VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
High Precision Foil Wraparound Surface Mount Chip Resistor with
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm)
FEATURES
•
Temperature coefficient of resistance (TCR):
± 2.0 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.) (see table 1)
•
Tolerance: to ± 0.01 %
•
Power rating: to 400 mW at + 70 °C
•
Load life stability: to ± 0.01 % at 70 °C, 2000 h
at rated power
•
Resistance range: 10
Ω
to 125 kΩ (for higher and lower
values, please contact us)
•
Vishay Foil resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1K2345 vs. 1K)
•
Fast thermal stabilization < 1 s
•
Electrostatic discharge (ESD) up to 25 000 V
•
Short time overload:
≤
0.01 %
•
Non inductive, non capacitive design
•
Rise time: 1 ns effectively no ringing
•
Current noise: - 42 dB
•
Voltage coefficient < 0.1 ppm/V
•
Non inductive: < 0.08 µH
•
Non hot spot design
•
Terminal finishes available: lead (Pb)-free, tin/lead alloy
•
Compliant to RoHS directive 2002/95/EC
•
Matched sets are available per request
•
Prototype quantities available in just 5 working days
or sooner. For more information, please contact
foil@vishaypg.com
•
For better performances please review
VSMP
and
VFCP
Series datasheets
Top View
INTRODUCTION
Bulk Metal
®
Foil (BMF) technology out-performs all other
resistor technologies available today for applications that
require high precision and high stability, and allows
production of customer oriented products designed to satisfy
challenging and specific technical requirements.
The BMF provides an inherently low and predictable
Temperature Coefficient of Resistance (TCR) and excellent
load life stability for high precision analog applications.
Model VSM offers low TCR, excellent load life stability, tight
tolerance, excellent shelf life stability, low current noise and
low voltage coefficient, all in the same resistor.
The VSM has a full wraparound termination which ensures
safe handling during the manufacturing process, as well as
providing stability during multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us using the e-mail address in the footer below.
APPLICATIONS
•
•
•
•
•
Automatic test equipment (ATE)
High precision instrumentation
Laboratory, industrial and medical
Audio
EB applications (electron beam scanning and recording
equipment, electron microscopes)
•
Down hole instrumentation
•
Communication
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)
(- 55 °C to + 125 °C, + 25 °C Ref.)
RESISTANCE
VALUE
(Ω)
250 to 125K
100 to < 250
50 to < 100
25 to < 50
10 to < 25
TOLERANCE
(%)
± 0.01
± 0.02
± 0.05
± 0.1
± 0.25
TYPICAL TCR AND
MAX. SPREAD
(ppm/°C)
±2±2
±2±3
±2±3
±2±4
±2±6
FIGURE 1 - POWER DERATING CURVE
Percent of Rated Power
- 55 °C
100
75
50
25
0
- 75
+ 70 °C
Note
(1)
For tighter performances and non-standard values up to 150K,
please contact Vishay application engineering using the e-mail
address in the footer below.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 63070
Revision: 25-Mar-10
- 50
- 25
0
+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
For any questions, contact:
foil@vishaypg.com
www.foilresistors.com
1
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
FIGURE 3 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
(For more Details, see Table 1)
+ 150
+ 100
Interloop Capacitance
Reduction in Series
Current Path
Before Trimming
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Δ
R
+ 50
± 2 ppm/°C
(+ 25 °C reference)
0
R
(ppm)
- 50
- 100
- 150
- 200
- 50
- 25
0
+ 25
+ 50
+ 75
+ 100 + 125
- 55
Ambient Temperature (°C) and TCR Chord Slopes for
Different Temperature Ranges
Mutual Inductance
Reduction due
to Change in
Current Direction
Note:
Foil shown in
black,
etched spaces in
white
Note
• The TCR values for < 100
Ω
are influenced by the termination
composition and result in deviation from this curve.
TABLE 2 - DIMENSIONS AND LAND PATTERN
in Inches (Millimeters)
Top View
L
X
T
D
CHIP SIZE
0805
1206
1506
2010
2512
L
± 0.005 (0.13)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
W
± 0.005 (0.13)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.23)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
Z
(1)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
G
(1)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
X
(1)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
Recommended Land Pattern
Footprint
W
Z
G
Note
(1)
Land pattern dimensions are per IPC-7351A
TABLE 3 - SPECIFICATIONS
CHIP SIZE
0805
1206
1506
2010
2512
RATED POWER (mW)
at + 70 °C
100
150
200
300
400
MAX. WORKING VOLTAGE
(≤
P
×
R
)
28 V
61 V
78 V
145 V
220 V
RESISTANCE RANGE
(Ω)
10 to 8K
10 to 25K
10 to 30K
10 to 70K
10 to 125K
MAXIMUM WEIGHT
(mg)
6
11
12
27
40
TABLE 4 - PERFORMANCES
MIL-PRF-55342
CHARACTERISTIC E
ΔR
LIMITS
Thermal Shock, 100 x (- 65 °C to + 150 °C)
± 0.1 %
Low Temperature Operation, - 65 °C, 45 min at P
nom
± 0.1 %
Short Time Overload, 6.25 x Rated Power, 5 s
± 0.1 %
High Temperature Exposure, + 150 °C, 100 h
± 0.1 %
Resistance to Soldering Heat
± 0.2 %
Moisture Resistance
± 0.2 %
Load Life Stability + 70 °C for 2000 h at Rated Power
± 0.5 %
TEST OR CONDITIONS
Note
(1)
As shown + 0.01
Ω
to allow for measurement errors at low values.
www.foilresistors.com
2
For any questions, contact:
foil@vishaypg.com
Document Number: 63070
Revision: 25-Mar-10
TYPICAL
ΔR
LIMITS
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
MAXIMUM
ΔR
LIMITS
(1)
± 0.02 % (200 ppm)
± 0.02 % (200 ppm)
± 0.02 % (200 ppm)
± 0.03 % (300 ppm)
± 0.01 % (100 ppm)
± 0.03 % (300 ppm)
± 0.01 % (100 ppm)
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
FIGURE 4 - RECOMMENDED MOUNTING
(1)(2)(3)
25
%
to
85 %
of T
A low profile solder fillet is
recommended to avoid
unnecessary
stresses along top edge of
metallization. IR and
vapor
phase
reflow are
best.
Notes
(1)
Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2)
Vacuum pick up is recommended for handling
(3)
Soldering iron may damage the resistor
TABLE 5 - GLOBAL PART NUMBER INFORMATION
(1)
NEW GLOBAL PART NUMBER: Y145512K7560T9R (preferred part number format)
DENOTES PRECISION
Y
VALUE
R
=
Ω
K
= kΩ
CHARACTERISTICS
0
= standard
9
= lead (Pb)-free
1 to 999
= custom
Y
1
4
5
5
1
2
K
7
5
6
0
T
9
R
PRODUCT CODE
1172
= VSM0805
1496
= VSM1206
1455
= VSM1506
1611
= VSM2010
1612
= VSM2512
RESISTANCE TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
PACKAGING
R
= tape and reel
W
= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1455 12K7565 T 9 R:
TYPE: VSM1506
VALUES: 12.7560 kΩ
ABSOLUTE TOLERANCE: 0.01 %
TERMINATION: lead (Pb)-free
PACKAGING: tape and reel
HISTORICAL PART NUMBER: VSM1506 12K756 TCR2 T S T (will continue to be used)
VSM1506
MODEL
VSM0805
VSM1206
VSM1506
VSM2010
VSM2512
12K756
TCR2
T
TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
S
TERMINATION
S
= lead (Pb)-free
B
= tin/lead
T
PACKAGING
T
= tape and reel
W
= waffle pack
TCR
RESISTANCE VALUE CHARACTERISTICS
12.756 kΩ
Note
(1)
For non-standard requests, please contact application engineering.
Document Number: 63070
Revision: 25-Mar-10
For any questions, contact:
foil@vishaypg.com
www.foilresistors.com
3
Legal Disclaimer Notice
Vishay Precision Group
Disclaimer
ALL PRODUCTS, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE.
Vishay Precision Group, Inc., its affiliates, agents, and employees, and all persons acting on its or their
behalf (collectively, “Vishay Precision Group”), disclaim any and all liability for any errors, inaccuracies or
incompleteness contained herein or in any other disclosure relating to any product.
The product specifications do not expand or otherwise modify Vishay Precision Group’s terms and
conditions of purchase, including but not limited to, the warranty expressed therein.
Vishay Precision Group makes no warranty, representation or guarantee other than as set forth in the terms
and conditions of purchase.
To the maximum extent permitted by applicable law, Vishay Precision
Group disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and
all liability, including without limitation special, consequential or incidental damages, and (iii) any and
all implied warranties, including warranties of fitness for particular purpose, non-infringement and
merchantability.
Information provided in datasheets and/or specifications may vary from actual results in different
applications and performance may vary over time. Statements regarding the suitability of products for
certain types of applications are based on Vishay Precision Group’s knowledge of typical requirements that
are often placed on Vishay Precision Group products. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular
application.
No license, express, implied, or otherwise, to any intellectual property rights is granted by this document, or
by any conduct of Vishay Precision Group.
The products shown herein are not designed for use in life-saving or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay Precision Group products not expressly
indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay
Precision Group for any damages arising or resulting from such use or sale. Please contact authorized
Vishay Precision Group personnel to obtain written terms and conditions regarding products designed for
such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document No.: 63999
Revision: 27-Apr-2011
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1
Microchip MCU
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