(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated V
R
, T
J
= 25°C)
Symbol
V
RRM
V
RWM
V
R
I
O
I
FRM
I
FSM
T
stg
, T
C
T
J
dv/dt
Value
30
Unit
V
2.0
4.0
40
−55
to +175
−55
to +125
10,000
A
A
A
°C
°C
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Lead (Note 1)
Thermal Resistance,
Junction−to−Ambient (Note 1)
Symbol
R
qJL
R
qJA
Value
18.6
135
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
see Figure 2
Maximum Instantaneous Reverse Current (Note 2)
see Figure 4
(V
R
= 30 V)
(V
R
= 15 V)
(I
F
= 2.0 A)
(I
F
= 4.0 A)
V
F
T
J
= 25°C
0.50
0.60
T
J
= 25°C
1
0.31
T
J
= 125°C
0.45
0.63
T
J
= 125°C
75
35
V
I
R
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Minimum pad size (0.108″ X 0.085″) for each lead on FR4 board.
2. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2.0%.
I
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
i
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
10
1
1
T
J
= 125°C
0.1
T
J
= 125°C
100°C
25°C
−55°C
100°C
25°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
V
F
, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS230L, NRVBS230L
100E−3
I
R
, REVERSE CURRENT (AMPS)
10E−3
1E−3
T
J
= 125°C
T
J
= 100°C
I
R
, MAXIMUM REVERSE CURRENT (AMPS)
100E−3
T
J
= 125°C
T
J
= 100°C
10E−3
1E−3
T
J
= 25°C
100E−6
10E−6
1E−6
T
J
= 25°C
100E−6
0
5
10
15
20
25
30
10E−6
0
5
10
15
20
25
30
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
20
40
60
80
100
120
140
T
C
, CASE TEMPERATURE (°C)
SQUARE WAVE
Ipk/Io =
p
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
P
FO
, AVERAGE POWER DISSIPATION (WATTS)
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Maximum Reverse Current
dc
FREQ = 20 kHz
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
0.5
1.0
1.5
2.0
2.5
Ipk/Io = 20
Ipk/Io = 10
Ipk/Io =
p
Ipk/Io = 5.0
SQUARE
WAVE
dc
T
J
= 125°C
3.0
3.5
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating Per Leg
Figure 6. Forward Power Dissipation Per Leg
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
1
R
qJ
Lead = 18.6
0.1
R
qJ
Ambient = 150
0.01
0.001
0.0001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 7. Thermal Response
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3
MBRS230L, NRVBS230L
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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