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Chip Card & Security ICs

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SRF 55V10P

Intelligent 10 Kbit EEPROM

with Contactless Interface compliant to ISO/IEC 15693

and ISO/IEC 18000-3 mode 1

®

Plain Mode Operation

Short Product Information

July 2007

SRF 55V10P Short Product Information

Revision History:

Previous Releases:

Page

Current Version 2007-07-02

2002-07-30

Ref.: SRF55V10P_ShortProductInfo_2007-06.doc

Subjects (changes since last revision)

Editorial changes

Important:

For further information please contact:

Infineon Technologies AG in Munich, Germany,

Chip Card & Security ICs,

Fax +49 (0)89 / 234-955 9372

E-Mail: security.chipcard.ics@infineon.com

Published by Infineon Technologies AG, CC Applications Group

D-81726 München

To our valued customers

We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional

amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If

you find any information that is missing or appears in error, please use the contact section above to inform us. We

appreciate your assistance in making this a better document.

Attention please!

The information herein is given to describe certain components and shall not be considered as warranted

characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding

circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon

Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of

that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices

or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect

human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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SRF 55V10P

Intelligent 10 Kbit EEPROM

with Contactless Interface (ISO/IEC 15693 and ISO/IEC 18000-3 mode 1)

Features

Contactless Interface

•

Physical Interface and Anticollision compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1

—

contactless transmission of data and supply energy

—

carrier frequency: 13.56 MHz

—

data rate up to 26 kbit/s

—

anticollision with identification of up to 30 tags/sec

—

read / write distance up to 150 cm depending on reader antenna configuration

10 Kbit EEPROM

•

ISO mode – block organization of memory

—

up to 248 blocks of user memory (block size 4 bytes)

Custom mode – page organization of memory

—

up to 128 pages of user memory (page size 8 bytes)

Unique chip identification number (UID)

EEPROM programming time per block/page < 4 ms

EEPROM endurance > 100,000 erase/write cycles

1)

Data retention > 10 years

1)

Value Counters: up to 65536

(value range from 0 to 2

16

-1)

—

each page in the User Area is configurable as a Value Counter

support of Anti-Tearing

Electrical characteristics

•

ESD protection minimum 2 kV

•

Ambient temperature –25

…

+70°C (for the chip)

1)

Values are temperature dependent

Short Product Information

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SRF 55V10P

Development Tool

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Evaluation Kit including my-d

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Manager Software

1

Table 1:

Type

Ordering and Packaging information

Ordering Information

Package

1)

Sawn wafer

NiAu bump wafer

2)

Memory

User

Admin.

Pages

Ordering Code

SP000009362

SRF 55V10P C

SRF 55V10P NB

SRF 55V10P MCC2

SRF 55V10P MFCC1 S-MFCC1-2-1

P-MCC2-2-1

1024 bytes 256 bytes

128

SP000294241

SP000010035

SP000009365

For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local

Infineon sales office.

Pin Description

Figure 1: Pin Configuration Module Contactless Card – MFCC1 (top / bottom view)

Figure 2: Pin Configuration Module Contactless Card – MCC2 (top view)

1)

2)

Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic

cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging

FCoS™ Flip Chip on Substrate

Short Product Information

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SRF 55V10P

L

A

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SRF 55V10P

L

B

Figure 3: Pad Configuration Die

Table 2

Symbol

L

A

L

B

Pin Definitions and Functions

Function

Antenna connection

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SRF 55V10P C

SRF 55V10P C概述

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