DATASHEET
BOARD LEVEL COOLING – Bond On 2292
Board Level Cooling – Bond On 2292
Device Type
Leadless Chip Carriers, Flat Packs
and 68 position
Bond On 2292 is a circular board level heat sink designed to cool Leadless
Chip Carriers, Flat Packs, and 68 position devices. Representative image
only.
ORDERING INFORMATION
Part Number
2292BG
HEAT SINK DETAILS
Property
Material
Finish
Device Attachment Options
Thermal Interface Material
Details
Aluminum
Black Anodize
Epoxy
Epoxy
Property
Heat Sink Width (mm)
Heat Sink Length (mm)
Heat Sink Height (mm)
Heat Sink Mounting Direction
Details
28.58
28.58
9.14
Horizontal, Vertical
MECHANICAL & PERFORMANCE
Drawing dimensions are shown in mm, (in)
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com