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LTC4308CMS8#PBF

产品描述IC ACCELERATOR I2C HOTSWAP 8MSOP
产品类别电源/电源管理    电源电路   
文件大小164KB,共16页
制造商Linear ( ADI )
官网地址http://www.analog.com/cn/index.html
标准
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LTC4308CMS8#PBF概述

IC ACCELERATOR I2C HOTSWAP 8MSOP

LTC4308CMS8#PBF规格参数

参数名称属性值
Brand NameLinear Technology
是否Rohs认证符合
厂商名称Linear ( ADI )
零件包装代码MSOP
包装说明TSSOP,
针数8
制造商包装代码MS8
Reach Compliance Codecompliant
ECCN代码EAR99
可调阈值NO
模拟集成电路 - 其他类型POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码S-PDSO-G8
JESD-609代码e3
长度3 mm
湿度敏感等级1
信道数量1
功能数量1
端子数量8
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3 mm

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FEATURES
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LTC4308
Low Voltage, Level Shifting
Hot Swappable 2-Wire Bus
Buffer with Stuck Bus Recovery
DESCRIPTION
The LTC
®
4308 hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corrup-
tion of the data and clock busses. The LTC4308 provides
bidirectional buffering, keeping the backplane and card
capacitances isolated. Negative offset from output to
input allows communication between output bus devices
with high V
OL
and devices on the low voltage input side,
where bus supplies can be as low as 0.9V. If SDAOUT or
SCLOUT are low for 30ms, the LTC4308 will automati-
cally break the Input-Output connection. At this time the
LTC4308 automatically generates up to 16 clock pulses
on SCLOUT in an attempt to free the bus. A connection
will resume if the stuck bus is cleared.
During insertion, the SDAOUT and SCLOUT lines are pre-
charged to 1V to minimize bus disturbances. When driven
high, the ENABLE input allows the LTC4308 to connect after
a stop bit or bus idle condition. Driving ENABLE low breaks
the connection between SDAIN and SDAOUT, SCLIN and
SCLOUT. READY is an open-drain output which indicates
that the backplane and card sides are connected.
L,
LT, LTC and LTM are registered trademarks of Linear Technology Corporation. Hot Swap
is a trademark of Linear Technology Corporation. All other trademarks are the property of their
respective owners. Protected by U.S. Patents including 7032051, 6650174, 6356140.
Optimized for Low Voltage Systems Down to 0.9V
Bidirectional Buffer with Stuck Bus Recovery
–200mV Offset In-Out/+300mV Offset Out-In
30ms Stuck Bus Timeout
Compatible with Non-Compliant V
OL
I
2
C Devices
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
±6kV Human Body Model (HBM) ESD Protection
Isolates Input SDA and SCL Lines from Output
Compatible with I
2
C™, I
2
C Fast Mode and SMBus
READY Open-Drain Output
1V Precharge on SDAOUT and SCLOUT Lines
Small 8-Lead (3mm × 3mm × 0.75mm) DFN and
8-Lead MSOP Packages
APPLICATIONS
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Live Board Insertion
Servers
Capacitance Buffer/Bus Extender
RAID Systems
ATCA
TYPICAL APPLICATION
The LTC4308 in a 1.2V
Microcontroller Application
1.2V
0.01μF
2.7k
2.7k
10k
2.7k
2.7k
5V
1.2V to 5V Level Shifting
SDAOUT
2V/DIV
CH1
V
CC
LTC4308
SCLIN
SCLOUT
CARD_SCL
SDAIN
0.5V/DIV
CH2
MICRO-
CONTROLLER
SDAIN
ENABLE
SDAOUT
CARD_SDA
4308 TA01a
READY
GND
READY
1μs/DIV
4308 TA01b
4308f
1

LTC4308CMS8#PBF相似产品对比

LTC4308CMS8#PBF LTC4308IMS8#PBF LTC4308CDD#TRPBF LTC4308CMS8#TRPBF LTC4308CDD#PBF LTC4308IDD#PBF LTC4308IDD#TRPBF LTC4308IMS8#TRPBF
描述 IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
零件包装代码 MSOP MSOP DFN MSOP DFN DFN DFN MSOP
包装说明 TSSOP, TSSOP, HVSON, TSSOP, HVSON, HVSON, HVSON, TSSOP,
针数 8 8 8 8 8 8 8 8
制造商包装代码 MS8 MS8 DD MS8 DD DD DD MS8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
可调阈值 NO NO NO NO NO NO NO NO
模拟集成电路 - 其他类型 POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码 S-PDSO-G8 S-PDSO-G8 S-PDSO-N8 S-PDSO-G8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 S-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
长度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
湿度敏感等级 1 1 1 1 1 1 1 1
信道数量 1 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8
最高工作温度 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP HVSON TSSOP HVSON HVSON HVSON TSSOP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 1.1 mm 0.8 mm 1.1 mm 0.8 mm 0.8 mm 0.8 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING NO LEAD GULL WING NO LEAD NO LEAD NO LEAD GULL WING
端子节距 0.65 mm 0.65 mm 0.5 mm 0.65 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
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