电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206C271KDRACTU

产品描述CAP CER 270PF 1KV X7R 1206
产品类别无源元件    电容器   
文件大小1MB,共22页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

C1206C271KDRACTU在线购买

供应商 器件名称 价格 最低购买 库存  
C1206C271KDRACTU - - 点击查看 点击购买

C1206C271KDRACTU概述

CAP CER 270PF 1KV X7R 1206

C1206C271KDRACTU规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称KEMET(基美)
包装说明CHIP, ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time4 weeks
电容0.00027 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.6 mm
JESD-609代码e3
长度3.2 mm
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, EMBOSSED PLASTIC, 7/13 INCH
正容差10%
额定(直流)电压(URdc)1000 V
尺寸代码1206
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度1.6 mm

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC
(Commercial Grade)
Overview
KEMET’s High Voltage surface mount MLCCs in X7R
Dielectric feature a 125°C maximum operating temperature
and are considered “temperature stable.” The Electronics
Industries Alliance (EIA) characterizes X7R dielectric as
a Class II material. Components of this classification
are fixed, ceramic dielectric capacitors suited for
bypass and decoupling applications or for frequency
discriminating circuits where Q and stability of capacitance
characteristics are not critical. X7R exhibits a predictable
change in capacitance with respect to time and voltage
and boasts a minimal change in capacitance with reference
to ambient temperature. Capacitance change is limited to
±15% from −55°C to +125°C.
Available in a variety of case sizes and industry leading
CV values (capacitance/voltage), these devices exhibit
low leakage current and low ESR at high frequencies.
Conventional uses include both snubbers and filters
in applications such as switching power supplies and
lighting ballasts. Their exceptional performance at
high frequencies has made high voltage MLCC's the
preferred dielectric choice of design engineers worldwide.
In addition to their use in power supplies, these capacitors
are widely used in industries related to automotive
(hybrid), telecommunications, medical, military, aerospace,
semiconductors and test/diagnostic equipment.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC-Q200 qualification requirements.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
1210
C
154
K
C
Rated
Voltage
(VDC)
C = 500
B = 630
D = 1,000
F = 1,500
G = 2,000
Z = 2,500
H = 3,000
R
Dielectric
R = X7R
A
Failure
Rate/Design
A = N/A
C
Termination Finish
1
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options
Table"
Case Size
Specification/
Capacitance Capacitance
Ceramic
(L" x W")
Series
Code (pF)
Tolerance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1
C = Standard
Two
significant
digits and
number of
zeros.
J = ±5%
K = ±10%
M = ±20%
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1010_X7R_HV_SMD • 7/31/2018
1
寻找ARM7平台C开发人员
我朋友自己公司的一个自行车出租管理系统,现在数据库管理这一块已经完成,手持式终端这一块的功能没有人做,朋友开价8万,要求在年后系统可以运行,不知道有没有人感兴趣?手持式终端这边的设 ......
tunersys ARM技术
LED芯片制造设备现状及其工艺介绍
 一、上游外延片生长设备国产化现状   LED产业链通常定义为上游外延片生长、中游芯片制造和下游芯片封装测试及应用三个环节。从上游到下游行业,进入门槛逐步降低,其中LED产业链上游外延生 ......
探路者 电源技术
如何用万用表测出双向晶闸管的三个极
双向晶闸管除了一个电极G仍然叫控制极外,另外两个电极通常不再叫阳极和阴极,而统称为主电极T1和T2。双向晶闸管是一种N-P-N-P-N型5层结构的半导体,其符号和内部结构图见图1-1。 用万用表区分 ......
fighting 模拟电子
【MSP430 编译器使用经验】+IAR软件仿真与算法优化
本帖最后由 tianshuihu 于 2014-8-13 00:11 编辑 从接触单片机以来先后使用了Keil、IAR、CodeWarrior、CCS、Atmel studio...各种开发环境,各有优缺点 经过时间的洗礼,总的来说对Keil和IAR ......
tianshuihu 微控制器 MCU
TI电源参考设计集锦 - 23例参考设计文档下载
1、用于 USB 电池充电器的同步升压 (5V®4A) DC/DC 控制器 NexFET™ 功率 MOSFET CSD16340Q3 能够使功率转换中损耗降至最低,并针对 5V 门极驱动应用进行了优化。 立即下载4331.slpr0 ......
qwqwqw2088 模拟与混合信号
蓝牙耳机的设计考虑因素[多图]
为了快速设计出能给最终用户带来愉悦体验的蓝牙耳机产品,就需要考虑蓝牙芯片、蓝牙协议栈与耳机配置软件、软硬件开发套件、参考设计、互操作性测试和本地技术支持等多种因素,本文对这些设计考 ......
tmily 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1691  1937  1895  445  1772  54  40  13  35  26 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved