Technical Data Sheet
LOCTITE LF 318D
May
-2016
PRODUCT DESCRIPTION
LOCTITE LF 318D provides the
characteristics:
Technology
Application
Solder paste
Pb-free soldering
DIRECTIONS FOR USE
Printing:
1. LOCTITE LF 318D is available for stencil printing down to 0.4mm
(0.016") pitch QFP devices, with type 3 (AGS) powder.
2. Printing at speeds between 25mm/s (1.0"/s) and 150mm/s (6"/s)
can be achieved by using laser cut and electro-polished, electro-
formed stencils, metal squeegees (preferably 60°).
3. LOCTITE LF 318D is suitable for use in enclosed head printing
systems.
Reflow:
1. Any of the available methods of heating to cause reflow may be
used including IR, convection, hot belt, vapor phase and laser
soldering.
2. LOCTITE LF 318D is not sensitive to reflow profile type.
3. No single reflow profile is deemed suitable for all processes and
applications, but the following example profiles have given good
results in practice.
Profile 1:
following
product
LOCTITE LF 318D is a halide-free, no clean, low voiding Pb-free
solder paste, which has excellent humidity resistance and a broad
process window both for printing and reflow . This product has a high
tack force to resist component movement during high speed placement
and long printer abandon times. LOCTITE LF 318D shows excellent
solderability over a wide range of reflow profiles in both air and
nitrogen across a wide range of surface finishes including Ni/Au,
Immersion Sn, Immersion Ag and OSP copper.
FEATURES AND BENEFITS
●
●
●
●
●
Long print abandon time even on small CSP apertures
Colorless residues for easy post-reflow inspection
Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)
Suitable for enclosed head printing
Halide-free flux classification: ROL0 to ANSI/J-STD-004
TYPICAL PROPERTIES
Based on Type 3 powder
Solder Paste Typical Properties
Alloys
97SC
Powder Particle Size, µm
20 to 45
Powder Size Coding
AGS
IPC Equivalent
Type 3
Metal Loading (Weight %)
89.0
Slump, J-STD-005, mm
RT, 15 minutes
0.06
0.33 x 2.03 mm pads
0.33
0.63 x 2.03 mm pads
150°C, 15 minutes
0.2
0.33 x 2.03 mm pads
0.33
0.63 x 2.03 mm pads
Brookfield Viscosity TF spindle, 25°C, 5rpm after 855,000
2 minutes, mPa∙s
Thixotropic Index (Ti), 25°C
0.54
(Ti = log(viscosity @ 1.8s
-1
/ viscosity @ 18s
-1
)
Malcom Rheology, 10rpm, 25°C, Rate 6s
-1
2,020
-
Initial tack force,g mm ²
1.5
Useful open time, hours
>24
Solder Powder:
Careful control of the atomisation process for production of solder
powders for LOCTITE LF 318D solder pastes ensures that the solder
powder is produced to a quality level that exceeds J-STD-006 and EN
29453 requirements for sphericity, size distribution, impurities and
oxide levels.
Profile 2:
TDS LOCTITE LF 318D, May-2016
Cleaning:
1. LOCTITE LF 318D solder pastes are no-clean and are designed
to be left on the PCB in many applications post-assembly since
they do not pose a hazard to long-term reliability.
2. Residue removal can be achieved using conventional cleaning
processes based on solvents such as MCF800 or suitable
saponifying agents.
3. For stencil cleaning and cleaning board misprints, LOCTITE MSC
01 solvent cleaner is recommended.
RELIABILITY PROPERTIES
Solder Paste Medium:
LOCTITE LF 318D medium includes a stable resin system with slow
evaporating solvents and minimal odor. The formulation has been
tested to the requirements of the Telcordia (formerly known as
Bellcore) GR-78-CORE and ANSI/J-STD-004 for a type ROL0
classification specification.
Test
Copper Plate Corrosion
Copper Mirror Corrosion
Chlorides & Bromides
Surface Insulation
Resistance (without
cleaning)
Flux Activity Classification
(without cleaning)
Specification
ANSI/J-STD-004
ANSI/J-STD-004
ANSI/J-STD-004
ANSI/J-STD-004
Telcordia GR-78-Core
JIS-Z-3248
ANSI/J-STD-004
Results
Pass
Pass
Pass
Pass
Pass
Pass
ROL0
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
µm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing,
Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits.
The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere.
®
denotes a trademark
registered in the U.S. Patent and Trademark Office.
STORAGE AND SHELF LIFE
Storage:
It is recommended to store LOCTITE LF 318D at 0 to 10°C. (NB
cartridges should be stored tip down to prevent the formation of air
pockets). The paste should be removed from cold storage a minimum
of 4 hours before use. Do not use forced heating methods to bring
solder paste up to temperature. LOCTITE LF 318D has been
formulated to minimize flux seperation on storage but should this
occur, gentle stirring for 15 seconds will return the product to it's
correct rheological performance. To prevent contamination of unused
product, do not return any material to its original container.
Shelf Life:
Provided LOCTITE LF 318D is stored tighly sealed in its original
container at 0 to 10°C, a minimum shelf life of 183 days can be
expected. Air shipment is recommended to minimize the time the
containers are exposed to higher temperatures.
DATA RANGES
The data contained herein may be reported as a typical value and/or a
range. Values are based on actual test data and are verified on a
periodic basis.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Not for Product Specifications
The technical information contained herein is intended for reference
only. Please contact Henkel Technologies Technical Service for
assistance and recommendations on specifications for this product.
Reference 0.1
Americas
Europe
Asia
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+32.1457.5611
+86.21.3898.4800
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