IC ADC 12BIT 2MSPS 28QFM
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 28 |
制造商包装代码 | UFD |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大模拟输入电压 | 2.053 V |
最小模拟输入电压 | -2.044 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PQCC-N28 |
JESD-609代码 | e3 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0244% |
模拟输入通道数量 | 2 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出位码 | 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
采样速率 | 2 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
LTC2321HUFD-12#TRPBF | LTC2321IUFD-12#TRPBF | LTC2321HUFD-12#PBF | LTC2321IUFD-12#PBF | LTC2321CUFD-12#TRPBF | |
---|---|---|---|---|---|
描述 | IC ADC 12BIT 2MSPS 28QFM | IC ADC 12BIT 2MSPS 28QFM | IC ADC 12BIT 2MSPS 28QFM | IC ADC 12BIT 2MSPS 28QFM | IC ADC 12BIT 2MSPS 28QFN |
Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
针数 | 28 | 28 | 28 | 28 | 28 |
制造商包装代码 | UFD | UFD | UFD | UFD | UFD |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
最大模拟输入电压 | 2.053 V | 2.053 V | 2.053 V | 2.053 V | 2.053 V |
最小模拟输入电压 | -2.044 V | -2.044 V | -2.044 V | -2.044 V | -2.044 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PQCC-N28 | R-PQCC-N28 | R-PQCC-N28 | R-PQCC-N28 | R-PQCC-N28 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
模拟输入通道数量 | 2 | 2 | 2 | 2 | 2 |
位数 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - |
输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
采样速率 | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
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