IC DAC 12BIT MULT 18-DIP
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DIP |
包装说明 | DIP, DIP18,.3 |
针数 | 18 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.5.B |
MX7521LN+ | MX7521UQ | MX7521JN+ | MX7521KN+ | MX7520LN+ | MX7520J/D-T | MX7521J/D-T | |
---|---|---|---|---|---|---|---|
描述 | IC DAC 12BIT MULT 18-DIP | IC DAC 12BIT MULT 18-DIP | IC DAC 12BIT MULT 18-DIP | IC DAC 10BIT MULT 16-DIP | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, DIE-16 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, DIE-18 | |
是否无铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIE | DIE |
包装说明 | DIP, DIP18,.3 | DIP-18 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP16,.3 | DIE, | DIE, |
针数 | 18 | 18 | 18 | 18 | 16 | 16 | 18 |
Reach Compliance Code | compliant | not_compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A001.A.5.B | 3A001.A.2.C | EAR99 | 3A001.A.5.B | - | - | - |
转换器类型 | - | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | - | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | - | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输入格式 | - | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | - | R-GDIP-T18 | R-PDIP-T18 | - | R-PDIP-T16 | R-XUUC-N16 | R-XUUC-N18 |
JESD-609代码 | - | e0 | e3 | - | e3 | e0 | e0 |
最大线性误差 (EL) | - | 0.05% | 0.2% | - | 0.05% | 0.2% | 0.2% |
位数 | - | 12 | 12 | - | 10 | 10 | 12 |
功能数量 | - | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | - | 18 | 18 | - | 16 | 16 | 18 |
最高工作温度 | - | 125 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | - | DIP | DIP | - | DIP | DIE | DIE |
封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | IN-LINE | - | IN-LINE | UNCASED CHIP | UNCASED CHIP |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
标称安定时间 (tstl) | - | 0.5 µs | 0.5 µs | - | 0.5 µs | 0.5 µs | 0.5 µs |
标称供电电压 | - | 15 V | 15 V | - | 15 V | 15 V | 15 V |
表面贴装 | - | NO | NO | - | NO | YES | YES |
技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | - | MILITARY | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Matte Tin (Sn) | TIN LEAD | TIN LEAD |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD | NO LEAD |
端子位置 | - | DUAL | DUAL | - | DUAL | UPPER | UPPER |
峰值回流温度(摄氏度) | - | - | 260 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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