LD6816 series
Ultra low dropout regulators, low noise, 150 mA
Rev. 1 — 28 September 2012
Product data sheet
1. Product profile
1.1 General description
The LD6816 series is a small-size Low DropOut regulator (LDO) family with a typical
voltage drop of 45 mV at 150 mA current rating. Operating voltages can range from 2.3 V
to 5.5 V. The devices are available with fixed output voltages between 1.2 V and 3.6 V.
In disabled mode the LD6816CX4/xxH devices show a high-ohmic state at the output pin,
while the LD6816CX4/xxP and LD6816CX4/CxxP devices contain a pull-down switching
transistor to provide a low-ohmic output state (auto discharge function).
All devices of the LD6816 series are available in a 0.4 mm pitch Wafer-Level Chip-Scale
Package (WLCSP) making them ideal for use in portable applications requiring
component miniaturization. All devices are manufactured in monolithic silicon technology.
1.2 Features and benefits
150 mA output current rating
Input voltage range from 2.3 V to 5.5 V
Fixed output voltage between 1.2 V and 3.6 V
Dropout voltage 45 mV at 150 mA output rating
Low quiescent current in shutdown mode (typical 0.1
A)
30
V
RMS output noise voltage (typical value) at 10 Hz to 100 kHz
Turn-on time < 150
s
55 dB Power Supply Rejection Ratio (PSRR) at 1 kHz
Over-temperature protection
Output current limiter
LD6816CX4/xxH: high-ohmic (3-state) output state when disabled
LD6816CX4/xxP and LD6816CX4/CxxP: low-ohmic output state when disabled (auto
discharge function)
Integrated ESD protection up to 10 kV Human Body Model (HBM)
WLCSP with 0.4 mm pitch and package size of 0.76 mm
0.76 mm
0.47 mm
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (dark green compliant)
1.3 Applications
Analog and digital interfaces requiring lower than standard supply voltages in mobile
appliances such as smart phones, mobile phone handsets and cordless telephones.
Other typical applications are digital still cameras, mobile internet devices, personal
navigation devices and portable media players.
NXP Semiconductors
LD6816 series
Ultra low dropout regulators, low noise, 150 mA
2. Pinning information
2.1 Pinning
bump A1
index area
A
B
001aao107
1
2
transparent top view,
solder balls facing down
Fig 1.
Pin configuration
2.2 Pin description
Table 1.
Symbol
GND
EN
OUT
IN
Pin description
Pin
A1
A2
B1
B2
Description
supply ground
device enable input; active HIGH
regulator output voltage
regulator input voltage
3. Ordering information
Table 2.
Ordering information
Package
Name
LD6816CX4/xxx
WLCSP4
LD6816CX4/CxxP WLCSP4
[1]
Size 0.76 mm
0.76 mm.
Type number
Description
wafer-level chip-scale package; 4 bumps (2
2)
[1]
Version
-
wafer-level chip-scale package with backside coating; -
4 bumps (2
2)
[1]
LD6816_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 28 September 2012
2 of 27
NXP Semiconductors
LD6816 series
Ultra low dropout regulators, low noise, 150 mA
3.1 Ordering options
Further information on output voltage is available on request; see
Section 18 “Contact
information”.
Table 3.
Type number extension of high-ohmic output in WLCSP4
Nominal output
voltage
1.2 V
1.3 V
1.4 V
1.6 V
1.8 V
2.0 V
2.2 V
2.3 V
Type number
LD6816CX4/25H
LD6816CX4/27H
LD6816CX4/28H
LD6816CX4/29H
LD6816CX4/30H
LD6816CX4/33H
LD6816CX4/36H
-
Nominal output
voltage
2.5 V
2.7 V
2.8 V
2.9 V
3.0 V
3.3 V
3.6 V
-
Type number
LD6816CX4/12H
LD6816CX4/13H
LD6816CX4/14H
LD6816CX4/16H
LD6816CX4/18H
LD6816CX4/20H
LD6816CX4/22H
LD6816CX4/23H
Table 4.
Type number extension of pull-down output in WLCSP4
Nominal output
voltage
1.2 V
1.3 V
1.4 V
1.6 V
1.8 V
2.0 V
2.1 V
2.2 V
Type number
LD6816CX4/23P
LD6816CX4/25P
LD6816CX4/27P
LD6816CX4/28P
LD6816CX4/29P
LD6816CX4/30P
LD6816CX4/33P
LD6816CX4/36P
Nominal output
voltage
2.3 V
2.5 V
2.7 V
2.8 V
2.9 V
3.0 V
3.3 V
3.6 V
Type number
LD6816CX4/12P
LD6816CX4/13P
LD6816CX4/14P
LD6816CX4/16P
LD6816CX4/18P
LD6816CX4/20P
LD6816CX4/21P
LD6816CX4/22P
Table 5.
Type number extension of pull-down output in WLCSP4 with backside coating
Nominal output
voltage
1.2 V
1.3 V
1.4 V
1.6 V
1.8 V
2.0 V
2.1 V
2.2 V
Type number
LD6816CX4/C23P
LD6816CX4/C25P
LD6816CX4/C27P
LD6816CX4/C28P
LD6816CX4/C29P
LD6816CX4/C30P
LD6816CX4/C33P
LD6816CX4/C36P
Nominal output
voltage
2.3 V
2.5 V
2.7 V
2.8 V
2.9 V
3.0 V
3.3 V
3.6 V
Type number
LD6816CX4/C12P
LD6816CX4/C13P
LD6816CX4/C14P
LD6816CX4/C16P
LD6816CX4/C18P
LD6816CX4/C20P
LD6816CX4/C21P
LD6816CX4/C22P
LD6816_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 28 September 2012
3 of 27
NXP Semiconductors
LD6816 series
Ultra low dropout regulators, low noise, 150 mA
4. Block diagram
V
IN
V
OUT
R1
V
EN
V
reference
GENERATOR
THERMAL
PROTECTION
OVERCURRENT
PROTECTION
R2
GND
001aan756
Fig 2.
Block diagram of LD6816CX4/xxH
V
IN
V
OUT
R1
V
EN
V
reference
GENERATOR
THERMAL
PROTECTION
R2
OVER CURRENT
PROTECTION
GND
001aan299
Fig 3.
Block diagram of LD6816CX4/xxP and LD6816CX4/CxxP (auto discharge
function)
LD6816_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 28 September 2012
4 of 27
NXP Semiconductors
LD6816 series
Ultra low dropout regulators, low noise, 150 mA
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
IN
P
tot
T
stg
T
j
T
amb
V
ESD
Parameter
voltage on pin IN
total power dissipation
storage temperature
junction temperature
ambient temperature
electrostatic discharge voltage
human body model level 6
machine model class 3
[1]
[2]
[3]
Conditions
4 ms transient
[1]
Min
0.5
-
55
40
40
-
-
Max
+6.0
770
+150
+125
+85
10
400
Unit
V
mW
C
C
C
kV
V
The (absolute) maximum power dissipation depends on the junction temperature T
j
. Higher power dissipation is allowed with lower
ambient temperatures. The conditions to determine the specified values are T
amb
= 25
C
and the use of a two layer Printed-Circuit
Board (PCB).
According to IEC 61340-3-1.
According to JESD22-A115C.
[2]
[3]
6. Recommended operating conditions
Table 7.
Operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol
T
amb
T
j
Pin IN
V
IN
Pin EN
V
EN
Pin OUT
C
L(ext)
[1]
Parameter
ambient temperature
junction temperature
voltage on pin IN
voltage on pin EN
external load capacitance
Conditions
Min
40
-
2.3
0
[1]
Typ
-
-
-
-
1.0
Max
+85
+125
5.5
V
IN
-
Unit
C
C
V
V
F
0.7
See
Section 10.1 “Output capacitor values”.
7. Thermal characteristics
Table 8.
Symbol
R
th(j-a)
[1]
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions
[1][2]
Typ
130
Unit
K/W
The overall R
th(j-a)
can vary depending on the board layout. To minimize the effective R
th(j-a)
, all pins must have a solid connection to
larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a
large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer
connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip.
Use the measurement data given for a rough estimation of the R
th(j-a)
in your application. The actual R
th(j-a)
value can vary in applications
using different layer stacks and layouts.
[2]
LD6816_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 28 September 2012
5 of 27
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