1
2
3
4
5
6
7
8
0.61 0.07
7312P0235A13LF
3.6
A
0.8
0.9 0.05
SECTION
A-A
SCALE 10:1
R0.
3
LEAD FREE CATALOGUE NUMBER
A
0
2
-0.1
(2x)
4.3
20.32
3.94
(1.2 )
0.01
+0.1
0
(1.8 )
0.14
B
12.8
13.9
DESCRIPTION
Connector especially designed for SMT technology
EMV compatible and in accordance with ISO 7816-2
MECHANICAL
Contacts force : between 0.2N-0.5N
Durability : 100000 cycles
Insertion force : 10N max
Extraction force : 3N min
ELECTRICAL
Insulation resistance : 1000MOhms
Dielectric withstand voltage between card contacts
and detection switch : 1000 Vrms
contact resistance:100 miliohms
Current carrying : min 10 microA max 1A
SWITCH
Contact closed : contact resistance 100mOhms
Open contact : voltage proof 300Vms
B
20
A
R1
STOP CARD
33.68 0.2
32.1 0.2
21.6 0.2
15.1
C
C
25.4 0.1
5.1 0.1
C
10.16
B
29.2 0.2
0.1 B
(21.8 )
D
A
0.8 0.05
0.2 C
2.54
2.54
5.08
E
17.78
A
54.3 0.05
Copyright FCI.
MATERIAL
Contacts : copper alloy
Plating : Gold / Equivalent PdNi over Nickel on contact area
Solder talls : Sn bare edge allowed
Housing : self extinguishing, Thermoplastic
UL94-V0 rated
ENVIRONMENT
Storage temperature : -40 C, +85 C
Operating temperature : -20 C, +70 C
Packaging : Tray
Compatible reflow soldering process
D
1 0.05
0.2 C
Pick and place area
26.35
E
=57.8 =
0.1 A
SCALE
2:1
surface
--
tolerance std
ISO 406
ISO 1101
projection
www.fciconnect.com
Dr
ISO 1302
mm
Scale
3:1
TOLERANCES UNLESS OTHERWISE SPECIFIED
LEGRAND
TISSERAND
RAMESH P K
SUDHIR V
title
1996/08/26
1996/08/26
2007/02/26
2007/02/26
F
ltr
A
B
C
D
E
F
G
REV F - 2006-04-17
ecn no
LS2030
--
dr
PRI
--
date
2002/04/26
--
2005/06/08
2005/06/30
2006/12/12
2008/03/07
2009/10/30
Eng
Chr
Appr
ANGULAR
0
2
0.X
0.3
0.1
0.05
size
LINEAR
0.XX
0.XXX
A2
ECN
F
--
Rev.
I09-0239
LS05-0047 LGO
LS05-0059 HLE
LS06-0206 HLE
I08-0035 RPK
I09-0239 RPK
Product family
MOBILE I/O Spec ref
dwg no
CHIP CARD CONNECTOR
TYPE : P02 (16cts with cover)
7312P0235A13
VJW53665
CUSTOMER
sheet
1 of 2
F
catalog no
1
2
3
4
5
6
7
PDM: Rev:G
STATUS:
Released
8
Printed: Oct 29, 2011
.
1
LEAD FREE CATALOGUE NUMBER
7312P0235A13LF
A
2
3
4
5
6
7
8
A
44.45
22.86
2.54
1.9
1.2
0.1
5.74
2.84
20
R1
8.2
B
8.69
12.8
B
2.1
+0.1
(2x)
0
20.32
3.28
=26 =
1.9
0.05
1.4
0.1
C
C
(33.68)
=21.8 =
(32.1 )
(24.26 )
13
2.54
17.78
1.9
5.08
SCALE
3:1
D
PCB LAYOUT
(RECOMMENDED)
D
E
13.09
6.8
21.86
19.78
NOTE: RoHS INFORMATIONS
-The "LF" products meet European Union Directives and other
country regulations as described in GS-22-008.
- The housing will withstand exposure to 260 c peak temperature
for 30 seconds in a convection, infra-red or vapor reflow oven.
See Application notes/procedures, if they are available.
- Packaging spec: see GS-14-920
E
Copyright FCI.
(5.24 for information)
surface
--
tolerance std
ISO 406
ISO 1101
projection
www.fciconnect.com
Dr
ISO 1302
mm
Scale
4:1
TOLERANCES UNLESS OTHERWISE SPECIFIED
LEGRAND
TISSERAND
RAMESH P K
SUDHIR V
title
1996/08/26
1996/08/26
2007/02/26
2007/02/26
F
LAYOUT FOR KEEP OUT ZONE
(CONNECTOR SIDE)
Eng
Chr
Appr
ANGULAR
0
2
0.X
0.3
0.1
0.05
size
LINEAR
0.XX
0.XXX
A2
ECN
F
--
Rev.
I09-0239
Product family
MOBILE I/O Spec ref
dwg no
CHIP CARD CONNECTOR
TYPE : P02 (16cts with cover)
7312P0235A13
VJW53665
CUSTOMER
sheet
2 of 2
F
catalog no
REV F - 2006-04-17
1
2
3
4
5
6
PDM: Rev:G
STATUS:
Released
8
Printed: Oct 29, 2011
.
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