512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | White Electronic Designs Corporation |
包装说明 | DIMM, |
Reach Compliance Code | unknow |
访问模式 | DUAL BANK PAGE BURST |
最长访问时间 | 0.75 ns |
其他特性 | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX |
JESD-30 代码 | R-XDMA-N240 |
长度 | 67.56 mm |
内存密度 | 536870912 bi |
内存集成电路类型 | DDR DRAM MODULE |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 200 |
字数 | 67108864 words |
字数代码 | 64000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64MX8 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 31.75 mm |
自我刷新 | YES |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.35 mm |
W3EG7264S265BD4 | W3EG7264S-AD4 | W3EG7264S262AD4 | W3EG7264S265AD4 | W3EG7264S335AD4 | W3EG7264S335BD4 | W3EG7264S202AD4 | W3EG7264S202BD4 | W3EG7264S-BD4 | |
---|---|---|---|---|---|---|---|---|---|
描述 | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL | 512MB - 2x32Mx72 DDR ECC SDRAM UNBUFFERED w/PLL |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
厂商名称 | White Electronic Designs Corporation | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | - |
包装说明 | DIMM, | - | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | - |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | - |
访问模式 | DUAL BANK PAGE BURST | - | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | - |
最长访问时间 | 0.75 ns | - | 0.75 ns | 0.75 ns | 0.7 ns | 0.7 ns | 0.75 ns | 0.75 ns | - |
其他特性 | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX | - | AUTO/SELF REFRESH; LG-MAX; WD-MAX | AUTO/SELF REFRESH; LG-MAX; WD-MAX | AUTO/SELF REFRESH; LG-MAX; WD-MAX | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX | AUTO/SELF REFRESH; LG-MAX; WD-MAX | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX | - |
JESD-30 代码 | R-XDMA-N240 | - | R-PBGA-B136 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | - |
长度 | 67.56 mm | - | 67.56 mm | 67.56 mm | 67.56 mm | 67.56 mm | 67.56 mm | 67.56 mm | - |
内存密度 | 536870912 bi | - | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | - |
内存集成电路类型 | DDR DRAM MODULE | - | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | - |
内存宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | - |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
端口数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 200 | - | 200 | 200 | 200 | 200 | 200 | 200 | - |
字数 | 67108864 words | - | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | - |
字数代码 | 64000000 | - | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | - |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
组织 | 64MX8 | - | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | - |
封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
封装代码 | DIMM | - | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | MICROELECTRONIC ASSEMBLY | - | GRID ARRAY, THIN PROFILE, FINE PITCH | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 31.75 mm | - | 35.05 mm | 35.05 mm | 35.05 mm | 31.75 mm | 35.05 mm | 31.75 mm | - |
自我刷新 | YES | - | YES | YES | YES | YES | YES | YES | - |
最大供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
最小供电电压 (Vsup) | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - |
标称供电电压 (Vsup) | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
表面贴装 | NO | - | YES | NO | NO | NO | NO | NO | - |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
端子位置 | DUAL | - | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 6.35 mm | - | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | - |
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