IC CHARG BATT LI-ON USB 10DFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DFN |
| 包装说明 | VSON, SOLCC10,.12,20 |
| 针数 | 10 |
| 制造商包装代码 | DD |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PDSO-N10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC10,.12,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 0.8 mA |
| 最大供电电压 (Vsup) | 8 V |
| 最小供电电压 (Vsup) | 4.3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |

| LTC4075EDD#PBF | LTC4075EDD#TR | DC867A | LTC4075EDD#TRPBF | LTC4075XEDD#TR | LTC4075XEDD#TRPBF | |
|---|---|---|---|---|---|---|
| 描述 | IC CHARG BATT LI-ON USB 10DFN | IC charg batt LI-ON usb 10dfn | board eval for ltc4075edd | IC CHARG BATT LI-ON USB 10DFN | IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, 0.75 MM HEIGHT, PLASTIC, MO-229WEED-2, DFN-10, Power Management Circuit | IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, 0.75 MM HEIGHT, PLASTIC, MO-229WEED-2, DFN-10, Power Management Circuit |
| 是否Rohs认证 | 符合 | - | - | 符合 | 不符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | - | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DFN | - | - | DFN | SON | SON |
| 包装说明 | VSON, SOLCC10,.12,20 | - | - | VSON, SOLCC10,.12,20 | HVSON, SOLCC10,.12,20 | HVSON, SOLCC10,.12,20 |
| 针数 | 10 | - | - | 10 | 10 | 10 |
| Reach Compliance Code | compliant | - | - | compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | - | - | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PDSO-N10 | - | - | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 |
| JESD-609代码 | e3 | - | - | e3 | e0 | e3 |
| 长度 | 3 mm | - | - | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 |
| 信道数量 | 1 | - | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 10 | - | - | 10 | 10 | 10 |
| 最高工作温度 | 70 °C | - | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | - | - | VSON | HVSON | HVSON |
| 封装等效代码 | SOLCC10,.12,20 | - | - | SOLCC10,.12,20 | SOLCC10,.12,20 | SOLCC10,.12,20 |
| 封装形状 | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | - | - | 260 | 235 | 260 |
| 电源 | 5 V | - | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电流 (Isup) | 0.8 mA | - | - | 0.8 mA | 0.8 mA | 0.8 mA |
| 最大供电电压 (Vsup) | 8 V | - | - | 8 V | 8 V | 8 V |
| 最小供电电压 (Vsup) | 4.3 V | - | - | 4.3 V | 4.3 V | 4.3 V |
| 标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | - | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | - | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 20 | 30 |
| 宽度 | 3 mm | - | - | 3 mm | 3 mm | 3 mm |
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