Model 60N50TP
Flanged Termination
60 Watts, 50
General Specifications
Resistive Element
Substrate
Cover
Mounting flange
Leads
Thick film
Aluminum nitride ceramic
Alumina Ceramic
Copper, nickel plated per QQ-N-290
99% pure silver (.005” thick)
Electrical Specifications
Features:
•
DC – 3 GHz
•
60 Watts
•
AlN Ceramic
•
Non-Nichrome Resistive
Element
•
Low VSWR
•
100% Tested
Resistance Range:
Frequency Range;
Power:
VSWR
50 ohms, ± 5%
DC – 3.0 GHz
60 Watts
1.25:1 DC – 3.0 GHz
Note:
Tolerance is
±0.010”,
unless otherwise specified. Designed to meet of
exceed applicable portions of MIL-E-5400. Operating temperature is -55ºC to
150ºC (see chart for derating temperatures).
All dimensions in inches.
Specifications subject to change with out notice.
Outline Drawing
60N50TP (097) Rev A
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model 60N50TP
Typical Performance:
Power De-rating:
Mounting Footprint and Procedure:
.025 MIN.
(2 PLACES)
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE: NONE
NOT RECOMMENDED APPLICATION
SCALE: NONE
SUGGESTED MOUNTING PROCEDURES:
1.
2.
3.
4.
MAKE SURE THAT THE DEVICES ARE MOUNTED ON
FLAT SURFACES (.001" UNDER THE DEVICE) TO
OPTIMIZE THE HEAT TRANSFER.
DRILL & TAP THE HEATSINK FOR THE APPROPRIATE
THREAD SIZE TO BE USED.
COAT HEATSINK WITH A MINIMUM AMOUNT OF HIGH
QUALITY SILICONE GREASE (.001" MAX. THICKNESS).
POSITION DEVICE ON MOUNTING SURFACE & SECURE
USING SOCKET HEAD SCREWS, FLAT & SPLIT WASHER.
TORQUE SCREWS TO THE APPROPRIATE VALUE. MAKE
SURE THAT THE DEVICE IS FLAT AGAINST THE HEATSINK.
(CARE SHOULD BE TAKEN TO AVOID UPWARD PRESSURE OF
THE LEADS TOWARDS THE LID).
SOLDER LEADS IN PLACE USING APPROPROATE SOLDER WITH
A CONTROLLED TEMPERATURE IRON.
** FOR MORE DETAILS CONTACT FACTORY **
5.
60N50TP (097) Rev A
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
嵌入式系统
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