SBSG
Surface Mount EMI Filters
C
L1
L2
W
T
B1
B2
4.55 ± 0.25
(0.179 ± 0.010)
4.70 ± 0.4
(0.185 ± 0.015)
3.20 ± 0.2
(0.126 ± 0.008)
2.50 ± 0.15
(0.098 ± 0.006)
1.50 ± 0.4
(0.059 ± 0.015)
0.30 ± 0.25
(0.012 ± 0.010)
Pi
4.55 ± 0.25
(0.179 ± 0.010)
5.25 ± 0.4
(0.207 ± 0.015)
3.20 ± 0.2
(0.126 ± 0.008)
2.50 ± 0.15
(0.098 ± 0.006)
1.50 ± 0.4
(0.059 ± 0.015)
0.30 ± 0.25
(0.012 ± 0.010)
Type
Chip Size
Max Current
Rated
Voltage
50Vdc
Dielectric
C0G/NP0
X7R
100Vdc
C0G/NP0
X7R
200Vdc
C0G/NP0
X7R
500Vdc
C0G/NP0
X7R
SBSGC
1812
10A
SBSGP
1812
5A
Minimum and maximum
capacitance values
-
220nF
-
100nF-150nF
-
68nF
-
1nF-47nF
-
220nF
-
100nF-150nF
-
68nF
-
1nF-47nF
Effects of mounting method on insertion loss
C and Pi filters are mounted to PCBs and soldered in identical manner to chip capacitors. Solder connections made to each end (signal lines) and
each side band (earth track).
Whilst SBSG, SBSM and SBSP filters can be mounted conventionally on PCBs, they are also suitable for mounting in a wall or partition on a board.
This greatly improves the screening between filter input and output, thereby enhancing the high frequency response.
The following insertion loss curves (for SBSP, SBSG, SBSM Pi filters), based on actual measurements, show the effect. It can be seen that the filters
conventionally mounted (Fig. 1) exhibit a drop in attenuation at higher frequencies. Improved shielding methods (Fig. 2), maintain excellent
suppression characteristics to 1GHz and above. See below for application example.
Syfer Technology Ltd.
Old Stoke Road, Arminghall
Norwich, Norfolk, NR14 8SQ
United Kingdom
Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com
SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13
Page 1 of 3
Insertion loss tables for surface mount EMI filters - C filter
Typical No-Load Insertion Loss (dB)*
Approximate
Resonant
Frequency
(MHz)
186
147
130
110
100
80
62.5
50
39
33
28
23
19
15.5
13
Product Code
Packing
Capacitance
(±20%)
Dielectric
Rated
Voltage
(dc)
100MHz
0.1MHz
10MHz
1MHz
DWV
(dc)
SBSGC5000102MX
SBSGC5000152MX
R = Tape-and-Reel (330mm / 13” reels)
T = Tape-and-Reel (178mm / 7” reels)
SBSGC5000222MX
SBSGC5000332MX
SBSGC5000472MX
B = Bulk Packed
SBSGC5000682MX
SBSGC5000103MX
SBSGC5000153MX
SBSGC5000223MX
SBSGC5000333MX
SBSGC5000473MX
SBSGC2000683MX
SBSGC1000104MX
SBSGC1000154MX
SBSGC0500224MX
1.0nF
1.5nF
2.2nF
3.3nF
4.7nF
6.8nF
10nF
15nF
22nF
33nF
47nF
68nF
100nF
150nF
220nF
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
500
500
500
500
500
500
500
500
500
500
500
200
100
100
050
750
750
750
750
750
750
750
750
750
750
750
500
250
250
125
0
0
0
0
0
0
0
0
0
1
2
3
5
8
11
0
0
0
1
2
4
5
8
11
14
17
20
23
27
30
5
8
11
14
17
20
24
27
32
34
36
37
41
47
49
23
27
32
34
40
38
38
38
39
39
39
39
39
39
39
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
* - Insertion Loss performance quoted is measured on an open board mounted on a brass backplane in a 50Ω system. Performance curves can be supplied on request. Performance in
circuit is liable to be different and is affected by board material, track layout, grounding efficiency and circuit impedances. Shielding can be used to improve high frequency
performance.
Insertion loss tables for surface mount EMI filters - Pi filter
Typical No-Load Insertion Loss (dB)*
Approximate
Resonant
Frequency
(MHz)
140
100
75
54
44
35
28
23
19
15
12
10
7.5
6
5.2
Product Code
Packing
Capacitance
(±20%)
Dielectric
Rated
Voltage
(dc)
100MHz
0.1MHz
10MHz
1MHz
DWV
(dc)
SBSGP5000102MX
SBSGP5000152MX
R = Tape-and-Reel (330mm / 13” reels)
T = Tape-and-Reel (178mm / 7” reels)
SBSGP5000222MX
SBSGP5000332MX
SBSGP5000472MX
B = Bulk Packed
SBSGP5000682MX
SBSGP5000103MX
SBSGP5000153MX
SBSGP5000223MX
SBSGP5000333MX
SBSGP5000473MX
SBSGP2000683MX
SBSGP1000104MX
SBSGP1000154MX
SBSGP0500224MX
1.0nF
1.5nF
2.2nF
3.3nF
4.7nF
6.8nF
10nF
15nF
22nF
33nF
47nF
68nF
100nF
150nF
220nF
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
500
500
500
500
500
500
500
500
500
500
500
200
100
100
050
750
750
750
750
750
750
750
750
750
750
750
500
250
250
125
0
0
0
0
0
0
0
0
0
1
2
3
5
8
11
0
0
0
1
2
3
5
8
10
12
14
16
17
20
25
5
8
10
15
17
23
28
35
43
46
53
55
56
58
58
39
41
39
39
39
39
39
39
39
39
39
39
39
39
39
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
* - Insertion Loss performance quoted is measured on an open FR4 board mounted on a brass backplane in a 50Ω system. Performance curves can be supplied on request. Performance in circuit is liable to
be different and is affected by board material, track layout, grounding efficiency and circuit impedances. Shielding can be used to improve high frequency performance.
SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13
Page 2 of 3
1GHz
1GHz
Ordering Information
SBS
Type
Surface
mount board
filter
G
Size
G
= 1812
P
Configuration
C
= C section
P
= Pi Section
500
Rated Voltage
050 = 50Vdc
100 = 100Vdc
200 = 200Vdc
500 = 500Vdc
0473
Capacitance in Pico farads (pF)
First digit is 0.
Second and third digits are significant
figures of capacitance code. The fourth
digit is number of zeros following.
Example:
0473
= 47nF
M
Tolerance
M = ±20%
X
Dielectric
X = X7R
T
Packaging
T=178mm
(7”) reel
R=330mm
(13”) reel
B = Bulk
Reeled Quantities
178mm (7”) reel
1812
500
330mm (13”) reel
1812
2000
Surface mount and panel mount solder-in filters
Solder pad layouts are included with the detailed information
for each part.
Recommended soldering profile
260°C. For SBSG, SBSM and SFSS ranges, solder time should
be minimised, and the temperature controlled to a maximum
of 220°C. For SFSR, SFST and SFSU ranges the maximum
temperature is 250°C.
Cooling to ambient temperature should be allowed to occur
naturally. Natural cooling allows a gradual relaxation of
thermal mismatch stresses in the solder joints. Draughts
should be avoided. Forced air cooling can induce thermal
breakage, and cleaning with cold fluids immediately after a
soldering process may result in cracked filters.
Note: The use of FlexiCap™ terminations is strongly
recommended to reduce the risk of mechanical cracking.
Soldering to axial wire leads
Soldering temperature
The tip temperature of the iron should not exceed 300°C.
Dwell time
Dwell time should be 3-5 seconds maximum to minimise the
risk of cracking the capacitor due to thermal shock.
Heat sink
Where possible, a heat sink should be used between the solder
joint and the body, especially if longer dwell times are
required.
Bending or cropping of wire leads
Bending or cropping of the filter terminations should not be
carried out within 4mm (0.157”) of the epoxy encapsulation,
the wire should be supported when cropping.
A more comprehensive application note covering
installation of all Syfer products is available on the
Syfer website.
Soldering of filters
The soldering process should be controlled such that the filter
does not experience any thermal shocks which may induce
thermal cracks in the ceramic dielectric.
The pre-heat temperature rise of the filter should be kept to
around 2°C per second. In practice successful temperature
rises tend to be in the region of 1.5°C to 4°C per second
dependent upon substrate and components.
The introduction of a soak after pre-heat can be useful as it
allows temperature uniformity to be established across the
substrate thus preventing substrate warping. The magnitude
or direction of any warping may change on cooling imposing
damaging stresses upon the filter.
E01, E03, E07 SBSP ranges are compatible with all standard
solder types including lead-free, maximum temperature
SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13
Page 3 of 3
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