电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

RCP0603B18R0GET

产品描述RES SMD 18 OHM 2% 1.5W 0603
产品类别无源元件   
文件大小93KB,共4页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 全文预览

RCP0603B18R0GET概述

RES SMD 18 OHM 2% 1.5W 0603

RCP0603B18R0GET规格参数

参数名称属性值
电阻值18 Ohms
容差±2%
功率(W)1.5W
成分厚膜
特性防潮
温度系数±150ppm/°C
工作温度-55°C ~ 155°C
封装/外壳0603(1608 公制)
供应商器件封装603
大小/尺寸0.063" 长 x 0.032" 宽(1.60mm x 0.81mm)
高度 - 安装(最大值)0.023"(0.58mm)
端子数2

文档预览

下载PDF文档
RCP
www.vishay.com
Vishay Dale
Thick Film Chip Resistors, Industrial, High Power,
Aluminum Nitride Substrate
FEATURES
• Thick film resistive element on an aluminum
nitride (AlN) substrates
• Very high thermal conductivity in a small
package size
• Termination: tin / lead wraparound termination
over nickel barrier. Also available with
lead (Pb)-free wraparound terminations.
Aluminum nitride
over 3 x more power - same size
• Capability to develop specific reliability
programs designed to customer requirements
• Operating temperature range: -65 °C to +155 °C
• High frequency performance to 6 GHz
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Available
Available
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Termination
Solder finish
Ruthenium oxide
Epoxy
Aluminum nitride
Solder-coated nickel barrier
Pure tin or tin / lead solder alloy
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
RCP0505
RCP0603
RCP1206
RCP2512
CASE
SIZE
0505
0603
1206
2512
POWER RATING
(1)
(Standard
Board Mount)
P
25 °C
W
1.4
1.5
2.4
3.5
POWER RATING
(1)
(Active
Temperature
Control)
W
5.0
3.9
11
22
MAXIMUM
WORKING
VOLTAGE
V
PxR
PxR
PxR
PxR
RESISTANCE
RANGE
10 to 2K
10 to 2K
10 to 2K
10 to 2K
TOLERANCE
±%
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
TEMPERATURE
COEFFICIENT
± ppm/°C
150
150
150
150
Notes
• Consult factory for availability of additional case sizes
(1)
The power rating depends on the maximum temperature of the resistive element. The temperature of the resistive element and adjacent
materials will rise due to the power dissipation of the resistor. The majority of this heat/energy is dissipated by conduction through the
substrate, terminations, solder joints, and printed circuit board. The maximum power rating in a particular application only applies if the
temperature of the resistive element is maintained at or below 155 °C
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: RCP1206W100RGWB (preferred part numbering format)
R
GLOBAL
MODEL
RCP0505
RCP0603
RCP1206
RCP2512
C
P
1
2
0
6
W
1
0
0
R
G
W
B
SPECIAL
Blank = standard
(dash number)
(up to 3 digits)
from
1 to 999
as
applicable
BOTTOM TERM.
W
= wide
B
= traditional
RESISTANCE
VALUE
R=
K = k
10R0
= 10
1K30
= 1.3 k
TOLERANCE
CODE
F
=±1%
G
=±2%
J
=±5%
PACKAGING CODE
TP
= tin / lead, T/R (full reel)
S3
= tin / lead, T/R (1000 pieces)
WB
= tin / lead, tray
S2
= tin / lead, T/R (500 pieces)
S6
= tin / lead, T/R (300 pieces)
EA
= lead (Pb)-free, T/R (full reel)
EB
= lead (Pb)-free, T/R (1000 pieces)
ET
= lead (Pb)-free, tray
EC
= lead (Pb)-free, T/R (500 pieces)
ED
= lead (Pb)-free, T/R (300 pieces)
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543)
Revision: 10-Mar-17
Document Number: 31098
1
For technical questions, contact:
ff2aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
内核加载
本人现有北京微芯力的一个实验箱,CPU是inter Xscale PXA 255,板子原带的是windows CE 系统,现在我想装载linux 内核,但是配套的资料中没有相关的介绍,在这里想请教一下高手们,装载linux 前 ......
user8786 嵌入式系统
定制WinCE镜像时串口驱动中当中怎样设置串口的波特率
现在有个问题,定制WinCE镜像启动后,串口无法使用,经过检查驱动正确的加载了,但是串口无法使用,硬件也没问题,问了实习公司做硬件的他们说波特率设置不对。现在想在驱动当中修改波特率,但 ......
cs_0104 嵌入式系统
锂电池转1.5V干电池。
本帖最后由 雨后的梧桐 于 2016-8-13 11:47 编辑 5号电池无处不在,玩具、生活电器、门禁等等,其带给我们便携的同时,也留下很多困扰:- 玩具等高耗电应用中需频繁更换电池;- 废旧电池处理 ......
雨后的梧桐 模拟与混合信号
ZSTACK中OTA升级程序问题
Zstack里OTA的HAL_OTA_DL和HAL_OTA_RC是什么意思,指的是待更新设备和协调器吗?Image指的是镜像文件吗? /***************************************************************************** ......
喵星人の马甲 51单片机
转到linux下做PCB
下载地址 ed2k://|file|Base_SPB155.md5|418|099FDAFDC400AF42FB67BC5BF0F48709|h=5Y6IRQQV4GZALBQ6WM6K2TJ4TWKC7PTR|/ ed2k://|file|Base_SPB155_license.lic|4417|9B199204E91D2EDDB92F735 ......
wheel Linux开发
关于arm嵌入式系统的usb驱动
本人是菜鸟 想学这方面的东西,但没有基础 请各位大侠推荐几本好书 谢谢!...
tunersys ARM技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1797  939  31  840  1488  4  45  44  35  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved