NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin SOIJ T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | 3A991.b.1.a |
| Part Status | Active |
| HTS | 8542.32.00.71 |
| Cell Type | NOR |
| Chip Density (bit) | 64M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Bottom|Top |
| Address Bus Width (bit) | 32 |
| Sector Size | 4Kbyte x 2048 |
| Page Size | 256byte |
| Number of Bits/Word (bit) | 1/2/4 |
| Number of Words | 64M/32M/16M |
| Programmability | Yes |
| Timing Type | Synchronous |
| Max. Access Time (ns) | 8 |
| Maximum Erase Time (s) | 0.05/Chip |
| Maximum Programming Time (ms) | 1.5/Page |
| Process Technology | CMOS |
| 接口类型 Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 20 |
| Program Current (mA) | 25 |
| Command Compatible | No |
| ECC Support | No |
| Support of Page Mode | No |
| Minimum Endurance (Cycles) | 100000 |
| 系列 Packaging | Tape and Reel |
| Supplier Package | SOIJ |
| Pin Count | 8 |
| Standard Package Name | SOP |
| Mounting | Surface Mount |
| Package Height | 1.98(Max) |
| Package Length | 5.26 |
| Package Width | 5.25 |
| PCB changed | 8 |
| Lead Shape | Gull-wing |
| SST26VF064BT-104V/SM | SST26VF064B-104-5I-SM | SST26VF064BT-104-5I-MF | SST26VF064B-104V/TD | SST26VF064B-104V/SO | SST26VF064BT-104V/MF | SST26VF064BT-104V/SO | SST26VF064B-104V/MF | SST26VF064BT-104V/MN | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin SOIJ T/R | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin SOIJ | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin WSON EP | Flash Serial-SPI 3.3V 64M-bit 8ns | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 16-Pin SOIC W Tube | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin WSON EP T/R | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 16-Pin SOIC W T/R | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin WSON EP Tube | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns 8-Pin WDFN EP T/R |
| 欧盟限制某些有害物质的使用 | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| ECCN (US) | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991b.1.a. | 3A991.b.1.a |
| Part Status | Active | Active | Active | Active | Active | Active | Active | Active | Active |
| Cell Type | NOR | NOR | NOR | NOR | NOR | NOR | NOR | NOR | NOR |
| Supplier Package | SOIJ | SOIJ | WSON EP | TBGA | SOIC W | WSON EP | SOIC W | WSON EP | WDFN EP |
| Pin Count | 8 | 8 | 8 | 24 | 16 | 8 | 16 | 8 | 8 |
| Mounting | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package Height | 1.98(Max) | 1.98(Max) | 0.73 | 0.78 | 2.05(Min) | 0.73 | 2.05(Min) | 0.73 | 0.73 |
| Package Length | 5.26 | 5.26 | 5 | 8 | 10.3 | 5 | 10.3 | 5 | 6 |
| Package Width | 5.25 | 5.25 | 6 | 6 | 7.5 | 6 | 7.5 | 6 | 8 |
| PCB changed | 8 | 8 | 8 | 24 | 16 | 8 | 16 | 8 | 8 |
| HTS | 8542.32.00.71 | - | - | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | 8542.32.00.71 | - |
| Chip Density (bit) | 64M | 64M | 64M | - | 64M | 64M | 64M | 64M | 64M |
| Architecture | Sectored | Sectored | Sectored | - | Sectored | Sectored | Sectored | Sectored | Sectored |
| Boot Block | Yes | Yes | Yes | - | Yes | Yes | Yes | Yes | Yes |
| Block Organization | Symmetrical | Symmetrical | Symmetrical | - | Symmetrical | Symmetrical | Symmetrical | Symmetrical | Symmetrical |
| Location of Boot Block | Bottom|Top | Bottom|Top | Bottom|Top | - | Bottom|Top | Bottom|Top | Top|Bottom | Top|Bottom | Bottom|Top |
| Address Bus Width (bit) | 32 | 32 | 32 | - | 32 | 32 | 32 | 32 | 32 |
| Sector Size | 4Kbyte x 2048 | 4Kbyte x 2048 | 4Kbyte x 2048 | - | 4Kbyte x 2048 | 4Kbyte x 2048 | 4Kbyte x 2048 | 4Kbyte x 2048 | 4Kbyte x 2048 |
| Page Size | 256byte | 256byte | 256byte | - | 256byte | 256byte | 256byte | 256byte | 256byte |
| Number of Bits/Word (bit) | 1/2/4 | 1/2/4 | 1/2/4 | - | 1/2/4 | 1/2/4 | 1/2/4 | 1/2/4 | 1/2/4 |
| Number of Words | 64M/32M/16M | 64M/32M/16M | 64M/32M/16M | - | 64M/32M/16M | 64M/32M/16M | 64M/32M/16M | 64M/32M/16M | 64M/32M/16M |
| Programmability | Yes | Yes | Yes | - | Yes | Yes | Yes | Yes | Yes |
| Timing Type | Synchronous | Synchronous | Synchronous | - | Synchronous | Synchronous | Synchronous | Synchronous | Synchronous |
| Max. Access Time (ns) | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| Maximum Erase Time (s) | 0.05/Chip | 0.05/Chip | 0.05/Chip | - | 0.05/Chip | 0.05/Chip | 0.05/Chip | - | - |
| Maximum Programming Time (ms) | 1.5/Page | 1.5/Page | 1.5/Page | - | 1.5/Page | 1.5/Page | 1.5/Page | 1.5/Page | 1.5/Page |
| Process Technology | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 接口类型 Interface Type |
Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | - | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) |
| Minimum Operating Supply Voltage (V) | 2.7 | 2.7 | 2.7 | - | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 |
| Typical Operating Supply Voltage (V) | 3|3.3 | 3.3|3 | 3|3.3 | - | 3.3|3 | 3|3.3 | 3.3|3 | 3.3|3 | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 | 3.6 | 3.6 | - | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 | 2.7 to 3.6 | 2.7 to 3.6 | - | 2.7 to 3.6 | 2.7 to 3.6 | 2.7 to 3.6 | 2.7 to 3.6 | 2.7 to 3.6 |
| Operating Current (mA) | 20 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 |
| Program Current (mA) | 25 | 25 | 25 | - | 25 | 25 | 25 | 25 | 25 |
| Command Compatible | No | No | No | - | No | No | No | No | No |
| ECC Support | No | No | No | - | No | No | No | No | No |
| Support of Page Mode | No | No | No | - | No | No | No | No | No |
| Minimum Endurance (Cycles) | 100000 | 100000 | 100000 | - | 100000 | 100000 | 100000 | 100000 | 100000 |
| 系列 Packaging |
Tape and Reel | - | - | Tray | Tube | Tape and Reel | Tape and Reel | Tube | Tape and Reel |
| Standard Package Name | SOP | SOP | - | BGA | SOP | - | SOP | - | DFN |
| Lead Shape | Gull-wing | Gull-wing | - | Ball | Gull-wing | - | Gull-wing | - | No Lead |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
