LTC2220-1 - 12-Bit, 185Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 不符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 |
制造商包装代码 | UP |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A991.C.2 |
Is Samacsys | N |
最大模拟输入电压 | 1 V |
最小模拟输入电压 | -0.5 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 |
JESD-609代码 | e0 |
长度 | 9 mm |
最大线性误差 (EL) | 0.0439% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 235 |
电源 | 3.3 V |
认证状态 | Not Qualified |
采样速率 | 185 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 9 mm |
Base Number Matches | 1 |
LTC2220CUP-1#TR | LTC2220IUP-1#TR | P-1005H2083ASWS | LTC2221IUP#TR | LTM2220IV-AA#PBF | LTC2220CUP#TR | LTC2220IUP#TR | |
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描述 | LTC2220-1 - 12-Bit, 185Msps ADC; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C | LTC2220-1 - 12-Bit, 185Msps ADC; Package: QFN; Pins: 64; Temperature Range: -40°C to 85°C | Fixed Resistor, Thin Film, 0.25W, 208000ohm, 100V, 0.05% +/-Tol, 50ppm/Cel, Surface Mount, 1005, CHIP | LTC2221 - 12-Bit, 135Msps ADCs; Package: QFN; Pins: 64; Temperature Range: -40°C to 85°C | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBCC100, 16 X 16 MM, MO-222, SIPLGA-100, Analog to Digital Converter | LTC2220 - 12-Bit, 170Msps ADCs; Package: QFN; Pins: 64; Temperature Range: 0°C to 70°C | LTC2220 - 12-Bit, 170Msps ADCs; Package: QFN; Pins: 64; Temperature Range: -40°C to 85°C |
是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
包装说明 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | CHIP | HVQCCN, LCC64,.35SQ,20 | QCCN, LGA100,25X25,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 |
Reach Compliance Code | not_compliant | not_compliant | compliant | not_compliant | compliant | not_compliant | not_compliant |
ECCN代码 | 3A991.C.2 | 3A991.C.2 | EAR99 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 | 3A991.C.2 |
JESD-609代码 | e0 | e0 | e3 | e0 | e3 | e0 | e0 |
端子数量 | 64 | 64 | 2 | 64 | 100 | 64 | 64 |
最高工作温度 | 70 °C | 85 °C | 155 °C | 85 °C | 85 °C | 70 °C | 85 °C |
最低工作温度 | - | -40 °C | -55 °C | -40 °C | -40 °C | - | -40 °C |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMT | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | THIN FILM | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Brand Name | Linear Technology | Linear Technology | - | Linear Technology | - | Linear Technology | Linear Technology |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | QFN | QFN | - | QFN | BGA | QFN | QFN |
针数 | 64 | 64 | - | 64 | 100 | 64 | 64 |
制造商包装代码 | UP | UP | - | UP | - | UP | UP |
Is Samacsys | N | N | - | N | N | - | - |
最大模拟输入电压 | 1 V | 1 V | - | 1 V | 3.5 V | 1 V | 1 V |
最小模拟输入电压 | -0.5 V | -0.5 V | - | -1 V | - | -1 V | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 | S-PQCC-N64 | - | S-PQCC-N64 | S-PBCC-N100 | S-PQCC-N64 | S-PQCC-N64 |
长度 | 9 mm | 9 mm | - | 9 mm | 16 mm | 9 mm | 9 mm |
最大线性误差 (EL) | 0.0439% | 0.0439% | - | 0.0244% | 0.0366% | 0.0366% | 0.0366% |
湿度敏感等级 | 1 | 1 | - | 1 | 3 | 1 | 1 |
模拟输入通道数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | - | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | - | OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | - | HVQCCN | QCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | - | LCC64,.35SQ,20 | LGA100,25X25,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 |
封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
峰值回流温度(摄氏度) | 235 | 235 | - | 235 | 250 | 235 | 235 |
电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 185 MHz | 185 MHz | - | 135 MHz | 170 MHz | 170 MHz | 170 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | 0.8 mm | - | 0.8 mm | 2.13 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
温度等级 | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | - | QUAD | BOTTOM | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 20 | 20 | - | 20 | 30 | 20 | 20 |
宽度 | 9 mm | 9 mm | - | 9 mm | 16 mm | 9 mm | 9 mm |
Base Number Matches | 1 | 1 | - | 1 | 1 | - | - |
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