Technical Data
March 2015
3M
™
Thermal Bonding Film 583
Product Description
3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermoplastic bonding film. It can
be heat or solvent activated for bonding. This film can also be lightly crosslinked using a post heat exposure. This
crosslinking will provide additional heat and solvent resistance as well as somewhat higher shear strengths.
3M TBF 583 must be stored at or below 4°C (40°F) for maximum storage life.
Key Features
• Flexible
• Heat or solvent activation
• Can be die-cut
• Slight surface tack
• Heat crosslinkable option
• Lower temperature lamination of the nitrile phenolic film range
Typical Physical Properties
Note:
The following technical information and data should be considered representative or typical only and should not
be used for specification purposes.
Product
Base Resin
Adhesive Thickness
Tack
Color
Construction
3M™ Thermal Bonding Film 583
Nitrile phenolic
2 mil (0.05 mm)
Slight
Brown
2 mil adhesive
3 mil silicone paper liner
Before Crosslinking
Tensile (psi)
Elongation (%)
Modulus (psi)
2 Lb. Dead Load Overlap Shear Heat Resistance
• Tensile and elongation conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638.
• 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).
After Crosslinking
3,140
180
13,800
>149°C (300°F)
400
800
240
71°C (160°F)
3M
™
Thermal Bonding Film 583
Application Equipment Suggestions
Note:
Appropriate application equipment can enhance bonding film performance. We suggest the following equipment
for the user’s evaluation in light of the user’s particular purpose and method of application.
The type of application equipment used to bond 3M™ Thermal Bonding Film 583 will depend on the application involved
and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll
laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using
a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to
a flat or three-dimensional part, a hot shoe or thermode method may be appropriate.
It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions
should be predetermined with substrates specific to user’s application.
Directions For Use – Heat Activation
To make a bond, remove the liner and place the adhesive film between the two substrates. The bond is then made through
heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment.
Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can
then be removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and
pressure. Since 3M TBF 583 has a slight surface tack, in some cases it may be tacked to a substrate with pressure
only (no heat).
Suggested TACKING Conditions
38°C to 49°C (100°F to 120°F) bondline temperature
2-5 seconds dwell time
5-20 psi pressure
For optimum bonding, the heat, pressure and dwell time for using 3M TBF 583 will depend upon the type and thickness
of the substrates being bonded together.
A suggested starting point, however, is to use the bonding conditions described below.
Suggested BEGINNING Bonding Conditions
107°C to 149°C (225°F to 300°F) bondline temperature
2-5 seconds dwell time
15-20 psi pressure
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3M
™
Thermal Bonding Film 583
Directions For Use – Heat Activation
(continued)
One approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series of
bonding temperatures, for example 93, 107, 121, 135 and 149°C (200, 225, 250, 275 and 300°F). Time and pressure will
be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and surfaces
that may be more difficult to bond will require longer times, higher pressures and higher temperatures.
If voids are
experienced in the bondline, they can be minimized by increasing pressure.
Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,
cooling the bondline below 66°C (150°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.
For reference, the following table shows typical bond strengths for bonds made at various temperatures. Such data
can be used to evaluate optimum bondline temperatures.
It is important to note that this table is valid only for the
specific substrates shown.
Varying temperature, pressure, or substrates can affect bond strengths.
User should
develop a similar table with substrates specific to user’s application.
Note:
Temperatures shown are bondline temperatures and not heat block or roll settings!
90° Peel Strengths of Bonds made at Various Temperatures
(2 and 20 sec. Dwell at Bondline Temperature) using 3M™ Thermal Bonding Film 583
Bondline
Temperature
24°C (75°F)
35°C (95°C)
46°C (115°)
57°C (135°F)
68°C (155°F)
79°C (175°F)
90°C (195°F)
101°C (215°F)
113°C (235°F)
124°C (255°F)
135°C (275°F)
146°C (295°F)
157°C (315°F)
168°C (335°F)
179°C (355°F)
FR-4 / Aluminum
2 sec.
20 sec.
9 piw
9 piw
9 piw
10 piw
11 piw
12 piw
13 piw
14 piw
14 piw
12 piw
12 piw
12 piw
11 piw
11 piw
11 piw
9 piw
9 piw
9 piw
10 piw
11 piw
13 piw
14 piw
14 piw
13 piw
12 piw
12 piw
11 piw
11 piw
11 piw
10 piw
CRS / Aluminum
2 sec.
20 sec.
5 piw
6 piw
6 piw
6 piw
7 piw
8 piw
9 piw
11 piw
12 piw
13 piw
12 piw
12 piw
11 piw
10 piw
6 piw
6 piw
6 piw
6 piw
7 piw
9 piw
10 piw
12 piw
14 piw
13 piw
13 piw
12 piw
12 piw
12 piw
11 piw
9 piw
• Peel values given in piw (pounds per inch width). ASTM D1876.
• Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel
(MEK wiped).* Bonds made on Sencorp device using 20 lbs. pressure.
*Note:
When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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3M
™
Thermal Bonding Film 583
Directions For Use – Solvent Activation
There are advantages and disadvantages with heat and solvent activation. Under normal conditions, heat activation is the
suggested method of bonding and will provide the greatest immediate adhesion strength. However, solvents such as MEK,
toluene and/or acetone can also be used to activate bonding if user is working with substrates that are heat-sensitive or
have irregular surface or shape.
*
The solvent may be applied to the film by brushing, wiping, spraying or dipping. It is important that the solvent be allowed
sufficient activating time to solvate the adhesive and bring it to a tacky, pressure sensitive state (typically 10-30 seconds).
Adhesive legs should appear during touch-testing before substrate is bonded. Bonding should occur before tackiness
disappears. If film is too wet, substrate may slip from bonding position; if too dry, a good bond may not develop.
When a solvent activation method is used, maximum adhesion strength will not be achieved immediately because it will
be related to the drying time of solvent from the adhesive. If the bond undergoes natural drying in ambient temperatures,
bond build-up may continue for 30 days until maximum adhesion is achieved. If the bond is exposed to constant low heat
(~66°C/150°F) after initial solvent activation, maximum adhesion can often be reached within 24-30 hours.
*Note:
When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
Directions For Use – Crosslinking
3M™ Thermal Bonding Film 583 may also be slightly crosslinked to enhance adhesion performance. Crosslinking of this
film can typically be achieved by heating the bondline at 177°C (350°F) for five minutes.
Note:
All reported data has not undergone crosslinking unless otherwise stated.
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3M
™
Thermal Bonding Film 583
Typical Performance Characteristics
Note:
The following technical information and data should be considered representative or typical only and should not
be used for specification purposes.
Test Substrate
Adhesion to Various Substrates Using 3M™ Thermal Bonding Film 583
Overlap Shear (OLS)
580 psi
630 psi
640 psi
660 psi
600 psi
500 psi
750 psi
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
NT
90° Peel
10 piw
10 piw
10 piw
10 piw
11 piw
9 piw
11 piw
10 piw
10 piw
10 piw
9 piw
10 piw
10 piw
<1 piw
<1 piw
9 piw
<1 piw
6 piw
7 piw
16 piw
5 piw
3 piw
2 piw
8 piw
Aluminum
(solvent wiped)
Aluminum
(etched)
Aluminum
(sanded, solvent wiped)
Aluminum
(scour pad abraded, solvent wiped)
FR-4
(printed circuit board substrate)
Phenolic Board
Cold Rolled Steel
Stainless Steel
ABS
(acrylonitrile-butadiene-styrene)
Ultem 1000
(polyetherimide)
Soda Lime Glass
PVC
(polyvinyl chloride)
Acrylic
Polypropylene
HDPE
(high density polyethylene)
HIPS
(high intensity polystyrene)
EPDM
(ethylene-propylene-diene monomer rubber)
Neoprene
(Shore A60)
Nitrile
(Shore A60)
SBR
(styrene butadiene resin)
DuPont™ Kapton
®
200E
(polyimide film)
PET
(polyester film)
PEN
(polyethylene naphthalate film)
Denim Fabric
• “NT” represents “Not Tested”.
• OLS values given in psi (pounds per square inch). ASTM D1002. Peel values given in piw (pounds per inch width). ASTM D1876.
• OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
• Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate. Sintech 5/GL peel rate was 2"/minute.
• Solvent wiped (MEK or alcohol)*; 3M™ Scotch-Brite™ Scour Pad (green) abraded; sanded (500 grit sandpaper).
• Samples were bonded on Sencorp device for 5 seconds dwell (+10 seconds ramp time) at 157°C (315°F), 20 pounds pressure.
*Note:
When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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