CONTENTS
Advanced Measures for Environmental Conservation as
Management Policy...........................................................
PACKAGES
2
CSP (Chip Size Package).....................................................
LGA (Land Grid Array Package) ...........................................
SiP (System in Package) ......................................................
SOF (System On Film) .........................................................
Package Lineup ....................................................................
55
56
57
59
60
STN CSTN TFT CG Silicon
LCD Modules .......................................................................
8
EL
EL Display Modules.............................................................. 14
LSI REG
CMOS IMAGE SENSORS
CMOS Camera Modules ...................................................... 15
CCDs
Higher-resolution CCDs .......................................................
1/3-type CCDs......................................................................
1/3.8-type CCD ....................................................................
1/4-type CCDs......................................................................
1/3-type CCDs with Dual-power-supply (5 V/12 V)
Operation .............................................................................
CCD Peripheral ICs/LSIs......................................................
16
16
17
17
17
18
25
26
27
29
OPTO
OPTOELECTRONICS
Photocoupler Index Tree
....................................................
Photocouplers
Phototransistor Output.......................................................
OPIC Output ......................................................................
Phototriac Coupler Index Tree
...........................................
Phototriac Couplers ..............................................................
Solid State Relay Index Tree
..............................................
Solid State Relays ................................................................
Photointerrupter Index Tree
...............................................
Photointerrupters <Transmissive type> ................................
Single Phototransistor Output............................................
Darlinton Phototransistor Output .......................................
OPIC Output ......................................................................
Photointerrupters <Reflective type> .....................................
Single Phototransistor Output............................................
Darlinton Phototransistor Output .......................................
OPIC Output ......................................................................
Photointerrupters for Specific Applications ...........................
Transmissive Type..............................................................
Reflective Type...................................................................
Phototransistor Index Tree.................................................
Phototransistors....................................................................
Photodiodes/OPIC Light Detectors
PIN Photodiodes...................................................................
PSD (Position Sensitive Detector) ........................................
Blue Sensitive Photodiodes ..................................................
Laser Power Monitoring Photodiodes
for Optical Disc System ........................................................
RGB Color Sensor................................................................
Ambient Light Sensors .........................................................
Infrared Emitting Diode Index Tree....................................
Infrared Emitting Diodes .......................................................
Optical-Electric Sensor Index Tree....................................
Distance Measuring Sensor Lineup......................................
Wide Angle Sensor Lineup ...................................................
High-Precision Displacement Sensor ...................................
Paper Size Sensor Lineup ....................................................
Dust Sensor Unit Lineup.......................................................
Color Toner Concentration (Deposition Amount) Sensor
Lineup...................................................................................
Distance Measuring Sensors................................................
Wide Angle Sensors .............................................................
Paper Size Sensors ..............................................................
High-Precision Displacement Sensor ...................................
Dust Sensor Units.................................................................
Color Toner Concentration (Deposition Amount) Sensors ....
Fiber Optics Index Tree
......................................................
Fiber Optics Lineup for Audio Equipment .............................
67
68
72
75
76
78
79
82
83
83
85
85
87
87
88
88
89
89
91
92
93
94
94
94
95
95
95
100
101
102
102
102
102
102
102
102
103
104
105
106
106
106
107
107
LSIs FOR LCDs/ANALOG ICs
For Notebook PCs, PC Monitors and LCD TVs....................
For Mobile Equipment ..........................................................
For Mobile Phones ...............................................................
Peripheral ICs for LSIs for LCDs ..........................................
SYSTEM LSIs
Special-function LSIs ........................................................... 31
IPs ........................................................................................ 32
SMART CARD SYSTEMS
Smart Cards/LSI Modules for Smart Cards ......................... 33
Reader/Writer for Smart Cards ............................................ 34
SDK (Software Development Kit) for Smart Cards............... 34
FLASH MEMORIES AND COMBINATION MEMORIES
FLASH MEMORIES.............................................................
SYSTEM-FLASH
.................................................................
HIGHLY FUNCTIONAL FLASH MEMORIES
Boot Block Type 3 V Page Mode Flash Memories................
STANDARD FLASH MEMORIES
Boot Block Type 3 V Flash Memories...................................
SYSTEM-FLASH
Fast-Reprogramming System-Flash for Digital Equipment ..
System-Flash for Amusement Products...............................
System-Flash for Automotive Use ........................................
System-Flash for Network Equipment..................................
COMBINATION MEMORIES
Boot Block Type Flash Memory + Pseudo SRAM ................
35
36
38
38
39
39
40
40
41
42
44
48
49
50
50
51
51
52
53
53
54
POWER DEVICES/ANALOG ICs
Low Power-Loss Voltage Regulators....................................
Surface Mount Type Low Power-Loss Voltage Regulators ...
Surface Mount Type Chopper Regulators
(DC-DC Converters).............................................................
Chopper Regulators (DC-DC Converters) ...........................
Power Supply ICs for CCDs/CCD Camera Modules ............
Power Supply ICs for TFT-LCDs...........................................
Fail Safe IC...........................................................................
LED Drivers..........................................................................
Laser Diode Drivers .............................................................
ANALOG ICs
Video Interface ICs for TFT-LCDs.........................................
Power Amplifiers for Wireless LAN.......................................
ICs for Audio Equipment ......................................................
Transmission/Reception Devices for MOST Compatible
Optical Fiber.........................................................................
Fiber Optic Transmitters .......................................................
Fiber Optic Receivers...........................................................
Optical Transmission Device ................................................
Optical Reception Device .....................................................
107
108
109
110
110
Two-In-One RF Units ............................................................
Analog Terrestrial RF Front-End Unit....................................
RF Front-End Units...............................................................
1-Segment Digital Terrestrial Module....................................
1-segment/3-segment Digital Terrestrial Module ..................
USB Interface Wireless LAN Module ....................................
127
128
128
129
129
130
LED
High-Luminosity LED Lamps................................................
LED Lamps ..........................................................................
Dichromatic LED Lamps ......................................................
High-Luminosity Chip LEDs .................................................
Chip LEDs ............................................................................
High-Luminosity Dichromatic Type Chip LEDs.....................
Dichromatic Type Chip LEDs................................................
High-Luminosity White Type Chip LEDs...............................
Pastel Color Chip LEDs........................................................
High-Luminosity Dichromatic Type Chip LEDs
(RGB 3-color) .......................................................................
LEDs for Camera Data Back ................................................
111
113
115
116
117
117
118
118
118
119
119
IR
IR DEVICE
Infrared Data Communication Device Index Tree
............
Infrared Data Communication Devices .................................
Infrared Wireless Audio Transmission Device .......................
IR Detecting Unit for Remote Control Index Tree.............
IR Detecting Units for Remote Control .................................
131
132
133
134
135
LASER DIODE
Laser Diodes ........................................................................ 120
Switching Power Supplies (Custom)..................................... 137
Switching Power Supply with Integrated High/Low Voltage
Circuit (Custom).................................................................... 137
PCB
PRINTED CIRCUIT BOARD
Advanced Flex Printed Circuit Boards .................................. 138
Flexible Build-up Multilayer PCBs......................................... 139
Flexible Printed Circuit Boards ............................................. 140
RF
RF COMPONENTS
Low Noise Blockdown Converter
Europe: LNB for Broadcasting Satellite ................................
U.S.A.: LNB for FSS Broadcast/(Others: LNB for
Communication) ...................................................................
Japan/Asia/Australia: LNBs for CS Digital Satellite
Broadcast .............................................................................
Japan: LNBs for BS/CS 110° Satellite Broadcast.................
Digital DBS Front-End Units.................................................
QPSK Demodulator Circuit Built-in Type ..............................
8 PSK Demodulator Circuit Built-in Type..............................
Combination Front-End for Digital Terrestrial and Digital
Satellite Broadcasting ..........................................................
Digital Terrestrial Front-End Unit ..........................................
Front-End Units for ISDB-T/DVB-T.......................................
121
121
122
122
123
124
124
125
126
126
UNIT
PICKUP
Slim Combo Drive Pickup ..................................................... 141
Slim DVD-ROM Drive Pickup................................................ 141
DVD Pickup for Automotive Use ........................................... 141
INDEX................................................................................
142
NOTICE..............................................................................
143
Device for Optical Discs
RF Component
IR Device
Optoelectronics LED /
Laser Diode
LASER
POWER
IC
LCD
LED
Advanced Measures for Environmental Conservation
In accordance with environmental guidelines established under Sharp’s Basic Environmental Philosophy,
the Sharp Group Charter of Corporate Behavior, and the Sharp Code of Conduct, Sharp is pursuing
environmental conservation in all aspects of its business activities. Since fiscal 2004, when the medium-
term brand objective of becoming an environmentally advanced company was first set, Sharp has been
promoting the Super Green Strategy to achieve its corporate vision and to establish sustainable
manufacturing systems.
Basic Environmental Philosophy
Creating an Environmentally Conscious Company with Sincerity and Creativity
The Sharp Group Charter of Corporate Behavior
Contribution to Conservation of the Global Environment
The Sharp Group will fulfill our responsibility for environmental conservation by promoting the creation
of proprietary technologies that contribute to protection of the global environment, and by carrying out
our product development and business activities in an environmentally conscious manner.
The Sharp Code of Conduct
Contribution to Conservation of the Global Environment
1. To Conserve the Environment:
1 We will comply with all applicable environmental laws, regulations
and territorial agreements, and work to practice efficient use and
conservation of resources and energy voluntarily, in the
recognition that environmental conservation is an essential facet
of corporate and individual pursuits.
2 We will ensure proper use and control of chemical substances in
our business activities including research, development and
manufacturing, meeting or exceeding levels determined by laws
and regulations.
3 We will engage in the active acquisition, reporting and promotion
of environmental information at an international level, as the
Sharp Group companies promote communication with
shareholders and local residents.
4 We understand the importance of internal company systems and
related details in acquiring third-party certification and
recertification of our ISO environmental management systems,
and we will conduct our business operations in accordance with
relevant internal guidelines.
2. To Develop Environmentally Conscious
Products and Services, and Conduct Our
Business Operations in an Environmentally
Conscious Manner:
1 We will engage positively in the minimization of resource use,
reduction in the size and weight of products, use of recycled
materials, and the development of long-lasting, energy-saving,
energy-creating products.
2 We will work to compile information related to harmful substances
that might damage the environment or human health, and will not,
as a matter of principle, make use of these harmful substances in
our products, services and business activities.
3 We will use recyclable materials wherever possible, with product
development focused as a matter of policy on structures that are
detachable or capable of dismantling, and suited to recycling.
4 We will work aggressively to reduce greenhouse gas emissions in
the full range of our business activities, in order to contribute to the
prevention of global warming.
5 We will work to conduct our business in such a way to select and
purchase materials that are harmless to the global environment, and
to local residents and employees, for the resources needed for
business activities (equipment, raw materials, subsidiary materials,
tools, etc.).
6 We realize that waste material is a valuable resource, and we will
actively conduct our business operations in such a way as to
maximize the 3Rs (reduce, recycle and reuse) and will contribute to
minimizing the amount of waste sent for permanent landfill disposal.
*
The Sharp Group Charter of Corporate Behavior and the Sharp Code of Conduct were instituted in May 2005 as a revised edition of the preceding Sharp
Charter of Conduct (instituted in 2003). The section above is an excerpt from descriptions of Sharp's environmental conservation efforts.
For more information: http://sharp-world.com/corporate/eco/report/index.html
2
as Management Policy
Corporate Vision of Achieving “Zero Global Warming Impact by 2010”
Sharp will limit to the greatest extent possible the amount of the greenhouse gas emissions resulting from its business activities around
the world, while at the same time, significantly help reduce greenhouse gas emissions based on the energy-creating effects of solar
cells and the energy-saving effects of products. The idea is for the amount of greenhouse gas emissions reduced to exceed the
amount emitted by fiscal 2010.
Sharp’s greenhouse gas emissions in fiscal 2006 were approximately 1.73 million t-CO
2
. At the same time, it is estimated that the solar
cells Sharp produced over the 20 years up to fiscal 2005 generated approximately 1,322 GWh
*1
in fiscal 2006. This is equivalent to a
reduction in greenhouse gas emissions of approximately 0.56 million t-CO
2*2
*1
Calculation based on 844 MW, Sharp's total solar cell
production over 20 years from 1986 to 2005.
*2
Calculated using a CO
2
emission unit of 0.425 kg/kWh (fiscal
2005) at the receiving end, announced by the Federation of
Electric Power Companies of Japan.
Reduce greenhouse gas
emissions from
worldwide business
activities
Boost the level of
reductions in greenhouse
gas emissions from energy
created by solar cells
and energy saved
by products
Super Green Strategies to Become an Environmentally Advanced Company
SGT
Super Green Technologies
Developing unique environmental technologies
that contribute to environmental conservation
SGP/D
SGP/D
Super Green Products and Devices
Creating products and devices with high
environmental performance
SGR
Super Green Recycling
Recycling used products to promote
resource recycling
SGT
SGR
SGF
SGF
Super Green Factories
Factories with high environmental consciousness
and trust from communities
SGM
Super Green Management
Enhancing environmental sustainability management
SGM
3
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