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LTC4304IMS#TRPBF

产品描述IC ACCELERATR I2C HOTSWAP 10MSOP
产品类别模拟混合信号IC    驱动程序和接口   
文件大小620KB,共16页
制造商Linear ( ADI )
官网地址http://www.analog.com/cn/index.html
标准
下载文档 详细参数 选型对比 全文预览

LTC4304IMS#TRPBF概述

IC ACCELERATR I2C HOTSWAP 10MSOP

LTC4304IMS#TRPBF规格参数

参数名称属性值
Brand NameLinear Technology
是否Rohs认证符合
厂商名称Linear ( ADI )
零件包装代码MSOP
包装说明TSSOP, TSSOP10,.19,20
针数10
制造商包装代码MS
Reach Compliance Codecompliant
ECCN代码EAR99
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-PDSO-G10
JESD-609代码e3
长度3 mm
湿度敏感等级1
功能数量1
端子数量10
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP10,.19,20
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源3/5 V
认证状态Not Qualified
座面最大高度1.1 mm
最大压摆率8 mA
最大供电电压5.5 V
最小供电电压2.7 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3 mm

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FEATURES
LTC4304
Hot Swappable 2-Wire
Bus Buffer with Stuck
Bus Recovery
DESCRIPTIO
The LTC
®
4304 hot swappable 2-wire bus buffer allows I/O
card insertion into a live backplane without corruption of
the data and clock busses. When a connection is made,
the LTC4304 provides bidirectional buffering, keeping the
backplane and card capacitances isolated. If SDAOUT or
SCLOUT is low for ≥30ms (typ), the LTC4304 automatically
breaks the data and clock bus connection and FAULT will
pull low. At this time the LTC4304 automatically generates
up to 16 clock pulses on SCLOUT in an attempt to free the
bus. A connection will be enabled automatically when the
bus becomes free. A logic low on the ACC input enables
the LTC4304’s rise-time accelerators. A logic high on ACC
disables the rise-time accelerators, which allows SDA and
SCL bus pull-up voltages below V
CC
.
During insertion, the SDA and SCL lines are precharged
to 1V to minimize bus disturbances. When driven high,
ENABLE allows the LTC4304 to connect after a stop bit or
bus idle occurs. Driving ENABLE low breaks the connection
between SDAIN and SDAOUT, SCLIN and SCLOUT. READY
is an open drain output that indicates when the backplane
and card sides are connected together.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 6356140, 6650174, 7032051.
Automatic Disconnect of SDA/SCL Lines when Bus
is Stuck Low for ≥30ms
Fault Flag for Stuck Bus
Recovers Stuck Busses with Automatic Clocking*
Bidirectional Buffer* for SDA and SCL Lines
Increases Fanout
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
Allows Bus Pullup Voltages Above and Below V
CC
±15kV Human Body Model ESD Protection
Isolates Input SDA and SCL Lines from Output
Compatible with I
2
C
TM
, I
2
C Fast-Mode and SMBus
Standards (Up to 400kHz Operation)
READY Open Drain Output
1V Precharge on All SDA and SCL Lines
High Impedance SDA, SCL Pins for V
CC
= 0V
ENABLE Gates Connection from Input to Output
MSOP 10-Pin and DFN (3mm
×
3mm) Packages
Hot Board Insertion
Servers
Capacitance Buffer/Bus Extender
RAID Systems
APPLICATIO S
TYPICAL APPLICATIO
5V 3.3V
10k
BACK_SCL
10k
0.01µF
10k
V
CC
LTC4304
SCLIN
SCLOUT
CARD_SCL
SDAIN
5V/DIV
SDAIN
BACK_SDA
FAULT
3.3V
100k
ENABLE
GND
READY
ACC
4304
TA01
10k
SDAOUT
5V/DIV
SDAOUT
CARD_SDA
SCLOUT
5V/DIV
FAULT
5V/DIV
BACKPLANE
CONNECTOR
STAGGERED
CONNECTOR
CARD
4304fa
U
U
U
Stuck Bus Resolved with
Automatic Clocking
STUCK LOW > 30ms
RECOVERS
DISCONNECT AT TIMEOUT
AUTOMATIC CLOCKING
200
m
s/DIV
4304 TA01b
1

LTC4304IMS#TRPBF相似产品对比

LTC4304IMS#TRPBF LTC4304CDD#PBF LTC4304IMS#PBF LTC4304IDD#PBF LTC4304CDD#TRPBF LTC4304CMS#TRPBF LTC4304IDD#TRPBF LTC4304CMS#PBF
描述 IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
零件包装代码 MSOP DFN MSOP DFN DFN MSOP DFN MSOP
包装说明 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20
针数 10 10 10 10 10 10 10 10
制造商包装代码 MS DD MS DD DD MS DD MS
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-PDSO-G10 S-PDSO-N10 S-PDSO-G10 S-PDSO-N10 S-PDSO-N10 S-PDSO-G10 S-PDSO-N10 S-PDSO-G10
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
长度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
湿度敏感等级 1 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1 1
端子数量 10 10 10 10 10 10 10 10
最高工作温度 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP HVSON TSSOP HVSON HVSON TSSOP HVSON TSSOP
封装等效代码 TSSOP10,.19,20 SOLCC10,.12,20 TSSOP10,.19,20 SOLCC10,.12,20 SOLCC10,.12,20 TSSOP10,.19,20 SOLCC10,.12,20 TSSOP10,.19,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260
电源 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 0.8 mm 1.1 mm 0.8 mm 0.8 mm 1.1 mm 0.8 mm 1.1 mm
最大压摆率 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING NO LEAD GULL WING NO LEAD NO LEAD GULL WING NO LEAD GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
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