C
70 ~ 80
3 KV/mm
1.7 x 10
14
Ohms
Methods listed as ASTM are tested in accordance with the ASTM method noted.
Thermal K without permanent film is 5 W/m-K (Based on testing of 3M TCSIP 5549). Effective Thermal K and Thermal Resistance will be somewhat
reduced with the addition of the polymeric film construction of 3M tape 5549S.
c
Shore 00 results depend on test method and thickness of the sample tested. Typical results are in the 70-80 Shore 00 range @ 6 mm test thickness.
Ask 3M for more details on pad softness.
Certificate of Analysis (COA)
The 3M Certificate of Analysis (COA) for this product is established when the product is commercially available from
3M. The COA contains the 3M specifications and test methods for the products performance limits that the product
will be supplied against. The 3M product is supplied to 3M COA test specifications and the COA test methods. Inquire
with 3M for the COA for this product.
The TDS data may contain preliminary data and is not within the COA specification limits and/or test methods that may
be used for COA purposes.
Storage and Shelf Life
3M™ Thermally Conductive Silicone Interface Pad 5549S
The shelf life of
3M™ Thermally Conductive Silicone Interface Pad 5549S
is 24 months from the date of manufacture
when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.
Safety Data Sheet:
Consult Safety Data Sheet before use.
Regulatory:
For regulatory information about this product, contact your 3M representative.
Technical Information:
The technical information, recommendations and other statements contained in this document are based
upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed.
Product Use:
Many factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use and
performance of a 3M product in a particular application Given the variety of factors that can affect the use and performance of a 3M
product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and
suitable for user’s method of application.
Warranty, Limited Remedy, and Disclaimer:
Unless an additional warranty is specifically stated on the applicable 3M product
packaging or product literature, 3M warrants that each 3M product meets the applicable 3M product specification at the time 3M
ships the product. 3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT
LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR
ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the
3M Product does not conform to this warranty, then the sole and exclusive remedy is, at 3M’s option, replacement of the 3M
product or refund of the purchase price.
Limitation of Liability:
Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product,
whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract,
negligence or strict liability.
Electronics Materials Solutions Division
3M Center, Building 224-3N-11
St. Paul, MN 55144-1000
1-800-251-8634 phone
651-778-4244 fax
www.3M.com/electronics
3M is a trademark of 3M Company.
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