Ceramic Plate Series CP14-71-06
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable
TEMs is available in numerous heat pumping capacities, geometric
shapes, and input power ranges. Assembled with Bismuth Telluride
semiconductor material and thermally conductive Aluminum Oxide
ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
FEATURES
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
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Precise temperature control
Compact geometric sizes
Reliable solid state operation
No sound or vibration
Environmentally friendly
DC operation
RoHS compliant
Medical lasers
Lab science instrumentation
Clinical diagnostics systems
Photonics laser systems
Electronic enclosure cooling
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Food & beverage cooling
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Chillers (liquid cooling)
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APPLICATIONS
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
Module Resistance (Ohms)
25°C
28.7
68
6.0
8.1
1.26
50°C
31.4
75
6.0
9.2
1.42
SUFFIX
L
L1
L2
ML
LM
MM
THICKNESS
(PRIOR TO
TINNING)
FLATNESS &
PARALLELISM
0.0015”/0.0015”
0.001”/0.001”
0.0005”/0.0005”
0.002”/0.002”
0.002”/0.002”
0.002”/0.002”
HOT FACE
Lapped
Lapped
Lapped
Metallized
Lapped
Metallized
COLD FACE
Lapped
Lapped
Lapped
Lapped
Metallized
Metallized
LEAD LENGTH
4.5”
4.5”
4.5”
4.5”
4.5”
4.5”
0.150”±0.010”
0.150”±0.001”
0.150”±0.0005”
0.154”±0.010”
0.154”±0.010”
0.158”±0.010”
SEALING OPTIONS
SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION
RT
EP
RTV
Epoxy
White
Black
-60 to 204 °C
-55 to 150 °C
Non-corrosive, silicone adhesive
Low density syntactic foam epoxy encapsulant
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CP14-71-06
NOTES
1. Max operating temperature: 80°C
2. Do not exceed Imax or Vmax when operating module
3. Reference assembly guidelines for recommended installation
4. Solder tinning also available on metallized ceramics
LAIRD-ETS-CP14-71-06-DATA-SHEET-101416
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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PCB设计
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