CHEMTRONICS
Technical Data Sheet
Chemask
PRODUCT DESCRIPTION
Chemask
is a fast curing peelable solder
masking agent. It contains a high
temperature resistant compound that protects
component-free areas during wave soldering.
Chemask
may be used to protect pins, posts,
contacts and edge connections during
conformal coating processes.
Stable to 515F (268C)
Compatible with rosin, water soluble
fluxes and cleaning solvents
Leaves no residue
Dries tack free in 30 minutes
Non-contaminating
TDS # CM8
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Color
Solvent Stability
Natural latex rubber
Pink
Stable in all Hydrocarbons,
Hydrofluorocarbons, water
and chlorinated solvents
All Types
515F
15 min.
30 min.
20,000-28,000 cps
DI Water
~ 60%
Nonflammable
7.2 lbs.
2 year
Flux Compatibility
Temperature Stability
Tack-Free Drying Time
(10 mils @ 77F)
Cure Time
(10 mils @ 77F)
Viscosity (@ 77F)
( 300 cps)
Viscosity Adjusted With
Solids Content
TYPICAL APPLICATIONS
Chemask
protects:
Component Free Areas for Soldering
Components
Pin Connectors During Soldering
Temperature Sensitive Components
During Wave Soldering
Sockets
Board Areas From Conformal Coating
Flash Point
Weight/Gallon
Shelflife
COMPATIBILITY
Chemask
is generally compatible with most
materials used in printed circuit board
fabrication. As with any solder masking
agent, compatibility with substrate must be
determined on a non-critical area prior to
use.
APPLICATION METHOD
Squeeze Bottle/Syringe
Spatula
Screening
Automatic Dispensing
Removal/Clean-up
Yes
Yes
No
Yes
By Hand
ENVIRONMENTAL IMPACT DATA
ENVIRONMENTAL IMPACT DATA
CFC
0.0%
VOC
3.1%
HCFC
0.0%
HFC
0.0%
Cl. Solv.
0.0%
ODP
0.00
CFC, HCFC, CL. SOLV., VOC, and HFC numbers
shown are the content by weight. Ozone depletion
potential (ODP) is determined in accordance with the
Montreal Protocol and U.S. Clean Air Act of 1990. The
ODP of this product is 0.0. It is the sum of the ODP of
the substances that may contribute to the depletion of
stratospheric ozone, based upon the weight of each
substance in the product’s formulation.
USAGE INSTRUCTIONS
For industrial use only.
Read MSDS carefully prior to use.
Chemask
solder masking agent is
engineered for all electronic manufacturing
applications. When applying by hand using
squeeze bottle or spatula, insure that all areas
of the pretinned hole are evenly covered on
the side to be soldered.
Automatic
dispensing equipment may also be used as
appropriate.
REMOVAL:
After allowing the mask to
become fully cured, peelable solder mask can
be removed by hand or by the use of
tweezers. Depending on ambient conditions,
peelable mask may remain on assemblies for
extended periods of time prior to component
insertion.
AVAILABILITY
CM8
8 oz. Squeeze Bottle
CM8E 236 ml. EU Label Squeeze Bottle
CM1
1 Gal. Liquid
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to
answer your technical and application related
questions. The toll free number is:
1-800-
TECH-401.
NOTE:
This information is believed to be accurate. It is
intended for professional end users having the
skills to evaluate and use the data properly.
CHEMTRONICS does not guarantee the
accuracy of the data and assumes no liability in
connection with damages incurred while using
it.
CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888
REV. G (10/15)
Chemtronics and Chemask are registered trademarks
of Chemtronics. All rights reserved.
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