ELLIPTICAL FIN HEAT SINK
908 Series
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up
to devices from
Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Pow
erex, Infineon, Microsemi, and many more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many
more Industries.
Material:
AL 6063
Finish:
Black Anodize
PART #
908-35-1-12-2-B-0
908-35-1-15-2-B-0
908-35-1-18-2-B-0
908-35-1-21-2-B-0
908-35-1-23-2-B-0
908-35-1-28-2-B-0
908-35-1-33-2-B-0
HEIGHT
(mm)
12
15
18
21
23
28
33
CHIP SIZE
(mm)
35
35
35
35
35
35
35
NATURAL
CONVECTION
11.1 C/W
10.58 C/W
10.06 C/W
9.53 C/W
8.75 C/W
7.93 C/W
7.11 C/W
FORCED CONVECTION (C/W)
200 LFM 400 LFM
600 LFM
3.07 C/W
2.79 C/W
2.54 C/W
2.35 C/W
2.13 C/W
1.94 C/W
1.69 C/W
2.07 C/W
1.87 C/W
1.69 C/W
1.52 C/W
1.35 C/W
1.19 C/W
1.02 C/W
1.64 C/W
1.46 C/W
1.27 C/W
1.15 C/W
1.01 C/W
.86 C/W
.72 C/W
THERMAL PERFORMANCE:
4
908-35-1-12-2-B-0
3.5
908-35-1-15-2-B-0
3
C/ Watt
908-35-1-18-2-B-0
2.5
908-35-1-21-2-B-0
2
908-35-1-23-2-B-0
1.5
1
0.5
200 LFM
400 LFM
Forced Convection
Series
Chip Size
Construction
Height
Chip Height
Finish
Interface
908-35-1-28-2-B-0
908-35-1-33-2-B-0
600 LFM
19-
19
21
23
27
908-
29
31
33
35
37.5
40
1-
12-
12 = 11.6
15 = 14.6
18 = 17.6
21 = 20.6
1-
1 = .9-2.1
2 = 2.2-3.4
B-
1
0 = None
1 = T725
1= Eliptical
Fin
23 = 22.6
28 = 27.6
33 = 32.6
B = BLK
ANO
T h e r m a l
C o o l i n g
S o l u t i o n s
f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
ELLIPTICAL FIN HEAT SINK
908 Series
Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and
the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.
Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage
chip. Contact area is the edge of chip.
ASSEMBLY INSTRUCTION:
Step 1:
Hook the
clip under one
side of the BGA
chip set.
Step 2:
Rotate
assembly down
until opposite
side clip engages
substrate edge of
BGA chip set.
Step 3:
Make sure
the sop rods are
clearing from edges
of BGA chip set.
Step 4:
Press firmly
down to make sure
clips fully engage
edges of chip set.
Heat Sink should not
move around easily.
Random Vibration Test
Frequency
：5
Hz to 500 Hz
Acceleration
：3.13
grms
P.S.D
：0.01
g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis
：X,
Y, Z axis
Test Time
：10
mins (Each axis)
Total Test Time
：30
mins
T h e r m a l
C o o l i n g
S o l u t i o n s
SHOCK TEST SPECIFICATION：
Wave Form
：Half
sine wave
Acceleration
：50
g
Duration Time
：11
ms
No. of Shock
：Each
axis 3 times
Shock Direction
：±X,
±Y, ±Z axis
Reliability & Communication
Testing Instruments
f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
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