RA = 10 μ" [0.25 μm] gold with matte tin tails (RIA E1 & C1 apply)
RB = 30 μ" [0.76 μm] gold with matte tin tails (RIA E1 & C1 apply)
Contact Quantity Code:
(see table)
TS-0815-E
Sheet 2 of 2
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnectors.com
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在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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