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SMBJ5339B/TR13

产品描述DIODE ZENER 5.6V 5W SMBJ
产品类别分立半导体    二极管   
文件大小397KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

SMBJ5339B/TR13概述

DIODE ZENER 5.6V 5W SMBJ

SMBJ5339B/TR13规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Microsemi
包装说明R-PDSO-J2
Reach Compliance Codeunknown
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-214AA
JESD-30 代码R-PDSO-J2
JESD-609代码e0
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.38 W
标称参考电压5.6 V
表面贴装YES
技术ZENER
端子面层TIN LEAD
端子形式J BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流220 mA

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SMBJ5333B thru SMBJ5388B
Available
Surface Mount Silicon 5 Watt
Zener Diodes
DESCRIPTION
The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection
from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number.
It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical
characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS
compliant matte-tin finish. This J-bend design (SMBJ) in the DO-214AA allows for greater PC
board mounting density. These plastic encapsulated Zeners have a moisture classification of
“Level 1” with no dry pack required. Microsemi also offers numerous other Zener products to
meet higher and lower power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-214AA
J-Bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to JEDEC registered 1N5333 thru 1N5388 series.
Ideal for high-density and low-profile mounting.
Zener voltage available 3.3 V to 200 V.
Plus/minus 10%, 5% and 2% voltage tolerances are available.
(See
part nomenclature
block.)
RoHS compliant versions available.
Also available in:
DO-215AA Package
(Gull-wing surface mount)
SMBG5333 – SMBG5388
T-18 Package
(axial-leaded)
1N5333 – 1N5388
APPLICATIONS / BENEFITS
Regulates voltage over broad operating current and temperature ranges.
Wide selection from 3.3 to 200 V.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses.
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) with adequate heat sinking.
Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
(1)
Thermal Resistance Junction-to-Ambient
o (2)
Off-State Power Dissipation @ 25 C
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
25
90
5.0
1.2
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
pad layout).
2. 5 watts at T
L
< 25
o
C, or 1.38 watts at T
A
= 25
º
C when mounted on FR4 PC board with recommended
footprint (also see
Figure 1).
T4-LDS-0246-2, Rev. 1 (120180)
©2012 Microsemi Corporation
Page 1 of 5
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