Eccosorb®MFS
High-Loss, Non-Rigid, Magnetically Loaded Stock
HIGH-LOSS NON-RIGID ABSORBER
Eccosorb MFS is a high-loss stock based on silicone. This product was developed to
overcome the physical limitations of rigid high-loss absorbers. Being flexible, Eccosorb MFS
can be fitted to compound curves. It has low outgassing properties for space applications.
FEATURES AND BENEFITS
•
Flexible structure for improved fit
•
Low outgassing for space applications
•
Good adhesion to metals during t° cycling
due to elastomeric properties
MARKETS
•
Commercial Telecom
•
Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
Frequency Range
Service Temperature °C (°F)
Density g/cc
Hardness, Shore A
Volume Resistivity ohm-cm
Thermal Expansion per °C
Thermal Conductivity W/mK
Water Absorption % 24 Hours
Dielectric Strength volts/mil
ECCOSORB MFS
1 – 18 GHz
<160 (< 320)
4.15 – 4.3
>70
10
10
-6
63 x 10
0.865
<0.1
>10
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
APPLICATIONS
•
Eccosorb MFS is engineered for terminations, loads, attenuators in microwave circuits,
and in waveguides and transmission systems.
•
It can be bonded to low-expansion-coefficient ceramics, such as sintered ferrites.
AVAILABILITY
•
Eccosorb MFS is available in two types, Eccosorb® MFS-117 and Eccosorb® MFS-124
•
Sheets: 30.5cm x 30.5cm (12” x 12” ) in thicknesses of 0.32cm (1/8”), 0.64cm (1/4”),
1.27cm (1/2”) & 2.54cm (1.0”)
•
Bars: 30.5cm long (12”) in squares of 0.64, 1.27, 2.54 cm (1/4, 1/2, 1.0”).
•
It can be supplied with a Pressure Sensitive Adhesive (PSA).
•
Available in other thicknesses, sizes, and customer specified shapes upon request
INSTRUCTION FOR USE
•
Can be cut with a sharp knife, sawed, sanded, and ground to form pyramids, cones and
other machines parts. Magnetic holding devices can be used for machine operations.
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Eccosorb®MFS
TEMPERATURE CYCLING
Many rigid materials cannot be bonded to metal surfaces and then temperature cycled.
Temperature changes break this bond. This is due to the difference in the thermal
expansion coefficient between the metal and the load material. Since Eccosorb MFS is a
true elastomer, it deforms slightly to accommodate dimensional changes. In addition, a
pyramid or wedge of Eccosorb MFS can be bonded over a large area to a waveguide wall to
improve heat dissipation.
Typical Electrica l Properties
GHz
MFS-117
K'
tan δ
d
K"
M'
tan δ
m
M"
dB/cm
dB/in
lZl/Z
0
MFS-124
K'
tan δ
d
K"
M'
tan δ
m
M"
dB/cm
dB/in
lZl/Z
0
10
- 7
195
0.18
35
5
0
0
0
0
0.16
260
0.4
104
7
0
0
0
0
0.16
10
- 6
158
0.21
33
5
0
0
0
0
0.18
205
0.39
80
6.9
0
0
0
0
0.18
10
- 5
120
0.23
28
5
0
0
0
0
0.2
145
0.36
52
6.8
0
0
0
0
0.21
10
- 4
85
0.24
20
5
0
0
0
0
0.24
95
0.31
29
6.7
0
0
0
0
0.26
10
- 3
62
0.22
14
5
0
0
0
0
0.28
70
0.26
18
6.6
0
0
0
0
0.3
10
- 2
48
0.18
8.6
5
0
0
0.03
0.08
0.32
52
0.2
1
6.3
0
0
0.03
0.08
0.34
10
- 1
38
0.12
4.6
4.8
0.1
0.48
0.27
0.69
0.36
40
0.14
5.6
6
0.2
1.2
0.48
1.2
0.39
1.0
28
0.09
2.5
4.1
0.2
0.82
2.8
7.1
0.39
32
0.08
2.6
5
0.45
2.3
6.5
16.51
0.42
3.0
22.9
0.06
1.4
3.4
0.39
1.33
11
28
0.4
25.8
0.07
1.8
3.8
0.69
2.62
20
50
0.42
8.6
21.4
0.02
0.42
1.2
1.36
1.63
46
117
0.3
23.8
0.05
1.19
2.5
1.1
2.75
63
160
0.39
10.0
21
0.02
0.42
1.1
1.5
1.7
56
142
0.31
23.6
0.03
0.71
1.5
1.4
2.1
67
170
0.33
18.0
20.6
0.02
0.41
1
2
2
119
302
0.33
23
0.04
0.92
1
2.5
2.5
149
378
0.34
*Note: Attenuation is a theoretical property calculated from the Complex Permittivity and Complex Permeability of a lossy material and is
strictly a means of comparing one absorbing material to another. The attenuation properties are not an indication of how the material will
perform inside a microwave device. The frequencies of use recommended for Eccosorb
®
MFS-117 & Eccosorb
®
MFS-124 in the Typical
Properties Table of this bulletin are based on application experience at Laird.
Typical Electrical Properties Legend
K'
tan δ
d
K"
M'
tan δ
m
M"
dB/cm
dB/in
lZl/Z
0
Real part of the permittivity (dielectric constant)
Dielectric loss tangent
Imaginary part of the permittivity (loss)
Real part of the magnetic permeability
Magnetic loss tangent
Imaginary part of the magnetic permeability (loss)
Attenuation per unit distance
Attenuation per unit distance
Normalized impedance magnitude ratio
RFP-DS-MFS 100915
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the
end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be
the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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