OptoTEC™ Series OT08-04-F0-0203
Thermoelectric Module
The OptoTEC™ Series is a miniature thermoelectric module (TEM).
This product series is primarily used in applications to stabilize the
temperature of sensitive optical components in telecom and
photonics industries.
This product line is available in multiple configurations and surface
finishing options. Assembled with Bismuth Telluride semiconductor
material and thermally conductive Aluminum Oxide ceramics, the
OptoTEC Series is designed for lower current and lower heat-
pumping applications. Custom designs are available to
accommodate metallization, pretinning, ceramic patterns, and
solder posts, however MOQ applies.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
•
•
•
•
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Miniature geometric sizes
Precise temperature control
Reliable solid state operation
No sound or vibration
DC operation
•
RoHS compliant
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Laser diodes
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CCD cameras
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Infrared (IR) sensors
•
Pump lasers
•
Crystal oscillators
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Optical transceivers
APPLICATIONS
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
Qmax (watts)
Delta Tmax (°C)
Imax (amps)
Vmax (volts)
Module Resistance (ohms)
25
0.2
67
0.8
0.5
0.52
50
0.2
77
0.8
0.5
0.59
SUFFIX
11
TB
00
22
GG
0.096”± 0.002”
0. 096”± 0.0005”
0.110” ± 0.005”
0.110” ± 0.005”
0.110” ± 0.005”
THICKNESS
(PRIOR TO TINNING)
0.002” / 0.002”
0.0005” / 0.0005”
NA / NA
NA / NA
NA / NA
FLATNESS &
PARALLELISM
HOT FACE
Lapped
Lapped
Metalized
Pre-tinned
Au plated
COLD FACE
Lapped
Lapped
Metalized
Pre-tinned
Au plated
2.0”
2.0”
2.0
2.0
2.0
LEAD
LENGTH
SEALING OPTIONS
SUFFIX
RT
EP
SEALANT
RTV
Epoxy
COLOR
White
Black
TEMP RANGE
-60 to 204 °C
-55 to 150 °C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
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OT08-04-F0-0203
PERFORMANCE CURVES
MECHANICAL DRAWING
Ceramic material 96% Alumina ceramics
Solder construction: 138°C BiSn
OPERATING TIPS
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Max operating temperature: 80°C
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Do not exceed Imax or Vmax when operating module
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Reference assembly guidelines for recommended installation
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
LAIRD-ETS-OT08-04-F0-0203-DATA-SHEET-083116
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PCB设计
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