UltraTEC™ Series UT8-12-F2-2525
Thermoelectric Module
The UltraTEC™ Series is a high heat pumping density thermoelectric
module (TEM). The module is assembled with a large number of
semiconductor couples to achieve a higher heat pumping capacity than
standard single stage TEMs.
This product line is available in multiple configurations and is ideal for
applications that require higher cooling capacities with limited surface
area. Assembled with Bismuth Telluride semiconductor material and
thermally conductive Aluminum Oxide ceramics, the UltraTEC Series is
designed for higher current and larger heat-pumping applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
High heat pump density
Precise temperature control
Reliable solid state operation
No sound or vibration
DC operation
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RoHS compliant
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APPLICATIONS
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Analytical instrumentation
Clinical diagnostics
Photonics laser systems
Electronic enclosure cooling
Food and beverage cooling
Chillers (liquid cooling)
PERFORMANCE SPECIFICATIONS
Hot side temperature (°C)
Qmax (watts)
Delta Tmax (°C)
Imax (amps)
Vmax (volts)
Module resistance (ohms)
25
69
69
7.9
14.4
1.678
50
75
79
7.99
16.2
1.892
SUFFIX
11
TA
TB
THICKNESS
0.077” ± 0.015”
0.077” ± 0.001”
0.077” ± 0.0005”
0.002” / 0.0035”
0.001” / 0.001”
0.0005” / 0.0005”
FLATNESS &
PARALLELISM
Lapped
Lapped
Lapped
HOT
FACE
Lapped
Lapped
Lapped
COLD
FACE
LEAD
LENGTH
6.0”
6.0”
6.0”
SEALING OPTION
SUFFIX
RT
EP
RTV
Epoxy
SEALANT
COLOR
White
Black
TEMP RANGE
-60 to 204°C
-55 to 150°C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
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UT8-12-F2-2525
PERFORMANCE CURVES
MECHANICAL DRAWING
Ceramic material 96% Alumina ceramics
Solder construction: 138°C BiSn
OPERATING TIPS
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Max operating temperature: 80°C
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Do not exceed Imax or Vmax when operating module
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Reference assembly guidelines for recommended installation
LAIRD-ETS-UT8-12-F2-2525-DATA-SHEET-101416
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property right.
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